The category is 'Memory'
Memory (6000)
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- RoHS Status
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- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Access Time-Max | Active Read Current - Max | Brand | Clock Frequency-Max (fCLK) | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Interface Type | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Memory Types | Mfr | Minimum Operating Temperature | Moisture Sensitive | Mounting Styles | Number of Words | Number of Words Code | Operating Temperature (Max.) | Operating Temperature (Min.) | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom (Vsup) | Timing Type | Tradename | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Interface | Memory Size | Number of Ports | Nominal Supply Current | Speed | Operating Mode | Max Supply Current | Clock Frequency | Supply Current-Max | Access Time | Memory Format | Memory Interface | Data Bus Width | Organization | Output Characteristics | Seated Height-Max | Memory Width | Write Cycle Time - Word, Page | Address Bus Width | Product Type | Density | Standby Current-Max | Memory Density | Screening Level | Access Time (Max) | Parallel/Serial | I/O Type | Sync/Async | Word Size | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | Standby Voltage-Min | Alternate Memory Width | Refresh Cycles | I2C Control Byte | Sequential Burst Length | Interleaved Burst Length | Reverse Pinout | Product Category | Memory Organization | Height | Height Seated (Max) | Length | Width | Radiation Hardening | REACH SVHC | RoHS Status | Lead Free |
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 | Mfr Part No K4B2G0846D-HCH9 | Samsung | Datasheet | - | - | Min: 1 Mult: 1 | YES | 78 | 0.255 ns | 667 MHz | SAMSUNG SEMICONDUCTOR INC | Samsung Semiconductor | K4B2G0846D-HCH9 | 268435456 words | 256000000 | 85 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA78,9X13,32 | BGA78,9X13,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | Obsolete | 5.79 | Yes | 1.5 V | DRAMs | CMOS | BOTTOM | BALL | 0.8 mm | compliant | R-PBGA-B78 | Not Qualified | 1.5 V | OTHER | 0.135 mA | 256MX8 | 3-STATE | 8 | 0.012 A | 2147483648 bit | COMMON | DDR DRAM | 8192 | 8 | 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No IS25LP032D-JTLA3-TR | Integrated Silicon Solution, Inc. (ISSI) | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | USON-8 | YES | 8-USON (4x3) | 8 | 25 mA | 133 MHz | 5000 | INTEGRATED SILICON SOLUTION INC | QPI, SPI | IS25LP032D-JTLA3-TR | 133 MHz | + 125 C | Non-Volatile | ISSI, Integrated Silicon Solution Inc | - 40 C | SMD/SMT | 4194304 words | 4000000 | 125 °C | -40 °C | Tape & Reel (TR) | PLASTIC/EPOXY | HVSON | HVSON, | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Active | NOT SPECIFIED | 5.64 | Yes | 3.6 V | 2.3 V | 3 V | Synchronous | Automotive grade | -40°C ~ 125°C (TA) | Cut Tape | IS25LP032D | FLASH - NOR (SLC) | 2.3V ~ 3.6V | DUAL | NO LEAD | NOT SPECIFIED | 1 | 0.8 mm | compliant | R-PDSO-N8 | 3.6 V | AUTOMOTIVE | 2.3 V | 32 Mbit | 133 MHz | SYNCHRONOUS | 133 MHz | 25 mA | 7 ns | FLASH | SPI - Quad I/O, QPI, DTR | 8 bit | 4 M x 8 | 0.6 mm | 8 | 40µs, 800µs | 33554432 bit | AEC-Q100 | SERIAL | FLASH | 3 V | 4M x 8 | 4 mm | 3 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No BR25H020FJ-2CE2 | ROHM Semiconductor | Datasheet | 1792 | - | Min: 1 Mult: 1 | 16 Weeks | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | Automotive grade | -40°C~125°C TA | Cut Tape (CT) | 2013 | Automotive, AEC-Q100 | Active | 1 (Unlimited) | 8 | ALSO OPERATES AT 2.5V WITH 5MHZ AND SEATED HT-CALCULATED | 2.5V~5.5V | DUAL | NOT SPECIFIED | 1 | 5V | 1.27mm | NOT SPECIFIED | Not Qualified | 5.5V | 3/5V | 4.5V | 2Kb 256 x 8 | SYNCHRONOUS | 10MHz | EEPROM | SPI | 8 | 4ms | 0.00001A | SERIAL | SPI | 1000000 Write/Erase Cycles | 4ms | 100 | HARDWARE/SOFTWARE | 1.65mm | 4.9mm | 3.9mm | Unknown | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No SST26WF064C-104I/SM | Microchip Technology | Datasheet | 32 | - | Min: 1 Mult: 1 | 6 Weeks | Surface Mount | 8-SOIC (0.209, 5.30mm Width) | YES | Non-Volatile | Automotive grade | -40°C~85°C TA | Tube | SST26 SQI® | e3 | Active | 1 (Unlimited) | 8 | Matte Tin (Sn) - annealed | 1.65V~1.95V | DUAL | 1 | 1.8V | 1.27mm | R-PDSO-G8 | 1.95V | 1.65V | 64Mb 8M x 8 | SYNCHRONOUS | 104MHz | FLASH | SPI - Quad I/O | 64MX1 | 1 | 1.5ms | 67108864 bit | TS 16949 | SERIAL | 1.8V | 2.03mm | 5.26mm | 5.25mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No FM24V01-G | Cypress Semiconductor Corp | Datasheet | 154 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2008 | F-RAM™ | e3 | Obsolete | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 2V~3.6V | DUAL | 260 | 1 | 3.3V | 1.27mm | 20 | FM24V01 | 8 | 3.3V | 3.6V | 2V | 2-Wire, I2C, Serial | 128Kb 16K x 8 | 1mA | 3.4MHz | 130ns | FRAM | I2C | 8b | 128 kb | 0.00015A | 8b | 1.478mm | 4.98mm | 3.987mm | No | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 93C76CT-I/MC | Microchip Technology | Datasheet | 35 | - | Min: 1 Mult: 1 | 6 Weeks | Tin | Surface Mount | Surface Mount | 8-VFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2008 | e3 | yes | Active | 1 (Unlimited) | 8 | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 0.5mm | 40 | 93C76C | 8 | 5V | 5V | Serial | 8Kb 1K x 8 512 x 16 | 3mA | 3MHz | 100 ns | EEPROM | SPI | 512X16 | 16 | 2ms | 8 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 2ms | 200 | HARDWARE/SOFTWARE | 8 | 1mm | 3mm | 2mm | No | Non-RoHS Compliant | Contains Lead | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No CY7C1370D-167AXCT | Cypress Semiconductor Corp | Datasheet | 415 |
| Min: 1 Mult: 1 | Surface Mount | Surface Mount | 100-LQFP | 100 | Volatile | 0°C~70°C TA | Tape & Reel (TR) | 2011 | NoBL™ | e4 | yes | Obsolete | 3 (168 Hours) | 100 | 3A991.B.2.A | Nickel/Palladium/Gold (Ni/Pd/Au) | PIPELINED ARCHITECTURE | 3.135V~3.6V | QUAD | 260 | 1 | 3.3V | 0.65mm | 20 | CY7C1370 | 3.3V | 3.6V | 3.135V | 18Mb 512K x 36 | 4 | 275mA | 167MHz | 3.4ns | SRAM | Parallel | 512KX36 | 3-STATE | 36 | 19b | 18 Mb | 0.07A | COMMON | Synchronous | 36b | 1.6mm | 20mm | No | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No CY7C1414JV18-250BZXC | Cypress Semiconductor Corp | Datasheet | 286 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 165-LBGA | 165 | Volatile | 0°C~70°C TA | Tray | 2003 | e1 | Obsolete | 3 (168 Hours) | 165 | Tin/Silver/Copper (Sn/Ag/Cu) | PIPELINED ARCHITECTURE | 1.7V~1.9V | BOTTOM | 260 | 1 | 1.8V | 1mm | unknown | 20 | CY7C1414 | 165 | Not Qualified | 1.8V | 1.9V | 1.7V | 36Mb 1M x 36 | 2 | 1.29A | 250MHz | 450 ps | SRAM | Parallel | 1MX36 | 3-STATE | 36 | 19b | 36 Mb | 0.35A | SEPARATE | Synchronous | 36b | 1.7V | 1.4mm | 17mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No CY7C006AV-25AXC | Cypress Semiconductor Corp | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 64-LQFP | 64 | Volatile | 0°C~70°C TA | Tray | 2000 | e4 | yes | Obsolete | 3 (168 Hours) | 64 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 3V~3.6V | QUAD | 260 | 1 | 3.3V | 0.8mm | 25GHz | 30 | CY7C006 | 64 | 3.3V | 3.6V | 3V | 128Kb 16K x 8 | 2 | 165mA | SRAM | Parallel | 16KX8 | 3-STATE | 8 | 25ns | 28b | 128 kb | COMMON | Asynchronous | 8b | 2V | 1.6mm | 14mm | No | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No CAV25040YE-GT3 | ON Semiconductor | Datasheet | 2668 | - | Min: 1 Mult: 1 | 4 Weeks | ACTIVE (Last Updated: 3 days ago) | Gold | Surface Mount | Surface Mount | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | Automotive grade | -40°C~125°C TA | Tape & Reel (TR) | 2008 | Automotive, AEC-Q100 | e4 | yes | Active | 1 (Unlimited) | 8 | 2.5V~5.5V | DUAL | NOT SPECIFIED | 1 | 5V | 0.65mm | NOT SPECIFIED | 8 | 5.5V | 2.5V | SPI, Serial | 4Kb 512 x 8 | SYNCHRONOUS | 10MHz | 35 ns | EEPROM | SPI | 8 | 5ms | 4 kb | SPI | 5ms | 1.2mm | 4.4mm | 3mm | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No CY7C1520KV18-333BZXI | Cypress Semiconductor Corp | Datasheet | 1608 |
| Min: 1 Mult: 1 | 13 Weeks | Surface Mount | Surface Mount | 165-LBGA | 165 | Volatile | -40°C~85°C TA | Tray | 2003 | e1 | Active | 3 (168 Hours) | 165 | Tin/Silver/Copper (Sn/Ag/Cu) | PIPELINED ARCHITECTURE | 1.7V~1.9V | BOTTOM | 260 | 1 | 1.8V | 30 | CY7C1520 | 165 | 1.8V | 72Mb 2M x 36 | 1 | 640mA | 333MHz | 450 ps | SRAM | Parallel | 2MX36 | 3-STATE | 36 | 21b | 72 Mb | COMMON | Synchronous | 36b | No | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No AT28HC256E-90DM/883 | Microchip Technology | Datasheet | 1812 | - | Min: 1 Mult: 1 | 23 Weeks | Through Hole | Through Hole | 28-CDIP (0.600, 15.24mm) | 28 | Non-Volatile | Military grade | -55°C~125°C TC | Tube | e0 | Active | 1 (Unlimited) | 28 | 3A001.A.2.C | TIN LEAD | AUTOMATIC WRITE | 8542.32.00.51 | 4.5V~5.5V | DUAL | 1 | 5V | 2.54mm | AT28HC256 | 5V | Parallel, SPI | 256Kb 32K x 8 | 80mA | 90ns | EEPROM | Parallel | 32KX8 | 8 | 10ms | 256 kb | MIL-STD-883 Class C | 5V | 10ms | 5.72mm | 37.215mm | 15.24mm | No | Non-RoHS Compliant | Contains Lead | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No AT21CS01-SSHM10-B | Microchip Technology | Datasheet | 34 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tube | 2017 | e4 | Active | 1 (Unlimited) | 8 | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.7V~3.6V | DUAL | 1 | 1.8V | 1.27mm | AT21CS01 | R-PDSO-G8 | 3.6V | 1.7V | 1Kb 128 x 8 | SYNCHRONOUS | 125kHz | EEPROM | I2C, Single Wire | 128X8 | 8 | 5ms | 1024 bit | SERIAL | 1-WIRE | 5ms | 1.75mm | 4.9mm | 3.9mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MX30LF1GE8AB-TI | Macronix | Datasheet | 6912 | - | Min: 1 Mult: 1 | 8 Weeks | YES | 85°C | -40°C | Tray | 2015 | e3 | Active | 3 (168 Hours) | 48 | NAND TYPE | Matte Tin (Sn) | DUAL | GULL WING | 260 | 1 | 3V | 0.5mm | 40 | R-PDSO-G48 | 3.6V | INDUSTRIAL | 2.7V | ASYNCHRONOUS | 128MX8 | 8 | 1073741824 bit | PARALLEL | FLASH | 2.7V | 1.2mm | 18.4mm | 12mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No CY7C1418AV18-167BZC | Cypress Semiconductor Corp | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 165-LBGA | YES | 165 | Volatile | 0°C~70°C TA | Tray | 2006 | e0 | Obsolete | 3 (168 Hours) | 165 | 3A991.B.2.A | Tin/Lead (Sn/Pb) | PIPELINED ARCHITECTURE | 8542.32.00.41 | 1.7V~1.9V | BOTTOM | 220 | 1 | 1.8V | 1mm | not_compliant | NOT SPECIFIED | CY7C1418 | 165 | Not Qualified | 1.8V | 1.9V | 1.7V | 36Mb 2M x 18 | 167MHz | 500 ps | SRAM | Parallel | 2MX18 | 3-STATE | 18 | 36 Mb | 0.22A | COMMON | 1.7V | 1.4mm | 17mm | 15mm | Non-RoHS Compliant | Contains Lead | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No CY62256VNLL-70ZRXI | Cypress Semiconductor Corp | Datasheet | - | - | Min: 1 Mult: 1 | 15 Weeks | Surface Mount | Surface Mount | 28-TSSOP (0.465, 11.80mm Width) | 28 | Volatile | -40°C~85°C TA | Tray | 2002 | MoBL® | e4 | yes | Obsolete | 3 (168 Hours) | 28 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 0.55mm | 70GHz | 20 | CY62256 | 28 | 3V | 3.6V | 2.7V | 256Kb 32K x 8 | 1 | 30mA | 30mA | SRAM | Parallel | 32KX8 | 3-STATE | 8 | 70ns | 15b | 256 kb | 0.000006A | 70 ns | COMMON | Asynchronous | 8b | YES | No | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No GS842Z36CB-250 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | BGA-119 | GSI Technology | 84 | Parallel | GSI Technology | 250 MHz | + 70 C | SDR | 0 C | Yes | SMD/SMT | 3.6 V | 2.3 V | NBT SRAM | Tray | GS842Z36CB | NBT Pipeline/Flow Through | Memory & Data Storage | 4 Mbit | 155 mA, 195 mA | 5.5 ns | 128 k x 36 | SRAM | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 34LC02T-I/ST | Microchip Technology | Datasheet | 8012 | - | Min: 1 Mult: 1 | 12 Weeks | Tin | Surface Mount | Surface Mount | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2011 | e3 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 2.2V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 40 | 34LC02 | 8 | Not Qualified | 5V | 2.2V | I2C, Serial | 2Kb 256 x 8 | 3mA | SYNCHRONOUS | 1MHz | 400ns | EEPROM | I2C | 8 | 5ms | 2 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1010DDDR | 1.2mm | 4.4mm | 3mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No BR93H56RF-2CE2 | ROHM Semiconductor | Datasheet | 2000 | - | Min: 1 Mult: 1 | 16 Weeks | Surface Mount | 8-SOIC (0.173, 4.40mm Width) | YES | 8 | Non-Volatile | Automotive grade | -40°C~125°C TA | Cut Tape (CT) | 2016 | Automotive, AEC-Q100 | Active | 1 (Unlimited) | 8 | SEATED HT-CALCULATED | 2.5V~5.5V | DUAL | NOT SPECIFIED | 1 | 4V | 1.27mm | NOT SPECIFIED | Not Qualified | 5.5V | 3/5V | 2.5V | 2Kb 128 x 16 | SYNCHRONOUS | 2MHz | EEPROM | SPI | 16 | 4ms | 0.00001A | SERIAL | MICROWIRE | 1000000 Write/Erase Cycles | 4ms | 100 | SOFTWARE | 1.71mm | 5mm | 4.4mm | Unknown | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 93AA76CT-I/ST | Microchip Technology | Datasheet | 8000 |
| Min: 1 Mult: 1 | 6 Weeks | Tin | Surface Mount | Surface Mount | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2012 | e3 | yes | Active | 1 (Unlimited) | 8 | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 40 | 93AA76C | 8 | 5.5V | 2/5V | Serial | 8Kb 1K x 8 512 x 16 | 3mA | 3MHz | 100 ns | EEPROM | SPI | 512X16 | 16 | 5ms | 8 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 8 | 1.1mm | 4.4mm | 3mm | No | ROHS3 Compliant | Lead Free |
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K4B2G0846D-HCH9
Samsung
Package:Memory
Price: please inquire
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IS25LP032D-JTLA3-TR
Integrated Silicon Solution, Inc. (ISSI)
Package:Memory
Price: please inquire
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BR25H020FJ-2CE2
ROHM Semiconductor
Package:Memory
Price: please inquire
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SST26WF064C-104I/SM
Microchip Technology
Package:Memory
Price: please inquire
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FM24V01-G
Cypress Semiconductor Corp
Package:Memory
Price: please inquire
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93C76CT-I/MC
Microchip Technology
Package:Memory
Price: please inquire
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CY7C1370D-167AXCT
Cypress Semiconductor Corp
Package:Memory
2.945960
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CY7C1414JV18-250BZXC
Cypress Semiconductor Corp
Package:Memory
Price: please inquire
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CY7C006AV-25AXC
Cypress Semiconductor Corp
Package:Memory
Price: please inquire
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CAV25040YE-GT3
ON Semiconductor
Package:Memory
Price: please inquire
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CY7C1520KV18-333BZXI
Cypress Semiconductor Corp
Package:Memory
148.153782
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AT28HC256E-90DM/883
Microchip Technology
Package:Memory
Price: please inquire
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AT21CS01-SSHM10-B
Microchip Technology
Package:Memory
Price: please inquire
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MX30LF1GE8AB-TI
Macronix
Package:Memory
Price: please inquire
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CY7C1418AV18-167BZC
Cypress Semiconductor Corp
Package:Memory
Price: please inquire
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CY62256VNLL-70ZRXI
Cypress Semiconductor Corp
Package:Memory
Price: please inquire
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GS842Z36CB-250
GSI Technology
Package:Memory
Price: please inquire
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34LC02T-I/ST
Microchip Technology
Package:Memory
Price: please inquire
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BR93H56RF-2CE2
ROHM Semiconductor
Package:Memory
Price: please inquire
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93AA76CT-I/ST
Microchip Technology
Package:Memory
0.543256