The category is 'Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Brand | Category | Data RAM Size | Dimensions | Distributed RAM | Factory Pack QuantityFactory Pack Quantity | Flash | For Use With/Related Products | I2C Bus Support | Ihs Manufacturer | Installed RAM | Interface Type | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Maximum RAM Capacity | Memory Card Interface | Memory Types | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of CPU Cores | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | On-Board Storage Size | On-Board Storage Type | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Panel Cutout | Part Life Cycle Code | Part Package Code | PCIe | Processor Brand | Processor Series | Processor Type | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Note | Max Supply Voltage | Min Supply Voltage | Memory Size | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Data Rate | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Total RAM Bits | Number of Gates | Max Frequency | Contents | Speed Grade | Number of Transceivers | Primary Attributes | Ethernet | Number of Registers | Combinatorial Delay of a CLB-Max | USB | Platform | Number of CLBs | Number of Logic Cells | Form Factor | Number of Cores | GPIO | Number of Equivalent Gates | Flash Size | SATA | Video Outputs | Interconnect System | Suggested Programming Environment | Product Category | Height | Length | Width | Radiation Hardening |
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 | Mfr Part No RM-F600-SMC | iBASE Technology | Datasheet | - | - | Min: 1 Mult: 1 | 4 | 2 | 2 | Round | 1x PCIex1 | -20 to 60 °C | ARM | One 10/100/1000 | 2 USB2.0 Host/1 USB2.0 OTG | 12 | 1 SATA | 1 HDMI, 1 LVDS 24 bit | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EK-U1-KCU105-G | AMD | Datasheet | 36 | - | Min: 1 Mult: 1 | XCKU040 | Programmable Logic Tools | XCKU040 | AMD | Box | PCIe | Active | Kintex® UltraScale™ | Programmable Logic Tools | - | Board(s), Cable(s), Power Supply | Yes | Kintex UltraScale FPGA KCU105 PCIe Card | No | FMC, Pmod | Vivado | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SOM-3567BS0XB-S7A1 | Advantech | Datasheet | - | - | Min: 1 Mult: 1 | Advantech | 70 mm x 70 mm | 1 | 2 GB | Ethernet, GPIO, I2C, PCIe, SATA, Serial, USB | Advantech | + 85 C | 8 GB | DDR3L | - 40 C | Intel | E3827 | Atom | Details | SOM-3567 | Computing | 1.75 GHz | 5 V | 2 GB | System-On-Modules - SOM | Qseven | System-On-Modules - SOM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TE0808-05-BBE21-AK | Trenz Electronic | Datasheet | - | - | Min: 1 Mult: 1 | 5.2 cm x 7.6 cm | 1 | 128 MB | 4 GB | GPIO, Serial | + 85 C | 4 GB | DDR4 | 0 C | Xilinx | Zynq UltraScale+ | XCZU15EG-1FFVC900E | Details | This product may require additional documentation to export from the United States. | 5.2 cm x 7.6 cm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TE0808-05-9BE21-L | Trenz Electronic | Datasheet | - | - | Min: 1 Mult: 1 | 5.2 cm x 7.6 cm | 1 | 128 MB | 4 GB | GPIO, Serial | + 85 C | 4 GB | DDR4 | 0 C | Xilinx | Zynq UltraScale+ | XCZU9EG-1FFVC900E | Details | This product may require additional documentation to export from the United States. | 5.2 cm x 7.6 cm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TE0808-05-6BE21-AK | Trenz Electronic | Datasheet | - | - | Min: 1 Mult: 1 | 76 mm x 52 mm | 1 | 128 MB | 4 GB | GPIO, SPI | + 85 C | 4 GB | DDR4 | 0 C | Xilinx | Zynq UltraScale+ | XCZU6EG-1FFVC900E | Details | This product may require additional documentation to export from the United States. | - | 3.3 V | 5.2 cm x 7.6 cm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TE0807-03-7DE21-AS | Trenz Electronic | Datasheet | - | - | Min: 1 Mult: 1 | 5.2 cm x 7.6 cm | 1 | 128 MB | 4 GB | PCIe | 4 GB | DDR4 | 32 GB | eMMC | Xilinx | Zynq UltraScale+ | XCZU7EV-1FBVB900E | Details | This product may require additional documentation to export from the United States. | 5.2 cm x 7.6 cm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No P0630 | TE Connectivity | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL090S-1FG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | YES | 484 | MICROSEMI CORP | M2GL090S-1FG484I | 267 | PLASTIC/EPOXY | BGA | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | 5.3 | Non-Compliant | No | 1.2 V | 100 °C | -40 °C | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | 323.3 kB | 267 | FIELD PROGRAMMABLE GATE ARRAY | 86316 | 86316 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010S-1FG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | MICROSEMI CORP | M2S010S-1FG484I | 3 | , | Obsolete | 20 | 5.85 | No | e0 | Tin/Lead (Sn/Pb) | 225 | compliant | FIELD PROGRAMMABLE GATE ARRAY | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LFX500EB-03FH516C | Lattice Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 516 | ROCHESTER ELECTRONICS INC | LFX500EB-03FH516C | 3 | 70 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | BGA | 30 | 5.86 | No | 2.7 V | 2.3 V | 2.5 V | e0 | No | TIN LEAD | ALSO OPERATES WITH 3.3V SUPPLY | BOTTOM | BALL | 225 | 1 mm | unknown | 516 | S-PBGA-B516 | COMMERCIAL | COMMERCIAL | 1764 CLBS, 476000 GATES | 2.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 1.07 ns | 1764 | 476000 | 31 mm | 31 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090TS-1FGG484I | Microchip | Datasheet | 2150 | - | Min: 1 Mult: 1 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2S090 | 64 kB | MICROSEMI CORP | - | - | M2S090TS-1FGG484I | 166 MHz | Microchip Technology | 3 | SMD/SMT | 267 | 86316 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.8 | Yes | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL005-1FGG484 | Microchip | Datasheet | 8 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2GL005 | MICROSEMI CORP | M2GL005-1FGG484 | Microchip Technology | 3 | 209 | 85 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | Compliant | Yes | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | IGLOO2 | 85 °C | 0 °C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B484 | 209 | Not Qualified | 1.2 V | OTHER | 87.9 kB | 209 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 6060 | 719872 | 6060 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL090-1FGG676 | Microchip | Datasheet | 1890 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | 676-BGA | YES | 676-FBGA (27x27) | 676 | M2GL090 | MICROSEMI CORP | M2GL090-1FGG676 | + 85 C | Microchip Technology | 0 C | 3 | SMD/SMT | 425 | 86184 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA676,26X26,40 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.27 | Compliant | Yes | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | IGLOO2 | 85 °C | 0 °C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B676 | 425 | Not Qualified | 1.2 V | 1.2 V | OTHER | 323.3 kB | 425 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 86316 | 2648064 | 86316 | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150T-FCVG484 | Microchip | Datasheet | 2084 | - | Min: 1 Mult: 1 | 484-BFBGA | YES | 484-FBGA (19x19) | 484 | M2S150 | MICROSEMI CORP | M2S150T-FCVG484 | Microchip Technology | 4 | 273 | 85 °C | Tray | PLASTIC/EPOXY | FBGA | VFBGA-484 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | Active | 40 | 5.77 | Yes | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B484 | 273 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 273 | 3.15 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | 19 mm | 19 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060-FCSG325I | Microchip | Datasheet | 2065 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | YES | 325 | 325-FCBGA (11x11) | 325 | M2S060 | 64 kB | MICROSEMI CORP | - | - | M2S060-FCSG325I | 166 MHz | 1.26 V | + 100 C | Microchip Technology | 1.14 V | - 40 C | 3 | 200 | 56520 LE | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.79 | Compliant | Yes | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 100 °C | -40 °C | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 250 | 0.5 mm | compliant | S-PBGA-B325 | 200 | Not Qualified | 1.2 V | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 11 mm | 11 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL050-1FGG484 | Microchip | Datasheet | 2008 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2GL050 | MICROSEMI CORP | M2GL050-1FGG484 | Microchip Technology | 3 | 267 | 85 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | Compliant | Yes | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | IGLOO2 | 85 °C | 0 °C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | OTHER | 228.3 kB | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 56340 | 1869824 | 56340 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1AGLE3000V5-FG896I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Obsolete (Last Updated: 2 months ago) | Surface Mount | YES | 896 | 400.011771 mg | 896 | MICROSEMI CORP | M1AGLE3000V5-FG896I | 3 | 620 | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | FBGA-896 | SQUARE | GRID ARRAY | Obsolete | 20 | 5.88 | Compliant | No | 1.575 V | 1.425 V | 1.5 V | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B896 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 63 kB | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 75264 | 3e+06 | 892.86 MHz | 75264 | 75264 | 3000000 | 1.73 mm | 29 mm | 29 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060T-FGG676 | Microchip | Datasheet | 1653 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 676-BGA | YES | 676-FBGA (27x27) | 676 | M2S060 | 64 kB | MICROSEMI CORP | - | - | M2S060T-FGG676 | 166 MHz | Microchip Technology | 3 | 387 | 56520 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA676,26X26,40 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.81 | Non-Compliant | Yes | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B676 | 387 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 387 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL005-VFG256 | Microchip | Datasheet | 1376 | - | Min: 1 Mult: 1 | Surface Mount | BGA-256 | YES | 256-FPBGA (14x14) | 256 | M2GL005 | Microchip Technology / Atmel | 703 kbit | 119 | MICROSEMI CORP | M2GL005-VFG256 | 340 MHz | + 85 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 161 I/O | 505 LAB | 6060 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.27 | Details | Yes | FPGA IGLOOu00ae2 Family 6060 Cells 1.2V 256-Pin VFBGA Tray | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | IGLOO2 | 0.025037 oz | 0°C ~ 85°C (TJ) | Tray | M2GL005 | 8542.39.00.01 | Programmable Logic ICs | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 0.8 mm | compliant | S-PBGA-B256 | 1.2 V | OTHER | - | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | 6060 | FPGA - Field Programmable Gate Array | 719872 | STD | - | FPGA - Field Programmable Gate Array | 14 mm | 14 mm |
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RM-F600-SMC
iBASE Technology
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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EK-U1-KCU105-G
AMD
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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SOM-3567BS0XB-S7A1
Advantech
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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TE0808-05-BBE21-AK
Trenz Electronic
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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TE0808-05-9BE21-L
Trenz Electronic
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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TE0808-05-6BE21-AK
Trenz Electronic
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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TE0807-03-7DE21-AS
Trenz Electronic
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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P0630
TE Connectivity
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2GL090S-1FG484I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2S010S-1FG484I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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LFX500EB-03FH516C
Lattice Semiconductor
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2S090TS-1FGG484I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2GL005-1FGG484
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2GL090-1FGG676
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
343.606974
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M2S150T-FCVG484
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2S060-FCSG325I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
185.125539
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M2GL050-1FGG484
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
125.438045
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M1AGLE3000V5-FG896I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2S060T-FGG676
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2GL005-VFG256
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire