The category is 'Memory - Modules'
Memory - Modules (5402)
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- Reach Compliance Code
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- ECCN Code
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Data Retention Time-Min | Write Protection | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Boot Block | Common Flash Interface | Length | Width |
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![]() | Mfr Part No PM49FL004T-33VC | Integrated Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 120 ns | INTEGRATED SILICON SOLUTION INC | 524288 words | 512000 | 85 °C | PLASTIC/EPOXY | TSSOP | 8 X 14 MM, VSOP-32 | TSSOP32,.56,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | No | 3.3 V | EAR99 | NOR TYPE | TOP BOOT | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | compliant | R-PDSO-G32 | Not Qualified | 3.6 V | OTHER | 3 V | SYNCHRONOUS | 0.02 mA | 512KX8 | 1.2 mm | 8 | 0.0005 A | 4194304 bit | PARALLEL | FLASH | 3.3 V | YES | YES | YES | 128 | 4K | TOP | 12.4 mm | 8 mm | |||||||||||||||||||||
![]() | Mfr Part No SST39VF040-70-4C-N | Microchip Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 5962-9461302HXC | White Microelectronics | Datasheet | - | - | Min: 1 Mult: 1 | NO | 66 | 100 ns | WHITE MICROELECTRONICS | 4194304 words | 4000000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | HEX-IN-LINE, SINGLE CAVITY, WITH STANDOFFS-66 | SQUARE | MICROELECTRONIC ASSEMBLY | Obsolete | 5 V | e4 | GOLD | CONFIGURABLE AS 2M X 16 OR 1M X 32 | HEX | PIN/PEG | 1 | unknown | S-CHMA-P66 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 4MX8 | 8 | 33554432 bit | PARALLEL | FLASH MODULE | 12 V | ||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No S25FL004A0LMAI003 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 50 MHz | SPANSION INC | 524288 words | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP8,.25 | SOP8,.25 | SQUARE | SMALL OUTLINE | Obsolete | SOIC | No | 3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | 1 | 1.27 mm | compliant | 8 | S-PDSO-G8 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 0.013 mA | 512KX8 | 2.159 mm | 8 | 0.00005 A | 4194304 bit | SERIAL | FLASH | 3 V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 5.283 mm | 5.283 mm | |||||||||||||||||||
![]() | Mfr Part No SST27VF020-70-3C-WHE | Greenliant Systems Ltd | Datasheet | - | - | Min: 1 Mult: 1 | GREENLIANT SYSTEMS LTD | , | Obsolete | EAR99 | 8542.32.00.51 | compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No S29GL128S90FAI020 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | SPANSION INC | , | Transferred | 3A991.B.1.A | 8542.32.00.51 | unknown | FLASH | 3 V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MX29LV002NCBTC-70 | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 70 ns | MACRONIX INTERNATIONAL CO LTD | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | TSOP1 | TSOP1, TSSOP32,.8,20 | TSSOP32,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP1 | No | 3 V | e0 | EAR99 | NOR TYPE | Tin/Lead (Sn/Pb) | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | unknown | 32 | R-PDSO-G32 | Not Qualified | 3.6 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 0.03 mA | 256KX8 | 1.2 mm | 8 | 0.000005 A | 2097152 bit | PARALLEL | FLASH | 3 V | 100000 Write/Erase Cycles | YES | YES | YES | 1,2,1,3 | 16K,8K,32K,64K | BOTTOM | 18.4 mm | 8 mm | |||||||||||||||||
![]() | Mfr Part No KFG5616Q1A-DEB5 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 67 | 14.5 ns | SAMSUNG SEMICONDUCTOR INC | 1 | 16777216 words | 16000000 | 85 °C | -30 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA67,8X10,32 | BGA67,8X10,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | Obsolete | Yes | 1.8 V | e3 | Yes | EAR99 | SLC NAND TYPE | MATTE TIN | 8542.32.00.51 | BOTTOM | BALL | 0.8 mm | compliant | R-PBGA-B67 | Not Qualified | OTHER | 0.04 mA | 16MX16 | 16 | 0.00005 A | 262144 bit | PARALLEL | FLASH | NO | NO | YES | 512 | 32K | 512 words | YES | ||||||||||||||||||||||||
![]() | Mfr Part No XC1764-CD8C | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | NO | 8 | 2.5 MHz | XILINX INC | 65536 words | 64000 | 85 °C | -40 °C | CERAMIC | DIP | DIP, DIP8,.3 | DIP8,.3 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | EAR99 | 8542.32.00.71 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T8 | Not Qualified | INDUSTRIAL | 0.01 mA | 64KX1 | 3-STATE | 1 | 0.0005 A | 65536 bit | COMMON | CONFIGURATION MEMORY | |||||||||||||||||||||||||||||||||||
![]() | Mfr Part No S29GL064M11FAIS10 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SST45VF010-10-4C-SA | Silicon Storage Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 10 MHz | SILICON STORAGE TECHNOLOGY INC | 1048576 words | 1000000 | 70 °C | PLASTIC/EPOXY | SOP | 4.90 X 6 MM, SOIC-8 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 3 V | e0 | EAR99 | NOR TYPE | Tin/Lead (Sn/Pb) | 8542.32.00.51 | DUAL | GULL WING | 1 | 1.27 mm | unknown | 8 | R-PDSO-G8 | Not Qualified | 3.6 V | COMMERCIAL | 2.7 V | SYNCHRONOUS | 0.03 mA | 1MX1 | 1.75 mm | 1 | 0.000015 A | 1048576 bit | SERIAL | FLASH | 2.7 V | SPI | 10000 Write/Erase Cycles | 100 | HARDWARE | 4.9 mm | 3.9 mm | ||||||||||||||||||||
![]() | Mfr Part No S29GL512N11FAI020 | Spansion | Datasheet | 720 | - | Min: 1 Mult: 1 | YES | 64 | 110 ns | SPANSION INC | 3 | 33554432 words | 32000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | 13 X 11 MM, FBGA-64 | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Obsolete | BGA | No | 3 V | e0 | No | 3A991.B.1.A | NOR TYPE | TIN LEAD | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 1 mm | not_compliant | 64 | R-PBGA-B64 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.09 mA | 32MX16 | 1.4 mm | 16 | 0.000005 A | 536870912 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 512 | 128K | 8/16 words | YES | YES | 13 mm | 11 mm | |||||||||||
![]() | Mfr Part No S29GL512N11FAI020 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 110 ns | ADVANCED MICRO DEVICES INC | 33554432 words | 32000000 | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA64,8X8,40 | BGA64,8X8,40 | SQUARE | GRID ARRAY | Transferred | No | e0 | EAR99 | NOR TYPE | Tin/Lead (Sn/Pb) | 8542.32.00.51 | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B64 | Not Qualified | INDUSTRIAL | 0.09 mA | 32MX16 | 16 | 0.000005 A | 536870912 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 512 | 128K | 8/16 words | YES | YES | |||||||||||||||||||||||||
![]() | Mfr Part No AM29SL800DT90WAF | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 90 ns | SPANSION INC | 3 | 524288 words | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | 8.15 X 6.15 MM, 0.80 MM PITCH, LEAD FREE, FBGA-48 | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | Yes | 1.8 V | e1 | EAR99 | NOR TYPE | TIN SILVER COPPER | TOP BOOT BLOCK | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 40 | 48 | R-PBGA-B48 | Not Qualified | 2.2 V | INDUSTRIAL | 1.7 V | ASYNCHRONOUS | 0.03 mA | 512KX16 | 1.2 mm | 16 | 0.000005 A | 8388608 bit | PARALLEL | FLASH | 1.8 V | 1000000 Write/Erase Cycles | 8 | YES | YES | YES | 1,2,1,15 | 16K,8K,32K,64K | YES | TOP | 8.15 mm | 6.15 mm | ||||||||||
![]() | Mfr Part No AM29F200BB-55SC | AMD | Datasheet | 1264 | - | Min: 1 Mult: 1 | YES | 44 | 55 ns | ADVANCED MICRO DEVICES INC | 131072 words | 128000 | 70 °C | PLASTIC/EPOXY | SOP | SOP, SOP44,.63 | SOP44,.63 | RECTANGULAR | SMALL OUTLINE | Transferred | SOIC | No | 5 V | e0 | EAR99 | NOR TYPE | Tin/Lead (Sn/Pb) | MINIMUM 1000K WRITE/ERASE CYCLE ;20 YEAR DATA RETENTION | 8542.32.00.51 | DUAL | GULL WING | 1 | 1.27 mm | unknown | 44 | R-PDSO-G44 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.06 mA | 128KX16 | 2.8 mm | 16 | 0.000005 A | 2097152 bit | PARALLEL | FLASH | 5 V | 1000000 Write/Erase Cycles | 20 | 8 | YES | YES | YES | 1,2,1,3 | 16K,8K,32K,64K | YES | BOTTOM | 28.2 mm | 13.3 mm | |||||||||||||
![]() | Mfr Part No AM29F200BB-55SC | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 55 ns | SPANSION INC | 3 | 131072 words | 128000 | 70 °C | PLASTIC/EPOXY | SOP | SOP, SOP44,.63 | SOP44,.63 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 5 V | e0 | No | EAR99 | NOR TYPE | TIN LEAD | MIN 1000K WRITE/ERASE CYCLE ;20 YEAR DATA RETENTION; BOTTOM BOOT BLOCK | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 1.27 mm | unknown | 44 | R-PDSO-G44 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.06 mA | 128KX16 | 2.8 mm | 16 | 0.000005 A | 2097152 bit | PARALLEL | FLASH | 5 V | 1000000 Write/Erase Cycles | 20 | 8 | YES | YES | YES | 1,2,1,3 | 16K,8K,32K,64K | YES | BOTTOM | 28.2 mm | 13.3 mm | ||||||||||
![]() | Mfr Part No X-7656-21407 | TE Connectivity | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No K9F3208U0B-TCB0 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 40 | 35 ns | SAMSUNG SEMICONDUCTOR INC | 4194304 words | 4000000 | 70 °C | PLASTIC/EPOXY | TSOP2 | TSOP2, | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP2 | 3.3 V | EAR99 | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.8 mm | compliant | 44 | R-PDSO-G40 | Not Qualified | 3.6 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 4MX8 | 1.2 mm | 8 | 33554432 bit | PARALLEL | FLASH | 2.7 V | 18.41 mm | 10.16 mm | |||||||||||||||||||||||||||||||
![]() | Mfr Part No MX29LV004CBTI-90G | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 40 | 90 ns | MACRONIX INTERNATIONAL CO LTD | 3 | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP1 | TSOP1, TSSOP40,.8,20 | TSSOP40,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP1 | Yes | 3 V | e6 | EAR99 | NOR TYPE | TIN BISMUTH | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | unknown | 40 | R-PDSO-G40 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.03 mA | 4MX8 | 1.2 mm | 8 | 0.000005 A | 33554432 bit | PARALLEL | FLASH | 3 V | YES | YES | YES | 1,2,1,7 | 16K,8K,32K,64K | YES | BOTTOM | YES | 18.4 mm | 10 mm | ||||||||||||||
![]() | Mfr Part No K9F1G16Q0M-YCB0 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 30 ns | SAMSUNG SEMICONDUCTOR INC | 67108864 words | 64000000 | 70 °C | PLASTIC/EPOXY | TSOP1 | 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP1 | No | 1.8 V | e0 | No | EAR99 | SLC NAND TYPE | TIN LEAD | CONTAINS ADDITIONAL 32M BIT NAND FLASH | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | compliant | 48 | R-PDSO-G48 | Not Qualified | 1.95 V | COMMERCIAL | 1.65 V | ASYNCHRONOUS | 0.015 mA | 64MX16 | 1.2 mm | 16 | 0.00005 A | 1073741824 bit | PARALLEL | FLASH | 1.8 V | NO | NO | YES | 1K | 64K | 1K words | YES | 18.4 mm | 12 mm |
PM49FL004T-33VC
Integrated Silicon Solution Inc
Package:Memory - Modules
Price: please inquire
SST39VF040-70-4C-N
Microchip Technology Inc
Package:Memory - Modules
Price: please inquire
5962-9461302HXC
White Microelectronics
Package:Memory - Modules
Price: please inquire
S25FL004A0LMAI003
Spansion
Package:Memory - Modules
Price: please inquire
SST27VF020-70-3C-WHE
Greenliant Systems Ltd
Package:Memory - Modules
Price: please inquire
S29GL128S90FAI020
Spansion
Package:Memory - Modules
Price: please inquire
MX29LV002NCBTC-70
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
KFG5616Q1A-DEB5
Samsung Semiconductor
Package:Memory - Modules
Price: please inquire
XC1764-CD8C
AMD Xilinx
Package:Memory - Modules
Price: please inquire
S29GL064M11FAIS10
Spansion
Package:Memory - Modules
Price: please inquire
SST45VF010-10-4C-SA
Silicon Storage Technology
Package:Memory - Modules
Price: please inquire
S29GL512N11FAI020
Spansion
Package:Memory - Modules
Price: please inquire
S29GL512N11FAI020
AMD
Package:Memory - Modules
Price: please inquire
AM29SL800DT90WAF
Spansion
Package:Memory - Modules
Price: please inquire
AM29F200BB-55SC
AMD
Package:Memory - Modules
Price: please inquire
AM29F200BB-55SC
Spansion
Package:Memory - Modules
Price: please inquire
X-7656-21407
TE Connectivity
Package:Memory - Modules
Price: please inquire
K9F3208U0B-TCB0
Samsung Semiconductor
Package:Memory - Modules
Price: please inquire
MX29LV004CBTI-90G
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
K9F1G16Q0M-YCB0
Samsung Semiconductor
Package:Memory - Modules
Price: please inquire
