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Memory - Modules (5402)

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Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	Factory Lead Time	Surface Mount	Number of Terminals	Access Time-Max	Clock Frequency-Max (fCLK)	Dimensions	I/O	Ihs Manufacturer	Interface Type	Moisture Sensitivity Levels	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Part Package Code	Rohs Code	Supply Voltage-Nom (Vsup)	JESD-609 Code	Pbfree Code	ECCN Code	Type	Terminal Finish	Additional Feature	HTS Code	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Terminal Pitch	Reach Compliance Code	Frequency	Time@Peak Reflow Temperature-Max (s)	Pin Count	JESD-30 Code	Qualification Status	Supply Voltage-Max (Vsup)	Temperature Grade	Supply Voltage-Min (Vsup)	Voltage	Operating Mode	Supply Current-Max	Organization	Output Characteristics	Seated Height-Max	Memory Width	Density	Standby Current-Max	Memory Density	Parallel/Serial	Memory IC Type	Programming Voltage	Serial Bus Type	Endurance	Write Protection	Alternate Memory Width	Data Polling	Toggle Bit	Command User Interface	Number of Sectors/Size	Sector Size	Page Size	Ready/Busy	Boot Block	Common Flash Interface	Temperature	Length	Width
Mfr Part No W97BH6MBVA2I	Winbond	Datasheet	-	-	Min: 1 Mult: 1						10X11.5mm2	16BIT		Low Power DDR2 SDRAM						VFBGA - 134																								400 / 533MHz								1.7 ~ 1.95V							2Gb																			-40 ~ 85˚C
Mfr Part No W9812G2KB-6I	Winbond	Datasheet	-	-	Min: 1 Mult: 1						8X13mm2	32BIT		SDRAM						TFBGA - 90																								166 / 200MbpsMHz								2.7 ~ 3.6V							128Mb																			-40~85˚C
Mfr Part No W9812G6KH-6I	Winbond	Datasheet	-	-	Min: 1 Mult: 1						400mil	16BIT		SDRAM						TSOPII - 54																								166 / 200MHz								3 ~ 3.6V							128Mb																			-40~85˚C
Mfr Part No W9825G6KH-5I	Winbond	Datasheet	-	-	Min: 1 Mult: 1						400mil	16BIT		SDRAM						TSOPII - 54																								166 / 200MHz								3 ~ 3.6V							256Mb																			-40 ~ 85˚C
Mfr Part No W9825G6KH-6I	Winbond	Datasheet	-	-	Min: 1 Mult: 1						400mil	16BIT		SDRAM						TSOPII - 54																								166 / 200MHz								3 ~ 3.6V							256Mb																			-40 ~ 85˚C
Mfr Part No W989D2DBJX6I	Winbond	Datasheet	-	-	Min: 1 Mult: 1						8X13mm2	32BIT		Low Power SDR SDRAM						VFBGA - 90																								133 / 166MHz								1.7 ~ 1.95V							512Mb																			-40 ~ 85˚C
Mfr Part No PF48F4000P0ZTQE	Numonyx Memory Solutions	Datasheet	-	-	Min: 1 Mult: 1		YES	88					NUMONYX			33554432 words	32000000	85 °C	-40 °C		PLASTIC/EPOXY	VFBGA	8 X 11 MM, 1 MM HEIGHT, LEAD FREE, SCSP-88	BGA88,8X12,32	RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	Transferred	BGA	Yes				EAR99	NOR TYPE		ASYNCHRONOUS READ MODE	8542.32.00.51	BOTTOM	BALL		1	0.8 mm	unknown			88	R-PBGA-B88	Not Qualified	2 V	INDUSTRIAL	1.7 V		SYNCHRONOUS	0.031 mA	32MX16		1 mm	16		0.00021 A	536870912 bit	PARALLEL	FLASH	1.8 V				16	NO	NO	YES	4,255	16K,64K			TOP	YES		11 mm	8 mm
Mfr Part No PF48F4000P0ZTQE	Micron Technology Inc	Datasheet	-	-	Min: 1 Mult: 1		YES	88	100 ns	52 MHz			MICRON TECHNOLOGY INC			16777216 words	16000000	85 °C	-40 °C		PLASTIC/EPOXY	VFBGA	SCSP-88	BGA88,8X12,32	RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	Obsolete	BGA	Yes	1.8 V		Yes	EAR99	NOR TYPE		ASYNCHRONOUS READ MODE	8542.32.00.51	BOTTOM	BALL	260	1	0.8 mm	compliant		30	88	R-PBGA-B88	Not Qualified	2 V	INDUSTRIAL	1.7 V		SYNCHRONOUS	0.031 mA	16MX16		1 mm	16		0.00021 A	268435456 bit	PARALLEL	FLASH	1.8 V				16	NO	NO	YES	4,255	16K,64K			TOP	YES		11 mm	8 mm
Mfr Part No QH25F160S33B8	Intel Corporation	Datasheet	184 In Stock	-	Min: 1 Mult: 1		YES	16		68 MHz			INTEL CORP			2097152 words	2000000	85 °C	-40 °C		PLASTIC/EPOXY	SOP	SOP,	SOP16,.4	RECTANGULAR	SMALL OUTLINE	Transferred	SOIC	Yes	3 V	e3		EAR99	NOR TYPE	MATTE TIN		8542.32.00.51	DUAL	GULL WING		1	1.27 mm	compliant			16	R-PDSO-G16	Not Qualified	3.6 V	INDUSTRIAL	2.7 V		SYNCHRONOUS	0.045 mA	2MX8	3-STATE	2.642 mm	8		0.00007 A	16777216 bit	SERIAL	FLASH	3 V	SPI	100000 Write/Erase Cycles	HARDWARE/SOFTWARE												10.338 mm	7.52 mm
Mfr Part No S29AL004D70BAI022	Cypress Semiconductor	Datasheet	-	-	Min: 1 Mult: 1		YES	48	70 ns				CYPRESS SEMICONDUCTOR CORP		3	262144 words	256000	85 °C	-40 °C		PLASTIC/EPOXY	VFBGA	FBGA-48		RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	Obsolete		No	3 V	e0		EAR99	NOR TYPE	TIN LEAD	ALSO CONFIGURABLE AS 512K X 8; BOTTOM BOOT BLOCK	8542.32.00.51	BOTTOM	BALL	260	1	0.8 mm	compliant				R-PBGA-B48		3.6 V	INDUSTRIAL	2.7 V		ASYNCHRONOUS		256KX16		1 mm	16			4194304 bit	PARALLEL	FLASH	3 V				8								BOTTOM			8.15 mm	6.15 mm
Mfr Part No S29AL004D70BAI022	AMD	Datasheet	-	-	Min: 1 Mult: 1		YES	48	70 ns				ADVANCED MICRO DEVICES INC			262144 words	256000	85 °C	-40 °C		PLASTIC/EPOXY	FBGA		BGA48,6X8,32	RECTANGULAR	GRID ARRAY, FINE PITCH	Transferred		No		e0		EAR99	NOR TYPE	Tin/Lead (Sn/Pb)		8542.32.00.51	BOTTOM	BALL			0.8 mm	unknown				R-PBGA-B48	Not Qualified		INDUSTRIAL				0.035 mA	256KX16			16		0.000005 A	4194304 bit	PARALLEL	FLASH			1000000 Write/Erase Cycles		8	YES	YES	YES	1,2,1,7	16K,8K,32K,64K		YES	BOTTOM
Mfr Part No S29AL004D70BAI022	Spansion	Datasheet	-	-	Min: 1 Mult: 1		YES	48	70 ns				SPANSION INC		3	262144 words	256000	85 °C	-40 °C		PLASTIC/EPOXY	VFBGA	8.15 X 6.15 MM, FBGA-48	BGA48,6X8,32	RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	Obsolete	BGA	No	3 V	e0	No	EAR99	NOR TYPE	TIN LEAD	ALSO CONFIGURABLE AS 512K X 8; BOTTOM BOOT BLOCK	8542.32.00.51	BOTTOM	BALL	260	1	0.8 mm	not_compliant			48	R-PBGA-B48	Not Qualified	3.6 V	INDUSTRIAL	2.7 V		ASYNCHRONOUS	0.035 mA	256KX16		1 mm	16		0.000005 A	4194304 bit	PARALLEL	FLASH	3 V		1000000 Write/Erase Cycles		8	YES	YES	YES	1,2,1,7	16K,8K,32K,64K		YES	BOTTOM			8.15 mm	6.15 mm
Mfr Part No SDINBDG4-8G-XAT	Western Digital Corp	Datasheet	-	-	Min: 1 Mult: 1
Mfr Part No MX26LV800BXBC-55	Macronix International Co Ltd	Datasheet	-	-	Min: 1 Mult: 1		YES	48	55 ns				MACRONIX INTERNATIONAL CO LTD			524288 words	512000	70 °C			PLASTIC/EPOXY	TFBGA	TFBGA, BGA48,6X8,32	BGA48,6X8,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	No	3.3 V	e0		EAR99	NOR TYPE	TIN LEAD		8542.32.00.51	BOTTOM	BALL		1	0.8 mm	unknown			48	R-PBGA-B48	Not Qualified	3.6 V	COMMERCIAL	3 V		ASYNCHRONOUS	0.03 mA	512KX16		1.2 mm	16		0.0001 A	8388608 bit	PARALLEL	FLASH	3 V		2000 Write/Erase Cycles		8	YES	YES	YES	1,2,1,15	16K,8K,32K,64K		YES	BOTTOM			8 mm	6 mm
Mfr Part No S29GL064M90BAIR00	Spansion	Datasheet	-	-	Min: 1 Mult: 1		YES	63	90 ns				SPANSION INC		3	8388608 words	8000000	85 °C	-40 °C		PLASTIC/EPOXY	TFBGA	12 X 11 MM, FBGA-63	BGA63,8X12,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	No	3.3 V	e0		EAR99	NOR TYPE	TIN LEAD		8542.32.00.51	BOTTOM	BALL	260	1	0.8 mm	not_compliant			63	R-PBGA-B63	Not Qualified	3.6 V	INDUSTRIAL	3 V		ASYNCHRONOUS	0.06 mA	8MX8		1.2 mm	8		0.000005 A	67108864 bit	PARALLEL	FLASH	3 V					YES	YES	YES	128	64K	8 words	YES	BOTTOM/TOP	YES		12 mm	11 mm
Mfr Part No SST25VF512-20-4C-S	Microchip Technology Inc	Datasheet	960 In Stock	-	Min: 1 Mult: 1
Mfr Part No MX29F002BQC-55	Macronix International Co Ltd	Datasheet	-	-	Min: 1 Mult: 1		YES	32	55 ns				MACRONIX INTERNATIONAL CO LTD			262144 words	256000	70 °C			PLASTIC/EPOXY	QCCJ	QCCJ, LDCC32,.5X.6	LDCC32,.5X.6	RECTANGULAR	CHIP CARRIER	Obsolete	LCC	No	5 V	e0		EAR99	NOR TYPE	TIN LEAD		8542.32.00.51	QUAD	J BEND		1	1.27 mm	unknown			32	R-PQCC-J32	Not Qualified	5.25 V	COMMERCIAL	4.75 V		ASYNCHRONOUS	0.05 mA	256KX8		3.55 mm	8		0.000005 A	2097152 bit	PARALLEL	FLASH	5 V		100000 Write/Erase Cycles			YES	YES	YES	1,2,1,3	16K,8K,32K,64K			BOTTOM			14.05 mm	11.43 mm
Mfr Part No SNV2S/2000G	Kingston Technology Company	Datasheet	1720 In Stock	1: $280.277155 10: $264.412411 100: $249.445670 500: $235.326104 View all price	Min: 1 Mult: 1	4 Weeks, 2 Days	NO						KINGSTON TECHNOLOGY COMPANY INC			2199023255552 words	2000000000000	70 °C			UNSPECIFIED	SMA			RECTANGULAR	MICROELECTRONIC ASSEMBLY	Active							NOR TYPE				SINGLE	NO LEAD		1		unknown				R-XSMA-N								2TX8			8			17592186044416 bit		FLASH MODULE
Mfr Part No TC54H1024AP-85	Toshiba America Electronic Components	Datasheet	-	-	Min: 1 Mult: 1		NO	40	85 ns				TOSHIBA CORP			65536 words	64000	70 °C			PLASTIC/EPOXY	DIP	DIP,		RECTANGULAR	IN-LINE	Active	DIP	No	5 V	e0	No	EAR99		TIN LEAD		8542.32.00.71	DUAL	THROUGH-HOLE		1	2.54 mm	unknown			40	R-PDIP-T40	Not Qualified	5.25 V	COMMERCIAL	4.75 V		ASYNCHRONOUS		64KX16		4.8 mm	16			1048576 bit	PARALLEL	OTP ROM																50.7 mm	15.24 mm
Mfr Part No PM25LQ080-BCE	Integrated Silicon Solution Inc	Datasheet	-	-	Min: 1 Mult: 1		YES	8		104 MHz			INTEGRATED SILICON SOLUTION INC		1	1048576 words	1000000	85 °C	-40 °C		PLASTIC/EPOXY	SOP	SOP,		SQUARE	SMALL OUTLINE	Active		Yes	3 V	e3		EAR99	NOR TYPE	Matte Tin (Sn)		8542.32.00.51	DUAL	GULL WING	260	1	1.27 mm	compliant		10		S-PDSO-G8		3.6 V	INDUSTRIAL	2.3 V		SYNCHRONOUS		1MX8		2.16 mm	8			8388608 bit	SERIAL	FLASH	3 V															5.28 mm	5.28 mm