The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | # I/Os (Max) | # Registers | Base Product Number | Clock Frequency-Max | Device System Gates | Factory Pack QuantityFactory Pack Quantity | Family Name | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Memory Types | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Number of Usable Gates | Operating Supply Voltage (Max) | Operating Supply Voltage (Min) | Operating Supply Voltage (Typ) | Operating Temp Range | Operating Temperature (Max.) | Operating Temperature (Min.) | Operating Temperature Classification | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Shape | Package Style | Package Type | Part Life Cycle Code | Process Technology | Product Status | Programmable | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Total Memory | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Termination | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Memory Size | Operating Supply Current | RAM Size | Clock Frequency | Propagation Delay | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Density | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Number of Logic Blocks (LABs) | Speed Grade | Number of Macro Cells | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Equivalent Gates | Height | Height Seated (Max) | Length | Width | Radiation Hardening | REACH SVHC | RoHS Status | Lead Free |
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![]() | Mfr Part No APA300-PQG208 | Microchip Technology | Datasheet | 2037 | - | Min: 1 Mult: 1 | Surface Mount | PQFP-208 | 208-PQFP (28x28) | 158 | 8192 | APA300 | 300000 | 24 | PROASICPLUS | 180 MHz | 2.7 V | + 70 C | Microchip Technology | 2.3 V | 0 C | Yes | Surface Mount | SMD/SMT | 158 I/O | - | - | 300000 | 2.7(V) | 2.3(V) | 2.5(V) | 0C to 70C | 70C | 0C | Commercial | Tray | PQFP | 0.22UM | Active | Yes | No | Details | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 73728 bit | ProASICPLUS | 2.5000 V | 0 to 70 °C | Tray | APA300 | 2.3V ~ 2.7V | 180(MHz) | 208 | 2.5 V | 5 mA | 73728 | 300000 | STD | 3.4 mm | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC3S500E-4FTG256I | Xilinx Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | Surface Mount | 256-LBGA | 256 | 190 | -40°C~100°C TJ | Tray | 2001 | Spartan®-3E | e1 | yes | Active | 3 (168 Hours) | 256 | EAR99 | 1.14V~1.26V | BOTTOM | BALL | 260 | 1.2V | 30 | XC3S500E | 256 | 149 | Not Qualified | 1.2V | 1.21.2/3.32.5V | 45kB | 572MHz | FIELD PROGRAMMABLE GATE ARRAY | 10476 | 368640 | 500000 | 1164 | 4 | 9312 | 0.76 ns | 1mm | 17mm | 17mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC6SLX75-3FGG676C | Xilinx Inc. | Datasheet | 744 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | Surface Mount | 676-BGA | 676 | 408 | 0°C~85°C TJ | Tray | 2008 | Spartan®-6 LX | e1 | yes | Active | 3 (168 Hours) | 676 | 1.14V~1.26V | BOTTOM | BALL | 250 | 1.2V | 1mm | 30 | XC6SLX75 | 676 | 400 | Not Qualified | 1.2V | 387kB | 862MHz | FIELD PROGRAMMABLE GATE ARRAY | 74637 | 3170304 | 5831 | 3 | 93296 | 0.21 ns | 2.44mm | 27mm | 27mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No EP3C5F256C7N | Intel | Datasheet | 4 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-LBGA | YES | 182 | 0°C~85°C TJ | Tray | Cyclone® III | e1 | Active | 3 (168 Hours) | 256 | EAR99 | TIN SILVER COPPER | 8542.39.00.01 | 1.15V~1.25V | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | EP3C5 | R-PBGA-B256 | 182 | Not Qualified | 472.5MHz | 182 | FIELD PROGRAMMABLE GATE ARRAY | 5136 | 423936 | 321 | 1.55mm | 17mm | 17mm | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr Part No LCMXO2-1200HC-6MG132I | Lattice Semiconductor Corporation | Datasheet | 12 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | Surface Mount | 132-LFBGA, CSPBGA | 132 | FLASH | 104 | -40°C~100°C TJ | Tray | 2000 | MachXO2 | e1 | yes | Active | 3 (168 Hours) | 132 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 2.375V~3.465V | BOTTOM | BALL | 250 | 2.5V | 0.5mm | 30 | LCMXO2-1200 | 132 | 105 | 2.5V | 2.5/3.3V | 17.3kB | 3.49mA | 8kB | FIELD PROGRAMMABLE GATE ARRAY | 1280 | 65536 | 388MHz | 160 | 640 | No | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No LCMXO2-1200ZE-1TG100C | Lattice Semiconductor Corporation | Datasheet | 12 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | Surface Mount | 100-LQFP | 100 | 657.000198mg | FLASH | 79 | 0°C~85°C TJ | Tray | 2000 | MachXO2 | yes | Active | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | 8542.39.00.01 | 1.14V~1.26V | QUAD | GULL WING | 260 | 1.2V | 0.5mm | 104MHz | 30 | LCMXO2-1200 | 100 | 80 | Not Qualified | 1.2V | 17.3kB | 58μA | 8kB | 10.21 ns | FIELD PROGRAMMABLE GATE ARRAY | 1280 | 64 kb | 65536 | 160 | 640 | 1.4mm | 14mm | 14mm | No SVHC | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No EP4CE40U19I7N | Intel | Datasheet | 296 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 484-FBGA | YES | 328 | -40°C~100°C TJ | Tray | 2016 | Cyclone® IV E | e1 | Active | 3 (168 Hours) | 484 | 3A001.A.7.A | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.15V~1.25V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 30 | EP4CE40 | S-PBGA-B484 | 328 | Not Qualified | 1.21.2/3.32.5V | 328 | FIELD PROGRAMMABLE GATE ARRAY | 39600 | 1161216 | 2475 | 2.05mm | 19mm | 19mm | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr Part No LFE2-12E-7FN256C | Lattice Semiconductor Corporation | Datasheet | 4000 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | Surface Mount | 256-BGA | 256 | 193 | 0°C~85°C TJ | Tray | 2008 | ECP2 | e1 | yes | Active | 3 (168 Hours) | 256 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.14V~1.26V | BOTTOM | BALL | 250 | 1.2V | 1mm | not_compliant | 30 | LFE2-12 | 256 | 193 | Not Qualified | 1.2V | 30.6kB | 27.6kB | 420MHz | FIELD PROGRAMMABLE GATE ARRAY | 12000 | 226304 | 1500 | 0.304 ns | 2.1mm | 17mm | 17mm | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr Part No LFE3-17EA-6FTN256I | Lattice Semiconductor Corporation | Datasheet | 4559 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | Surface Mount | 256-BGA | 256 | 133 | -40°C~100°C TJ | Tray | 2012 | ECP3 | e1 | yes | Active | 3 (168 Hours) | 256 | EAR99 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | 1.14V~1.26V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | LFE3-17 | 256 | 133 | 1.2V | 92kB | 18mA | 87.5kB | FIELD PROGRAMMABLE GATE ARRAY | 17000 | 716800 | 3.1MHz | 2125 | 0.379 ns | 1.55mm | 17mm | 17mm | No | No SVHC | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC6SLX45-3CSG484I | Xilinx Inc. | Datasheet | 2117 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | Surface Mount | 484-FBGA, CSPBGA | 484 | 320 | -40°C~100°C TJ | Tray | 2008 | Spartan®-6 LX | e1 | yes | Active | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.14V~1.26V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 30 | XC6SLX45 | 484 | 320 | Not Qualified | 1.2V | 261kB | 862MHz | FIELD PROGRAMMABLE GATE ARRAY | 43661 | 2138112 | 3411 | 3 | 54576 | 0.21 ns | 1.8mm | 19mm | 19mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA300-FG144M | Microchip Technology | Datasheet | 504 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | 144-FPBGA (13x13) | APA300 | 160 | 180 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 100 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | Actel | 0.014110 oz | -55°C ~ 125°C (TC) | Tray | APA300 | 2.3V ~ 2.7V | 2.5 V | 73728 | 300000 | 1.05 mm | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC3S200-4PQG208C | Xilinx Inc. | Datasheet | 119 |
| Min: 1 Mult: 1 | 10 Weeks | Tin | Surface Mount | Surface Mount | 208-BFQFP | 208 | 141 | 0°C~85°C TJ | Tray | 2006 | Spartan®-3 | e3 | yes | Active | 3 (168 Hours) | 208 | SMD/SMT | EAR99 | 1.14V~1.26V | QUAD | GULL WING | 245 | 1.2V | 0.5mm | 630MHz | 30 | XC3S200 | 208 | 141 | Not Qualified | 1.2V | 1.21.2/3.32.5V | 27kB | FIELD PROGRAMMABLE GATE ARRAY | 4320 | 221184 | 200000 | 480 | 4 | 0.61 ns | 480 | 3.4mm | 28mm | 28mm | Unknown | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC7K325T-3FFG676E | Xilinx Inc. | Datasheet | 792 |
| Min: 1 Mult: 1 | 11 Weeks | Surface Mount | 676-BBGA, FCBGA | YES | DDR3 | 400 | 0°C~100°C TJ | Tray | 2010 | Kintex®-7 | e1 | yes | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | 0.97V~1.03V | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | not_compliant | NOT SPECIFIED | XC7K325T | 676 | S-PBGA-B676 | 400 | Not Qualified | 11.83.3V | 1GB | 2MB | 1412MHz | 400 | FIELD PROGRAMMABLE GATE ARRAY | 326080 | 16404480 | 25475 | -3 | 407600 | 0.58 ns | 3.37mm | 27mm | 27mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC7K325T-1FBG900C | Xilinx Inc. | Datasheet | 492 | - | Min: 1 Mult: 1 | 11 Weeks | Copper, Silver, Tin | Surface Mount | 900-BBGA, FCBGA | 900 | 900-FCBGA (31x31) | DDR3 | 500 | 0°C~85°C TJ | Tray | 2009 | Kintex®-7 | Active | 4 (72 Hours) | 85°C | 0°C | 0.97V~1.03V | XC7K325T | 1.03V | 970mV | 1GB | 2MB | 326080 | 16404480 | 25475 | 25475 | -1 | 407600 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC3S1200E-4FG320I | Xilinx Inc. | Datasheet | 2329 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | Surface Mount | 320-BGA | 320 | 250 | -40°C~100°C TJ | Tray | 2012 | Spartan®-3E | e0 | no | Active | 3 (168 Hours) | 320 | 3A991.D | Tin/Lead (Sn/Pb) | 1.14V~1.26V | BOTTOM | BALL | 225 | 1.2V | 1mm | 30 | XC3S1200E | 320 | 194 | Not Qualified | 1.2V | 1.21.2/3.32.5V | 63kB | 572MHz | FIELD PROGRAMMABLE GATE ARRAY | 19512 | 516096 | 1200000 | 2168 | 4 | 17344 | 0.76 ns | 2mm | 19mm | 19mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC5VFX30T-2FFG665I | Xilinx Inc. | Datasheet | 440 | - | Min: 1 Mult: 1 | 16 Weeks | Copper, Silver, Tin | Surface Mount | Surface Mount | 665-BBGA, FCBGA | 665 | 360 | -40°C~100°C TJ | Tray | 1999 | Virtex®-5 FXT | e1 | Active | 4 (72 Hours) | 665 | 3A991.D | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 0.95V~1.05V | BOTTOM | BALL | 250 | 1V | 1mm | not_compliant | 30 | XC5VFX30T | 665 | 360 | Not Qualified | 306kB | 3040 CLBS | FIELD PROGRAMMABLE GATE ARRAY | 32768 | 2506752 | 2560 | 2 | 3040 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC3S100E-4VQG100C | Xilinx Inc. | Datasheet | 792 |
| Min: 1 Mult: 1 | 10 Weeks | Surface Mount | Surface Mount | 100-TQFP | 100 | 66 | 0°C~85°C TJ | Tray | 2008 | Spartan®-3E | e3 | yes | Active | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | 1.14V~1.26V | QUAD | GULL WING | 260 | 1.2V | 0.5mm | 30 | XC3S100E | 100 | 59 | 1.2V | 1.21.2/3.32.5V | 9kB | 572MHz | FIELD PROGRAMMABLE GATE ARRAY | 2160 | 73728 | 100000 | 240 | 4 | 1920 | 0.76 ns | 240 | 1mm | 14mm | 14mm | No | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3P600-FGG256I | Microchip Technology | Datasheet | 48 | - | Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | FBGA-256 | YES | 256 | 256-FPBGA (17x17) | 256 | A3P600 | 350 MHz | 90 | MICROSEMI CORP | A3P600-FGG256I | 231 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 177 I/O | - | 6500 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 1.31 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | 110592 bit | ProASIC3 | 1.5000 V | -40 to 85 °C | Tray | A3P600 | e1 | 3A001.A.7.A | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | 231 MHz | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 13.5 kB | 45 mA | 13.5 kB | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 6500 | 110592 | 600000 | 231 MHz | STD | 13824 | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | No | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC2S200-5FG256C | Xilinx Inc. | Datasheet | 407 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | Surface Mount | 256-BGA | 256 | 176 | 0°C~85°C TJ | Tray | 1999 | Spartan®-II | e0 | no | Active | 3 (168 Hours) | 256 | EAR99 | Tin/Lead (Sn63Pb37) | 2.375V~2.625V | BOTTOM | BALL | 225 | 2.5V | 1mm | not_compliant | 30 | XC2S200 | 256 | 176 | Not Qualified | 2.5V | 7kB | 263MHz | FIELD PROGRAMMABLE GATE ARRAY | 5292 | 57344 | 200000 | 1176 | 5 | 0.7 ns | 2mm | 17mm | 17mm | Non-RoHS Compliant | Contains Lead | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No EP4CE55F23C8N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 484-BGA | YES | 324 | 0°C~85°C TJ | Tray | Cyclone® IV E | e1 | Active | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.15V~1.25V | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | EP4CE55 | S-PBGA-B484 | 327 | Not Qualified | 1.21.2/3.32.5V | 472.5MHz | 327 | FIELD PROGRAMMABLE GATE ARRAY | 55856 | 2396160 | 3491 | 2.4mm | 23mm | 23mm | RoHS Compliant |
APA300-PQG208
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
XC3S500E-4FTG256I
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
XC6SLX75-3FGG676C
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
EP3C5F256C7N
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
LCMXO2-1200HC-6MG132I
Lattice Semiconductor Corporation
Package:Embedded - FPGAs (Field Programmable Gate Array)
14.820342
LCMXO2-1200ZE-1TG100C
Lattice Semiconductor Corporation
Package:Embedded - FPGAs (Field Programmable Gate Array)
12.042577
EP4CE40U19I7N
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
LFE2-12E-7FN256C
Lattice Semiconductor Corporation
Package:Embedded - FPGAs (Field Programmable Gate Array)
63.623046
LFE3-17EA-6FTN256I
Lattice Semiconductor Corporation
Package:Embedded - FPGAs (Field Programmable Gate Array)
36.304958
XC6SLX45-3CSG484I
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
APA300-FG144M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
729.418326
XC3S200-4PQG208C
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
62.691208
XC7K325T-3FFG676E
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
188.619040
XC7K325T-1FBG900C
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
XC3S1200E-4FG320I
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
XC5VFX30T-2FFG665I
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
XC3S100E-4VQG100C
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
15.661915
A3P600-FGG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
XC2S200-5FG256C
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
EP4CE55F23C8N
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
