The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | RAM Size | Clock Frequency | Propagation Delay | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Number of Logic Blocks (LABs) | Speed Grade | Output Function | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Dedicated Inputs | Number of Equivalent Gates | Height | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status |
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 | Mfr Part No M1A3PE3000-2FG324 | Microchip Technology | Datasheet | 532 |
| Min: 1 Mult: 1 | Surface Mount | 324-BGA | YES | 324-FBGA (19x19) | 324 | M1A3PE3000 | 350 MHz | 84 | MICROSEMI CORP | M1A3PE3000-2FG324 | Microchip Technology | Yes | 3 | 221 | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA324,18X18,40 | BGA324,18X18,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0°C ~ 85°C (TJ) | Tray | M1A3PE3000 | e0 | TIN LEAD SILVER | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B324 | 221 | Not Qualified | 1.5/3.3 V | COMMERCIAL | 221 | 75264 CLBS, 3000000 GATES | 1.78 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 75264 | 75264 | 3000000 | 19 mm | 19 mm | |||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P600-1FG256 | Microchip Technology | Datasheet | 27 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | A3P600 | 350 MHz | 90 | MICROSEMI CORP | A3P600-1FG256 | 272 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 177 I/O | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | A3P600 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | COMMERCIAL | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 1 | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P1000-FG144I | Microchip Technology | Datasheet | 13 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | M1A3P1000 | 350 MHz | 160 | MICROSEMI CORP | M1A3P1000-FG144I | 231 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 97 I/O | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.23 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | M1A3P1000 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | INDUSTRIAL | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | STD | 24576 | 1000000 | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M7A3P1000-FG144I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | FBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | M7A3P1000 | 350 MHz | 160 | MICROSEMI CORP | M7A3P1000-FG144I | 231 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 97 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Not Recommended | Active | 30 | 5.25 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | M7A3P1000 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B144 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 18 kB | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 231 MHz | STD | 24576 | 24576 | 1000000 | 1.05 mm | 13 mm | 13 mm | No | ||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P1000-2FG256 | Microchip Technology | Datasheet | 13 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | M1A3P1000 | 350 MHz | 90 | MICROSEMI CORP | M1A3P1000-2FG256 | 310 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 177 I/O | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | M1A3P1000 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | COMMERCIAL | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 2 | 24576 | 1000000 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M7A3P1000-FG484I | Microchip Technology | Datasheet | 2373 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | FBGA | 484 | 484-FPBGA (23x23) | 400.011771 mg | M7A3P1000 | 60 | 231 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | SMD/SMT | 300 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | M7A3P1000 | 85 °C | -40 °C | 1.425V ~ 1.575V | 1.5 V | 1.575 V | 1.425 V | 18 kB | 147456 | 1000000 | 231 MHz | STD | 24576 | 1.73 mm | 23 mm | 23 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M7A3P1000-2FG484 | Microchip Technology | Datasheet | 1756 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | M7A3P1000 | 350 MHz | 60 | MICROSEMI CORP | M7A3P1000-2FG484 | 310 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 300 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Not Recommended | Active | 30 | 5.25 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | M7A3P1000 | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B484 | Not Qualified | 1.5 V | COMMERCIAL | 1.575 V | 1.425 V | 18 kB | 24576 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 310 MHz | 2 | 24576 | 24576 | 1000000 | 1.73 mm | 23 mm | 23 mm | No | ||||||||||||||||||||||||||||||
| Mfr Part No A54SX16-TQG176 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | TQFP-176 | YES | 176-TQFP (24x24) | 176 | A54SX16 | 240 MHz | 40 | MICROSEMI CORP | A54SX16-TQG176 | 240 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 147 I/O | 70 °C | Tray | PLASTIC/EPOXY | LFQFP | 1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-176 | QFP176,1.0SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.24 | Details | Yes | 3.6 V | 3 V | 3.3 V | Actel | 0°C ~ 70°C (TA) | Tray | A54SX16 | e3 | Matte Tin (Sn) | CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | GULL WING | 260 | 0.5 mm | compliant | S-PQFP-G176 | 147 | Not Qualified | 3.3 V, 5 V | 3.3,5 V | COMMERCIAL | 147 | 1452 CLBS, 16000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 24000 | 1452 | 0.9 ns | 1452 | 1452 | 16000 | 1.4 mm | 24 mm | 24 mm | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A42MX24-2TQG176 | Microchip Technology | Datasheet | 1904 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | TQFP-176 | YES | 176 | 176-TQFP (24x24) | 176 | A42MX24 | 105 MHz | 40 | MICROSEMI CORP | A42MX24-2TQG176 | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 150 I/O | 70 °C | Tray | PLASTIC/EPOXY | LFQFP | 1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TQFP-176 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.3 | Details | Yes | 5.25 V | 3 V | 3.3 V | Actel | 0°C ~ 70°C (TA) | Tray | A42MX24 | e3 | Matte Tin (Sn) | 70 °C | 0 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | GULL WING | 260 | 0.5 mm | compliant | S-PQFP-G176 | Not Qualified | 3.3 V, 5 V | COMMERCIAL | 5.25 V | 3 V | 1890 CLBS, 36000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 912 | 36000 | 912 | 2 | 1410 | 1.8 ns | 1890 | 36000 | 1.4 mm | 24 mm | 24 mm | No | |||||||||||||||||||||||||||||||||||
| Mfr Part No M7A3P1000-2FG144I | Microchip Technology | Datasheet | 1904 |
| Min: 1 Mult: 1 | Surface Mount | Surface Mount | FBGA | 144 | 144-FPBGA (13x13) | 400.011771 mg | M7A3P1000 | 160 | 310 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | SMD/SMT | 97 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | M7A3P1000 | 85 °C | -40 °C | 1.425V ~ 1.575V | 310 MHz | 1.5 V | 1.575 V | 1.425 V | 18 kB | 147456 | 1000000 | 310 MHz | 2 | 24576 | 1.05 mm | 13 mm | 13 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A40MX04-1PLG68I | Microchip Technology | Datasheet | 1780 |
| Min: 1 Mult: 1 | Surface Mount | PLCC-68 | YES | 68-PLCC (24.23x24.23) | 68 | A40MX04 | 48 MHz | 19 | MICROSEMI CORP | A40MX04-1PLG68I | 160 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 57 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | QCCJ | QCCJ, | SQUARE | CHIP CARRIER | Active | Active | 40 | 5.29 | Details | Yes | 5.5 V | 3 V | 3.3 V | Actel | 0.171777 oz | -40°C ~ 85°C (TA) | Tube | A40MX04 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 245 | 1.27 mm | compliant | S-PQCC-J68 | Not Qualified | 3.3 V, 5 V | INDUSTRIAL | 547 CLBS, 6000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | 6000 | 2.3 ns | 547 | 6000 | 3.68 mm | 24.23 mm | 24.23 mm | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P400-1FGG256I | Microchip Technology | Datasheet | 7 | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-256 | YES | 256-FPBGA (17x17) | 256 | M1A3P400 | 90 | MICROSEMI CORP | M1A3P400-1FGG256I | Microchip Technology | Yes | 3 | SMD/SMT | 178 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | -40°C ~ 100°C (TJ) | Tray | M1A3P400 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | INDUSTRIAL | 9216 CLBS, 400000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 400000 | 9216 | 400000 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL150T-1FC1152 | Microchip Technology | Datasheet | 1868 |
| Min: 1 Mult: 1 | Surface Mount | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | M2GL150 | 24 | Microchip Technology | Yes | 574 | Tray | Active | N | This product may require additional documentation to export from the United States. | IGLOO2 | 0°C ~ 85°C (TJ) | Tray | M2GL150T | 1.14V ~ 2.625V | 146124 | 5120000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A54SX16A-TQG100A | Microchip Technology | Datasheet | 1928 |
| Min: 1 Mult: 1 | Surface Mount | TQFP-100 | 100-TQFP (14x14) | A54SX16 | 90 | 227 MHz | + 125 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 81 I/O | Tray | Active | Details | 2.75 V | 2.25 V | Actel | 0.023175 oz | -40°C ~ 125°C (TA) | Tray | A54SX16A | 2.25V ~ 5.25V | 2.5 V | 24000 | 1452 | STD | 1.4 mm | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A54SX32-1BG329 | Microchip Technology | Datasheet | 622 | - | Min: 1 Mult: 1 | Surface Mount | BGA-329 | YES | 329-PBGA (31x31) | 329 | A54SX32 | 280 MHz | 27 | MICROSEMI CORP | A54SX32-1BG329 | 280 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 249 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA329,23X23,50 | BGA329,23X23,50 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.24 | N | No | 3.6 V | 3 V | 3.3 V | Actel | 0°C ~ 70°C (TA) | Tray | A54SX32 | e0 | TIN LEAD | CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | BOTTOM | BALL | 225 | 1.27 mm | unknown | S-PBGA-B329 | 249 | Not Qualified | 3.3 V, 5 V | 3.3,5 V | COMMERCIAL | 249 | 2880 CLBS, 32000 GATES | 2.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 48000 | 2880 | 0.8 ns | 2880 | 2880 | 32000 | 1.8 mm | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1AFS250-1FG256 | Microchip Technology | Datasheet | 1836 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | M1AFS250 | 90 | MICROSEMI CORP | M1AFS250-1FG256 | 1282.05 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 114 I/O | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Fusion | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | M1AFS250 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | OTHER | 6144 CLBS, 250000 GATES | 1.68 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 250000 | 1 | 6144 | 250000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No EP1C12F324C7 | Intel | Datasheet | 788 | - | Min: 1 Mult: 1 | Surface Mount | 324-BGA | YES | 249 | 0°C~85°C TJ | Tray | Cyclone® | e0 | Obsolete | 3 (168 Hours) | 324 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 220 | 1.5V | 1mm | 30 | EP1C12 | S-PBGA-B324 | 249 | Not Qualified | 1.51.5/3.3V | 320MHz | 249 | FIELD PROGRAMMABLE GATE ARRAY | 12060 | 239616 | 1206 | 2.2mm | 19mm | 19mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XC2V3000-6FFG1152C | Xilinx Inc. | Datasheet | 20 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 1152-BBGA, FCBGA | 1152 | 720 | 0°C~85°C TJ | Tray | 2007 | Virtex®-II | yes | Obsolete | 4 (72 Hours) | EAR99 | 8542.39.00.01 | 1.425V~1.575V | XC2V3000 | 1.5V | 216kB | 1769472 | 3000000 | 3584 | 6 | 28672 | No | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XC2VP40-6FF1148I | Xilinx Inc. | Datasheet | 216 | - | Min: 1 Mult: 1 | 6 Weeks | Surface Mount | Surface Mount | 1148-BBGA, FCBGA | 804 | -40°C~100°C TJ | Tray | 2006 | Virtex®-II Pro | e0 | no | Obsolete | 4 (72 Hours) | 3A001.A.7.A | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 30 | XC2VP40 | S-PBGA-B1148 | 804 | Not Qualified | 1.5V | 1.51.5/3.32/2.52.5V | 432kB | 1200MHz | 804 | FIELD PROGRAMMABLE GATE ARRAY | 43632 | 3538944 | 4848 | 6 | 38784 | 0.32 ns | 3.4mm | 35mm | 35mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No EP20K160EBC356-2X | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 356-LBGA | YES | 271 | 0°C~85°C TJ | Tray | APEX-20KE® | e0 | Obsolete | 3 (168 Hours) | 356 | 3A991 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.71V~1.89V | BOTTOM | BALL | 220 | 1.8V | 1.27mm | compliant | 30 | EP20K160 | S-PBGA-B356 | 263 | Not Qualified | 1.81.8/3.3V | 160MHz | 1.93 ns | 263 | LOADABLE PLD | 6400 | 81920 | 404000 | 640 | MACROCELL | 4 | 1.63mm | 35mm | 35mm | Non-RoHS Compliant |
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M1A3PE3000-2FG324
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
606.552653
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A3P600-1FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3P1000-FG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
104.657024
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M7A3P1000-FG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3P1000-2FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M7A3P1000-FG484I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M7A3P1000-2FG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A54SX16-TQG176
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A42MX24-2TQG176
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
494.104844
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M7A3P1000-2FG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
202.371072
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A40MX04-1PLG68I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
118.470045
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M1A3P400-1FGG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M2GL150T-1FC1152
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
419.325916
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A54SX16A-TQG100A
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
295.585502
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A54SX32-1BG329
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1AFS250-1FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
150.366367
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EP1C12F324C7
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XC2V3000-6FFG1152C
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XC2VP40-6FF1148I
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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EP20K160EBC356-2X
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire