Interface - Telecom (6000)

-

-

Min: 1

Mult: 1

YES

8

RF MICRO DEVICES INC

2

85 °C

-30 °C

UNSPECIFIED

HVQCCN

2.20 X 2.20 MM, 0.45 MM HEIGHT, GREEN, QFN-8

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Transferred

Yes

3.3 V

e3

5A991.G

MATTE TIN

8517.70.00.00

QUAD

NO LEAD

260

1

0.65 mm

unknown

30

S-XQCC-N8

OTHER

0.5 mm

TELECOM CIRCUIT

2.2 mm

2.2 mm

-

-

Min: 1

Mult: 1

YES

225

APPLIED MICRO CIRCUITS CORP

70 °C

CERAMIC, METAL-SEALED COFIRED

BGA

BGA, HPGA224,18X18

HPGA224,18X18

SQUARE

GRID ARRAY

Obsolete

PGA

No

5 V

e0

TIN LEAD

8542.39.00.01

BOTTOM

BALL

1

2.54 mm

unknown

225

S-CBGA-B225

Not Qualified

COMMERCIAL

589 mA

10.4648 mm

TELECOM CIRCUIT

-5.2 V

47.244 mm

47.244 mm

-

-

Min: 1

Mult: 1

NO

16

MOTOROLA INC

85 °C

-40 °C

PLASTIC/EPOXY

DIP

DIP, DIP16,.3

DIP16,.3

RECTANGULAR

IN-LINE

Obsolete

No

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

DUAL

THROUGH-HOLE

2.54 mm

unknown

R-PDIP-T16

Not Qualified

INDUSTRIAL

TELECOM CIRCUIT

600
In Stock

-

Min: 1

Mult: 1

YES

68

CONEXANT SYSTEMS

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

QCCJ, LDCC68,1.0SQ

LDCC68,1.0SQ

SQUARE

CHIP CARRIER

Obsolete

LCC

No

5 V

e0

TIN LEAD

8542.39.00.01

QUAD

J BEND

3

1.27 mm

unknown

68

S-PQCC-J68

Not Qualified

INDUSTRIAL

80 mA

1168 Mbps

5.08 mm

FRAMER

24.23 mm

24.23 mm

2000
In Stock

-

Min: 1

Mult: 1

YES

16

RF MICRO DEVICES INC

70 °C

-10 °C

UNSPECIFIED

HVQCCN

HVQCCN,

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Transferred

3.3 V

5A991.G

8517.70.00.00

QUAD

NO LEAD

1

0.5 mm

unknown

S-XQCC-N16

COMMERCIAL

0.58 mm

TELECOM CIRCUIT

3 mm

3 mm

-

-

Min: 1

Mult: 1

YES

32

RF MICRO DEVICES INC

85 °C

-40 °C

UNSPECIFIED

LGA

LGA, LCC32,.32SQ,40

LCC32,.32SQ,40

SQUARE

GRID ARRAY

Transferred

LGA

Yes

3.6 V

Yes

5A991.G

8517.70.00.00

BOTTOM

NO LEAD

NOT SPECIFIED

1

1 mm

compliant

NOT SPECIFIED

32

S-XBGA-N32

Not Qualified

INDUSTRIAL

0.85 mA

1.2 mm

RF FRONT END CIRCUIT

8 mm

8 mm

-

-

Min: 1

Mult: 1

-

-

Min: 1

Mult: 1

YES

32

THESYS GESELLSCHAFT FUR MIKROELEKTRONIK MBH

85 °C

-40 °C

PLASTIC/EPOXY

LQFP

LQFP,

SQUARE

FLATPACK

Obsolete

QFP

8542.39.00.01

QUAD

GULL WING

1

0.8 mm

unknown

32

S-PQFP-G32

Not Qualified

INDUSTRIAL

1.6 mm

TELECOM CIRCUIT

7 mm

7 mm

4000
In Stock

-

Min: 1

Mult: 1

YES

28

TRIQUINT SEMICONDUCTOR INC

3

85 °C

-40 °C

PLASTIC/EPOXY

HQCCN

HQCCN,

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

Obsolete

QFN

Yes

5 V

e4

GOLD OVER NICKEL

8542.39.00.01

QUAD

NO LEAD

1

0.7 mm

compliant

28

S-PQCC-N28

Not Qualified

INDUSTRIAL

1.12 mm

RF AND BASEBAND CIRCUIT

6 mm

6 mm

-

-

Min: 1

Mult: 1

YES

256

BROADCOM CORP

1

PLASTIC/EPOXY

BGA

TBGA-256

GRID ARRAY

Obsolete

BGA

No

1.8 V

No

8542.39.00.01

BOTTOM

BALL

1

compliant

256

Not Qualified

ETHERNET TRANSCEIVER

-

-

Min: 1

Mult: 1

YES

256

BROADCOM CORP

PLASTIC/EPOXY

BGA

BGA,

UNSPECIFIED

GRID ARRAY

Obsolete

BGA

No

1.8 V

8542.39.00.01

BOTTOM

BALL

1

compliant

256

X-PBGA-B256

Not Qualified

TELECOM CIRCUIT

-

-

Min: 1

Mult: 1

YES

60

TEXAS INSTRUMENTS INC

70 °C

UNSPECIFIED

VQCCN

VQCCN,

SQUARE

CHIP CARRIER, VERY THIN PROFILE

Obsolete

QFN

5 V

8542.39.00.01

QUAD

NO LEAD

1

0.5 mm

unknown

60

S-XQCC-N60

COMMERCIAL

0.8 mm

TELECOM CIRCUIT

-5 V

9 mm

9 mm

-

-

Min: 1

Mult: 1

YES

10

RF MICRO DEVICES INC

85 °C

-40 °C

PLASTIC/EPOXY

BCC

BCC,

RECTANGULAR

CHIP CARRIER

Obsolete

2.85 V

8542.39.00.01

BOTTOM

BUTT

1

0.5 mm

unknown

R-PBCC-B10

INDUSTRIAL

1.195 mm

TELECOM CIRCUIT

2.5 mm

2 mm

-

-

Min: 1

Mult: 1

YES

12

TRIQUINT SEMICONDUCTOR INC

PLASTIC/EPOXY

LGA

LGA,

SQUARE

GRID ARRAY

Obsolete

LGA

e4

GOLD FLASH OVER NICKEL

8542.39.00.01

BOTTOM

NO LEAD

1

unknown

12

S-PBGA-N12

Not Qualified

2.1336 mm

TELECOM CIRCUIT

-

-

Min: 1

Mult: 1

YES

28

STMICROELECTRONICS

70 °C

-25 °C

PLASTIC/EPOXY

SOP

SOP, SOP28,.4

SOP28,.4

RECTANGULAR

SMALL OUTLINE

Obsolete

SOIC

No

e0

TIN LEAD

8542.39.00.01

DUAL

GULL WING

1

1.27 mm

not_compliant

28

R-PDSO-G28

Not Qualified

OTHER

2.65 mm

TELEPHONE MULTIFUNCTION CIRCUIT

17.9 mm

7.5 mm

-

-

Min: 1

Mult: 1

NO

28

WINBOND ELECTRONICS CORP

70 °C

PLASTIC/EPOXY

DIP

DIP28,.6

RECTANGULAR

IN-LINE

Obsolete

No

5 V

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

DUAL

THROUGH-HOLE

2.54 mm

not_compliant

R-PDIP-T28

Not Qualified

COMMERCIAL

-

-

Min: 1

Mult: 1

YES

81

NXP SEMICONDUCTORS

SOT-643-1

3

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

LFBGA,

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Obsolete

BGA

Yes

1.2 V

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

260

1

0.8 mm

unknown

30

81

S-PBGA-B81

Not Qualified

INDUSTRIAL

1.6 mm

INTERFACE CIRCUIT

9 mm

9 mm

-

-

Min: 1

Mult: 1

YES

100

INTEGRATED DEVICE TECHNOLOGY INC

85 °C

-40 °C

PLASTIC/EPOXY

HLFQFP

HLFQFP,

SQUARE

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Transferred

QFP

No

3.3 V

e0

No

TIN LEAD

8542.39.00.01

QUAD

GULL WING

1

0.5 mm

compliant

100

S-PQFP-G100

Not Qualified

INDUSTRIAL

1.4 mm

TELECOM CIRCUIT

14 mm

14 mm

-

-

Min: 1

Mult: 1

YES

16

TOKO INC

70 °C

-30 °C

PLASTIC/EPOXY

SOP

SOP,

RECTANGULAR

SMALL OUTLINE

Transferred

Yes

4 V

8542.39.00.01

DUAL

GULL WING

NOT SPECIFIED

1

1.27 mm

unknown

NOT SPECIFIED

R-PDSO-G16

Not Qualified

OTHER

1.94 mm

TELECOM CIRCUIT

9.9 mm

3.9 mm

-

-

Min: 1

Mult: 1

YES

16

ASAHI KASEI MICRODEVICES CORP

85 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP,

RECTANGULAR

SMALL OUTLINE

Obsolete

SOIC

4 V

8542.39.00.01

DUAL

GULL WING

1

1.27 mm

unknown

16

R-PDSO-G16

INDUSTRIAL

1.94 mm

TELECOM CIRCUIT

9.9 mm

3.9 mm