Interface - Telecom (6000)

-

-

Min: 1

Mult: 1

83
In Stock

-

Min: 1

Mult: 1

SILICON LABORATORIES INC

Transferred

Yes

unknown

-

-

Min: 1

Mult: 1

YES

96

RF MICRO DEVICES INC

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

VFBGA,

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Obsolete

BGA

Yes

1.8 V

e1

TIN SILVER COPPER

8542.39.00.01

BOTTOM

BALL

1

0.5 mm

compliant

96

S-PBGA-B96

Not Qualified

INDUSTRIAL

1 mm

TELECOM CIRCUIT

6 mm

6 mm

-

-

Min: 1

Mult: 1

YES

32

MELEXIS N V

85 °C

-40 °C

PLASTIC/EPOXY

QFP

QFP, QFP32,.35SQ,32

QFP32,.35SQ,32

SQUARE

FLATPACK

Obsolete

Yes

3 V

e3

Matte Tin (Sn)

8542.39.00.01

QUAD

GULL WING

0.8 mm

compliant

S-PQFP-G32

Not Qualified

INDUSTRIAL

32.7 mA

-

-

Min: 1

Mult: 1

NO

8

UNISONIC TECHNOLOGIES CO LTD

85 °C

-40 °C

PLASTIC/EPOXY

DIP

DIP8,.3

RECTANGULAR

IN-LINE

Active

8542.39.00.01

DUAL

THROUGH-HOLE

2.54 mm

compliant

R-PDIP-T8

Not Qualified

INDUSTRIAL

-

-

Min: 1

Mult: 1

NO

16

NATIONAL SEMICONDUCTOR CORP

125 °C

-25 °C

CERAMIC, GLASS-SEALED

DIP

DIP,

RECTANGULAR

IN-LINE

Obsolete

No

5 V

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

DUAL

THROUGH-HOLE

1

2.54 mm

unknown

R-GDIP-T16

Not Qualified

OTHER

6.4 mA

5.08 mm

TELECOM CIRCUIT

-5 V

19.43 mm

7.62 mm

-

-

Min: 1

Mult: 1

BROADCOM INC

,

Active

compliant

-

-

Min: 1

Mult: 1

-

-

Min: 1

Mult: 1

NO

18

HANGZHOU SILAN MICROELECTRONICS CO LTD

85 °C

-40 °C

PLASTIC/EPOXY

DIP

DIP, DIP18,.3

DIP18,.3

RECTANGULAR

IN-LINE

Contact Manufacturer

Yes

5 V

8542.39.00.01

DUAL

THROUGH-HOLE

1

2.54 mm

compliant

R-PDIP-T18

Not Qualified

INDUSTRIAL

7 mA

DTMF SIGNALING CIRCUIT

-

-

Min: 1

Mult: 1

YES

56

MICROCHIP TECHNOLOGY INC

70 °C

UNSPECIFIED

HVQCCN

VQFN-56

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Active

Yes

3.3 V

EAR99

8542.39.00.01

QUAD

NO LEAD

1

0.5 mm

compliant

S-XQCC-N56

COMMERCIAL

1 mm

TS 16949

ETHERNET SWITCH

8 mm

8 mm

-

-

Min: 1

Mult: 1

YES

36

ANALOG DEVICES INC

85 °C

-40 °C

UNSPECIFIED

HVQCCN

6 X 6 MM, LFCSP-36

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Obsolete

QFN

Yes

3.3 V

8542.39.00.01

QUAD

NO LEAD

1

0.5 mm

unknown

36

S-XQCC-N36

Not Qualified

INDUSTRIAL

1 mm

RF FRONT END CIRCUIT

6 mm

6 mm

-

-

Min: 1

Mult: 1

-

-

Min: 1

Mult: 1

YES

28

RF MICRO DEVICES INC

70 °C

-30 °C

UNSPECIFIED

HBCC

HBCC,

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG

Transferred

LGA

3.6 V

5A991.G

8517.62.00.50

BOTTOM

BUTT

1

unknown

28

R-XBCC-B28

OTHER

1.215 mm

TELECOM CIRCUIT

5.5 mm

5 mm

-

-

Min: 1

Mult: 1

APPLIED MICRO CIRCUITS CORP

,

Obsolete

compliant

-

-

Min: 1

Mult: 1

YES

44

HITACHI LTD

70 °C

PLASTIC/EPOXY

QFI

QFI, QFI45,.5X.6

QFI45,.5X.6

RECTANGULAR

FLATPACK

Transferred

QFI

No

5 V

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

QUAD

BUTT

1

1.016 mm

unknown

44

R-PQFP-B44

Not Qualified

COMMERCIAL

13.4 mA

2.92 mm

SLIC

-5 V

CONSTANT CURRENT

2-4 CONVERSION

-24 V

14.42 mm

11.88 mm

8397
In Stock

-

Min: 1

Mult: 1

YES

8

±0.5pF

GCQ

0201

0603

0.03 g

NXP SEMICONDUCTORS

MLCC

SMD

150 °C

-40 °C

PLASTIC/EPOXY

SOP

3.90 MM, PLASTIC, MS-012, SOT96-1, SOP-8

SOP8,.25

RECTANGULAR

SMALL OUTLINE

Not Recommended

SOIC

Yes

5 V

ceramic

-55...125°C

e4

Yes

NICKEL PALLADIUM GOLD SILVER

8542.39.00.01

9.3pF

DUAL

GULL WING

260

1

1.27 mm

compliant

30

8

R-PDSO-G8

Not Qualified

C0G (NP0)

AUTOMOTIVE

70 mA

5000000 Mbps

1.75 mm

AEC-Q100

CAN FD TRANSCEIVER

1

1

50V

4.9 mm

3.9 mm

-

-

Min: 1

Mult: 1

1500 (50 Hz, 1 min.) V

5.20

TEMPO SEMICONDUCTOR INC

6 mm (1/4 IN)

3 (6) Amin

2/ 1 (2P)

≥10000

,

Contact Manufacturer

ON-OFF, SPST

37*27.5*26.5/5000

8542.39.00.01

35.6 mm

unknown

≤20 mOhm

≥1000 (at U_isp.dc=500 V) MOhm

-25…+85 °C

250 (125) V

PCM CODEC

13.2 mm

7.9 mm

-

-

Min: 1

Mult: 1

YES

contact - tinned copper; sleeves - blue plastic

44

1.90

TEMIC SEMICONDUCTORS

75 °C

-25 °C

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

Transferred

for crimping paired multicore copper conductors of the same cross section

5 V

61*42*20/5000

Insulated double pin sleeve terminal series DTE

DUAL

GULL WING

1

contact - 14 mm

unknown

R-PDSO-G44

Not Qualified

COMMERCIAL EXTENDED

TELEPHONE MULTIFUNCTION CIRCUIT

2x16 mm2

outer cable terminal. inner - 8.7/ 8.3 mm

-

-

Min: 1

Mult: 1

YES

390 g

44

2500 (50 Hz / 1 min.) V

350.50

LEVEL ONE

~440 V

-30…+75 °C

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

QCCJ,

SQUARE

CHIP CARRIER

Transferred

LCC

5 V

43*24.5*24.5/20

3-phase solid state relay series 3SSR

8542.39.00.01

QUAD

J BEND

1

105 mm

unknown

44

S-PQCC-J44

Not Qualified

INDUSTRIAL

1000 (at Uisol.dc=500 V) MOhm min

5 (~100 V); 10 (~200 V) mA

Z - with zero crossing control

DIGITAL SLIC

40 A

40 mA max

4...16 (DC) V

10 ms max

33 mm

74 mm

-

-

Min: 1

Mult: 1

NO

0.65 g

14

200 times

900 V

0.61

MOTOROLA SEMICONDUCTOR PRODUCTS

125 °C

-55 °C

CERAMIC

DIP

DIP, DIP14,.3

DIP14,.3

RECTANGULAR

IN-LINE

Obsolete

No

53*35*158/2000

± 10 %

e0

trimmer resistor

500 kOhm

Tin/Lead (Sn/Pb)

DUAL

THROUGH-HOLE

2.54 mm

7.2 (case) mm

unknown

R-XDIP-T14

Not Qualified

12,-8 V

MILITARY

≥1000 (at Uisolation.dc=500 V) V

-55…+125 °C

240 °

maximum dissipation - 0.5 W

5.2 (case) mm

7 mm