The category is 'Memory - Modules'
Memory - Modules (5402)
- All Manufacturers
- Reach Compliance Code
- Ihs Manufacturer
- Part Life Cycle Code
- Organization
- Terminal Position
- Memory IC Type
- Memory Width
- Terminal Form
- Memory Density
- Surface Mount
- JESD-30 Code
- ECCN Code
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Ihs Manufacturer | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Endurance | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Boot Block | Common Flash Interface | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No TC58C128AFTI | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 111 ns | TOSHIBA CORP | 16777216 words | 16000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP48,.8,20 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | EAR99 | 8542.32.00.51 | DUAL | GULL WING | 0.5 mm | unknown | R-PDSO-G48 | Not Qualified | INDUSTRIAL | 0.045 mA | 16MX8 | 8 | 0.000006 A | 134217728 bit | PARALLEL | FLASH | NO | NO | NO | 1K | 16K | 512 words | YES | |||||||||||||||||||||||||||
| Mfr Part No HY27UG082G2M-TCB | SK Hynix Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 30 ns | SK HYNIX INC | 268435456 words | 256000000 | 70 °C | PLASTIC/EPOXY | TSOP1 | TSOP1, TSSOP48,.8,20 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP1 | No | 3.3 V | e0 | EAR99 | SLC NAND TYPE | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | unknown | 48 | R-PDSO-G48 | Not Qualified | 3.6 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 0.03 mA | 256MX8 | 1.2 mm | 8 | 0.0001 A | 2147483648 bit | PARALLEL | FLASH | 3.3 V | NO | NO | YES | 2K | 128K | 2K words | YES | 18.4 mm | 12 mm | |||||||||||||
| Mfr Part No CAT28F002T-12T | Catalyst Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 40 | 120 ns | CATALYST SEMICONDUCTOR INC | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP40,.8,20 | TSSOP40,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | No | 5 V | e0 | EAR99 | NOR TYPE | Tin/Lead (Sn/Pb) | 8542.32.00.51 | DUAL | GULL WING | 0.5 mm | unknown | R-PDSO-G40 | Not Qualified | COMMERCIAL | 0.055 mA | 256KX8 | 8 | 0.000001 A | 2097152 bit | PARALLEL | FLASH | 100000 Write/Erase Cycles | NO | NO | YES | 1,2,1,1 | 16K,8K,96K,128K | TOP | |||||||||||||||||||||||
| Mfr Part No S29GL064M10TAIR2 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 100 ns | SPANSION INC | 3 | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | No | 3.3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | 260 | 0.5 mm | not_compliant | R-PDSO-G56 | Not Qualified | INDUSTRIAL | 0.06 mA | 4MX16 | 16 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 128 | 64K | 4/8 words | YES | YES | |||||||||||||||||||
| Mfr Part No THGBMTG5D1LBAIL_TRAY | KIOXIA | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No M29W800DB70ZA6T | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | STMICROELECTRONICS | 524288 words | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | 6 X 9 MM, 0.80 MM PITCH, TFBGA-48 | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | No | 3 V | e0 | EAR99 | NOR TYPE | Tin/Lead (Sn63Pb37) | BOTTOM BOOT BLOCK | 8542.32.00.51 | BOTTOM | BALL | 1 | 0.8 mm | not_compliant | 48 | R-PBGA-B48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.02 mA | 512KX16 | 1.2 mm | 16 | 0.0001 A | 8388608 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 1,2,1,15 | 16K,8K,32K,64K | YES | BOTTOM | YES | 9 mm | 6 mm | |||||||||
| Mfr Part No S29GL128N11TAIV10 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 110 ns | SPANSION INC | 3 | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | MO-142EC, TSOP-56 | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSOP1 | No | 3 V | e0 | No | 3A991.B.1.A | NOR TYPE | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | not_compliant | 56 | R-PDSO-G56 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.09 mA | 8MX16 | 1.2 mm | 16 | 0.000005 A | 134217728 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 128 | 128K | 8/16 words | YES | YES | 18.4 mm | 14 mm | |||||||
| Mfr Part No S29GL128N11TAIV10 | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 110 ns | CYPRESS SEMICONDUCTOR CORP | 3 | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | MO-142EC, TSOP-56 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | No | 3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | compliant | R-PDSO-G56 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.09 mA | 8MX16 | 1.2 mm | 16 | 134217728 bit | PARALLEL | FLASH | 3 V | 8 | 18.4 mm | 14 mm | |||||||||||||||||||||
| Mfr Part No S29GL128N11TAIV10 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 110 ns | ADVANCED MICRO DEVICES INC | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | No | e0 | EAR99 | NOR TYPE | Tin/Lead (Sn/Pb) | 8542.32.00.51 | DUAL | GULL WING | 0.5 mm | unknown | R-PDSO-G56 | Not Qualified | INDUSTRIAL | 0.09 mA | 8MX16 | 16 | 0.000005 A | 134217728 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 128 | 128K | 8/16 words | YES | YES | ||||||||||||||||||||||
| Mfr Part No M5M27C102FP | Mitsubishi Electric | Datasheet | - | - | Min: 1 Mult: 1 | YES | 40 | 200 ns | MITSUBISHI ELECTRIC CORP | 65536 words | 64000 | 70 °C | PLASTIC/EPOXY | SOP | SOP, SOP40,.56 | SOP40,.56 | RECTANGULAR | SMALL OUTLINE | Obsolete | No | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | GULL WING | 1.27 mm | unknown | R-PDSO-G40 | Not Qualified | COMMERCIAL | 0.05 mA | 64KX16 | 3-STATE | 16 | 0.0001 A | 1048576 bit | COMMON | |||||||||||||||||||||||||||||||
 | Mfr Part No AT27LV512R-25RI | Atmel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | 250 ns | ATMEL CORP | 2 | 65536 words | 64000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP28,.5 | SOP28,.5 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 5 V | e0 | No | EAR99 | TIN LEAD | 8542.32.00.71 | DUAL | GULL WING | 225 | 1 | 1.27 mm | compliant | 28 | R-PDSO-G28 | Not Qualified | 5.5 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.025 mA | 64KX8 | 3-STATE | 2.79 mm | 8 | 0.00002 A | 524288 bit | PARALLEL | COMMON | OTP ROM | 18.25 mm | 8.74 mm | ||||||||||||||||
 | Mfr Part No S29JL032H70TAI313 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | SPANSION INC | 3 | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | MO-142DD, TSOP-48 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSOP1 | No | 3 V | e0 | No | 3A991.B.1.A | NOR TYPE | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | not_compliant | 48 | R-PDSO-G48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.045 mA | 2MX16 | 1.2 mm | 16 | 0.00001 A | 33554432 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 8,63 | 8K,64K | YES | TOP | YES | 18.4 mm | 12 mm | |||||||
| Mfr Part No S29JL032H70TAI313 | AMD | Datasheet | 129 | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | ADVANCED MICRO DEVICES INC | 3 | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP1 | MO-142DD, TSOP-48 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Transferred | TSOP1 | No | 3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | unknown | 48 | R-PDSO-G48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.045 mA | 2MX16 | 1.2 mm | 16 | 0.00001 A | 33554432 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 8,63 | 8K,64K | YES | TOP | YES | 18.4 mm | 12 mm | |||||||||
| Mfr Part No S29JL032H70TAI313 | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | CYPRESS SEMICONDUCTOR CORP | 3 | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | MO-142DDD, TSOP-48 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | No | 3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | compliant | R-PDSO-G48 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 2MX16 | 1.2 mm | 16 | 33554432 bit | PARALLEL | FLASH | 3 V | 8 | TOP | 18.4 mm | 12 mm | |||||||||||||||||||||
| Mfr Part No S29GL064M11TAIR30 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 110 ns | ADVANCED MICRO DEVICES INC | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | No | e0 | EAR99 | NOR TYPE | Tin/Lead (Sn/Pb) | 8542.32.00.51 | DUAL | GULL WING | 0.5 mm | unknown | R-PDSO-G48 | Not Qualified | INDUSTRIAL | 0.06 mA | 4MX16 | 16 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 8,127 | 8K,64K | 4/8 words | YES | TOP | YES | |||||||||||||||||||||
| Mfr Part No SST29SF020-55-4I-NHE | Microchip Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 55 ns | MICROCHIP TECHNOLOGY INC | 262144 words | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | ROHS COMPLIANT, PLASTIC, MS-016AE, LCC-32 | RECTANGULAR | CHIP CARRIER | Obsolete | QFJ | Yes | 5 V | e3 | Yes | EAR99 | NOR TYPE | MATTE TIN | 8542.32.00.51 | QUAD | J BEND | 1 | 1.27 mm | compliant | 32 | R-PQCC-J32 | Not Qualified | 5.5 V | INDUSTRIAL | 4.5 V | ASYNCHRONOUS | 256KX8 | 3.556 mm | 8 | 2097152 bit | PARALLEL | FLASH | 5 V | 13.97 mm | 11.43 mm | |||||||||||||||||||||
| Mfr Part No SST29SF020-55-4I-NHE | Silicon Storage Technology | Datasheet | 1600 | - | Min: 1 Mult: 1 | YES | 32 | 55 ns | SILICON STORAGE TECHNOLOGY INC | 262144 words | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | ROHS COMPLIANT, PLASTIC, MS-016AE, LCC-32 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Transferred | QFJ | Yes | 5 V | e3 | EAR99 | NOR TYPE | MATTE TIN | 8542.32.00.51 | QUAD | J BEND | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | Not Qualified | 5.5 V | INDUSTRIAL | 4.5 V | ASYNCHRONOUS | 0.02 mA | 256KX8 | 3.556 mm | 8 | 0.0001 A | 2097152 bit | PARALLEL | FLASH | 5 V | YES | YES | NO | 2K | 128 | 13.97 mm | 11.43 mm | ||||||||||||||
| Mfr Part No S29GL064M11TFIR2 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | ADVANCED MICRO DEVICES INC | , | Obsolete | EAR99 | 8542.32.00.51 | unknown | FLASH | 3 V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S29GL064M11TFIR2 | Spansion | Datasheet | 12 | - | Min: 1 Mult: 1 | YES | 56 | 110 ns | SPANSION INC | 3 | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP56,.8,20 | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | Yes | 3.3 V | e3 | EAR99 | NOR TYPE | MATTE TIN | 8542.32.00.51 | DUAL | GULL WING | 260 | 0.5 mm | unknown | 40 | R-PDSO-G56 | Not Qualified | INDUSTRIAL | 0.06 mA | 4MX16 | 16 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 128 | 64K | 4/8 words | YES | YES | |||||||||||||||||
| Mfr Part No SST39VF1601C-70-4I | Microchip Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 |
-
TC58C128AFTI
Toshiba America Electronic Components
Package:Memory - Modules
Price: please inquire
-
HY27UG082G2M-TCB
SK Hynix Inc
Package:Memory - Modules
Price: please inquire
-
CAT28F002T-12T
Catalyst Semiconductor
Package:Memory - Modules
Price: please inquire
-
S29GL064M10TAIR2
Spansion
Package:Memory - Modules
Price: please inquire
-
THGBMTG5D1LBAIL_TRAY
KIOXIA
Package:Memory - Modules
Price: please inquire
-
M29W800DB70ZA6T
STMicroelectronics
Package:Memory - Modules
Price: please inquire
-
S29GL128N11TAIV10
Spansion
Package:Memory - Modules
Price: please inquire
-
S29GL128N11TAIV10
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
-
S29GL128N11TAIV10
AMD
Package:Memory - Modules
Price: please inquire
-
M5M27C102FP
Mitsubishi Electric
Package:Memory - Modules
Price: please inquire
-
AT27LV512R-25RI
Atmel Corporation
Package:Memory - Modules
Price: please inquire
-
S29JL032H70TAI313
Spansion
Package:Memory - Modules
Price: please inquire
-
S29JL032H70TAI313
AMD
Package:Memory - Modules
Price: please inquire
-
S29JL032H70TAI313
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
-
S29GL064M11TAIR30
AMD
Package:Memory - Modules
Price: please inquire
-
SST29SF020-55-4I-NHE
Microchip Technology Inc
Package:Memory - Modules
Price: please inquire
-
SST29SF020-55-4I-NHE
Silicon Storage Technology
Package:Memory - Modules
Price: please inquire
-
S29GL064M11TFIR2
AMD
Package:Memory - Modules
Price: please inquire
-
S29GL064M11TFIR2
Spansion
Package:Memory - Modules
Price: please inquire
-
SST39VF1601C-70-4I
Microchip Technology Inc
Package:Memory - Modules
Price: please inquire