The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Contact Plating | Mount | Mounting Type | Package / Case | Mounting Feature | Contact Shape | Shell Material | Supplier Device Package | Material | Insert Material | Base Product Number | Body Orientation | Contact Materials | Contact Sizes | For Use With/Related Products | I/O Voltage | Instruction Set Architecture | Lead Free Status / RoHS Status | Maximum Operating Supply Voltage | Mfr | Minimum Operating Supply Voltage | Mounting Styles | Number of CPU Cores | Number of I/Os | Package | Product Depth (mm) | Product Status | RoHS | Typical Operating Supply Voltage | Voltage-Input | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | Part Status | Moisture Sensitivity Level (MSL) | Connector Type | Type | Resistance | Number of Positions | Max Operating Temperature | Min Operating Temperature | Color | Gender | Fastening Type | Contact Type | Orientation | Shielding | Ingress Protection | Shell Finish | Pin Count | Shell Size - Insert | Termination Style | Number of Contacts | Housing Color | Output Type | Operating Supply Voltage | Circuit | Note | Interface | Number of Ports | Speed | RAM Size | Shell Size, MIL | Core Processor | Peripherals | Connectivity | Architecture | Data Bus Width | Includes | Voltage - Load | Speed Grade | Load Current | Primary Attributes | Flash Size | Features | Product Length (mm) | Product Height (mm) | Material Flammability Rating | Radiation Hardening |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No XCVE1752-1LSENSVG1369 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD | 500 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1302-2LSEVFVC1596 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | AMD | 532 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ Prime | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1802-1MSIVIVA1596 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | AMD | 500 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1902-2MLIVSVD1760 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Gold | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | Straight | Brass | AMD | Panel | 692 | Tray | 58(mm) | Active | -40°C ~ 100°C (TJ) | Versal™ AI Core | M/F | 9/4(POS) | 1(Port) | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | 32.8(mm) | 16(mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU3CG-L1UBVA530I | AMD | Datasheet | 2324 |
| Min: 1 Mult: 1 | 530-WFBGA, FCBGA | 530-FCBGA (16x9.5) | AMD | 82 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU1CG-2SBVA484E | AMD | Datasheet | 2366 | - | Min: 1 Mult: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | AMD | - | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ | CAN/Serial I2C/SPI/U | 533MHz, 1.333GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | MPU, FPGA | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1702-1LSENSVG1369 | AMD | Datasheet | 600 | - | Min: 1 Mult: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD | 500 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1802-2MSIVSVA2197 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 770 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No QLS1046MN1T144AFN3 | Teledyne LeCroy | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1902-2MLEVSVD1760 | AMD | Datasheet | 783 |
| Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 692 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU2EG-1UBVA530E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 530-WFBGA, FCBGA | 530-FCBGA (16x9.5) | AMD | 82 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1902-2MLEVIVA1596 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | AMD | 500 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU42DR-2FSVE1156E | AMD | Datasheet | 613 |
| Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | 366 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 489K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No UPD60802F1-A11-BND-E2-A | Renesas | Datasheet | 1600 |
| Min: 1 Mult: 1 | Panel Mount | Bulkhead - Front Side Nut | Circular | Aluminum Alloy | Plastic | 22D | -- | Renesas Electronics America Inc | Bulk | Active | -65°C ~ 200°C | Bulk | MIL-DTL-38999 Series III, DTS | Active | -- | Receptacle Housing | For Male Pins | 128 | Threaded | Crimp | D | Shielded | Environment Resistant | Electroless Nickel | 25-35 | Silver | Contacts Not Included | -- | -- | -- | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z045-3FBG676E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 676-BBGA, FCBGA | 676-FCBGA (27x27) | Plastic, ABS/PC Blend | XC7Z045 | DMB-4774 | 1.2, 3.3 V | Thumb-2 | -- | AMD | 2 | 130 | Tray | Active | 0 to 100 °C | DMB | -- | Active | Cover, Lid | Clear | 676 | 5.25, 4.75, 5 V | 1GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32 Bit | Kintex™-7 FPGA, 350K Logic Cells | - | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU9CG-1FFVC900I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | DIN Rail | Module | -- | XCZU9 | 0.892 V | AMD | 0.808 V | 204 | Tray | Active | 0.8500 V | 18 ~ 36VAC | -40 to 100 °C | Bulk | DR | Active | Screw Terminal | AC | SPST-NO (1 Form A) | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 24V ~ 280V | 1 | 3A | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1402-1MSINSVF1369 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 1369-BFBGA | 1369-BGA (35x35) | AMD | 424 | Tray | Active | Non-Compliant | -40°C ~ 100°C (TJ) | Tape & Reel | Versal™ Prime | 20 % | 1 kΩ | 125 °C | -55 °C | 600MHz, 1.3GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1402-1MSIVSVD1760 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 726 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU1CG-1SBVA484E | AMD | Datasheet | 1843 |
| Min: 1 Mult: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | AMD | - | Tray | Active | Non-Compliant | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ | CAN/Serial I2C/SPI/U | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | MPU, FPGA | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU1CG-1SFVA625I | AMD | Datasheet | 1808 | - | Min: 1 Mult: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | AMD | - | Tray | Active | Non-Compliant | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | CAN/Serial I2C/SPI/U | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | MPU, FPGA | - | - |
-
XCVE1752-1LSENSVG1369
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1302-2LSEVFVC1596
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1802-1MSIVIVA1596
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1902-2MLIVSVD1760
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU3CG-L1UBVA530I
AMD
Package:Embedded - System On Chip (SoC)
526.798544
-
XCZU1CG-2SBVA484E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1702-1LSENSVG1369
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1802-2MSIVSVA2197
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
QLS1046MN1T144AFN3
Teledyne LeCroy
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1902-2MLEVSVD1760
AMD
Package:Embedded - System On Chip (SoC)
30,482.005029
-
XCZU2EG-1UBVA530E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1902-2MLEVIVA1596
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU42DR-2FSVE1156E
AMD
Package:Embedded - System On Chip (SoC)
13,122.303099
-
UPD60802F1-A11-BND-E2-A
Renesas
Package:Embedded - System On Chip (SoC)
13.329468
-
XC7Z045-3FBG676E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU9CG-1FFVC900I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1402-1MSINSVF1369
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1402-1MSIVSVD1760
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU1CG-1SBVA484E
AMD
Package:Embedded - System On Chip (SoC)
243.311237
-
XCZU1CG-1SFVA625I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire