The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mounting Type | Package / Case | Mounting Feature | Shell Material | Supplier Device Package | Dielectric Material | Base Product Number | Contact Finish Mating | Data RAM Size | Device Logic Units | For Use With/Related Products | I/O Voltage | Instruction Set Architecture | JTAG Support | L1 Cache Data Memory | L1 Cache Instruction Memory | Maximum Clock Frequency | Maximum Number of User I/Os | Maximum Operating Supply Voltage | Mfr | Minimum Operating Supply Voltage | Mounting Styles | Number of CPU Cores | Number of I/Os | Number of Logic Elements | Package | Primary Material | Product Status | RoHS | Supplier Package | Typical Operating Supply Voltage | Voltage Rating AC | Voltage Rating DC | Voltage, Rating | Operating Temperature | Series | Size / Dimension | Tolerance | Part Status | Termination | Connector Type | Type | Number of Positions | Color | Applications | Capacitance | Fastening Type | Current Rating (Amps) | Voltage - Supply | Orientation | Shielding | Ingress Protection | Shell Finish | Pin Count | Shell Size - Insert | Output Type | Operating Supply Voltage | Lead Spacing | Interface | Speed | RAM Size | Shell Size, MIL | Accessory Type | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Data Bus Width | Wavelength | Screening Level | Speed Grade | Primary Attributes | Number of Registers | Number of Cores | Flash Size | Proximity Detection | Features | Height Seated (Max) | Contact Finish Thickness - Mating | Ratings |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No XCZU6CG-2FFVC900I | AMD | Datasheet | 480 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU6 | 0.892 V | AMD | 0.808 V | 204 | Tray | Active | 0.8500 V | -40 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU6EG-L1FFVC900I | AMD | Datasheet | 496 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU6 | 0.892 V | AMD | 0.808 V | 204 | Tray | Active | 0.8500 V | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1L | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z012S-1CLG485C | AMD | Datasheet | 2258 |
| Min: 1 Mult: 1 | 485-LFBGA, CSPBGA | 485-CSPBGA (19x19) | XC7Z012 | 55000 | 1.8 V | RISC | Yes | 150 | 1.05 V | AMD | 0.95 V | 1 | 150 | Tray | Active | CSBGA | 1.0000 V | 0 to 85 °C | Zynq®-7000 | 485 | 2.3, 4.9 V | JTAG | 667MHz | 256 KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32 Bit | 1 | Artix™-7 FPGA, 55K Logic Cells | 68800 | - | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050T-FGG484I | Microchip | Datasheet | 1772 | - | Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S050 | 64 kB | - | - | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | SMD/SMT | 267 | 56340 LE | Tray | Active | 1.2000 V | -40 to 100 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 50K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU11EG-L2FFVC1156E | AMD | Datasheet | 479 |
| Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | XCZU11 | AMD | 360 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025T-FG484I | Microchip | Datasheet | 1617 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 484-BGA | 484-FPBGA (23x23) | M2S025 | 1.26 V | Microchip Technology | 1.14 V | 267 | Tray | Active | Non-Compliant | 1.2000 V | -40 to 100 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 25K Logic Modules | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU9EG-L1FFVC900I | AMD | Datasheet | 623 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU9 | AMD | 204 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU2EG-1SFVA625E | AMD | Datasheet | 35 | - | Min: 1 Mult: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | XCZU2 | 103,320 | 180 | 0.892 V | AMD | 0.808 V | 180 | Tray | Active | FCBGA | 0.8500 V | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 625 | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Extended Industrial | 1 | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | 94,464 | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU6CG-1FFVC900I | AMD | Datasheet | 672 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU6 | 0.892 V | AMD | 0.808 V | 204 | Tray | Active | 0.85 V | -40 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU6CG-2FFVB1156I | AMD | Datasheet | 404 |
| Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | XCZU6 | 0.892 V | AMD | 0.808 V | 328 | Bulk | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU15EG-1FFVC900E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU15 | 0.892 V | AMD | 0.808 V | 204 | Tray | Active | 0.8500 V | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFC023R25A1I1V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole | Radial | - | Polypropylene (PP), Metallized | Nichicon | 480 | Bulk | Active | 250V | - | -25°C ~ 85°C | EEC | 2.283 L x 1.024 W (58.00mm x 26.00mm) | -5%, +10% | PC Pins | General Purpose | 22 µF | - | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | - | 1.614 (41.00mm) | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU7EG-L1FFVF1517I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | XCZU7 | PEI-Genesis | 464 | Bulk | Active | -40°C ~ 100°C (TJ) | * | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-1FSVE1156I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Knowles Syfer | 366 | Tape & Reel (TR) | Active | -40°C ~ 100°C (TJ) | * | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU46DR-L2FSVH1760I | AMD | Datasheet | 556 |
| Min: 1 Mult: 1 | Surface Mount | 6-WDFN | 6-DFN (2x2) | ams OSRAM | 574 | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | Obsolete | -30°C ~ 70°C | - | Ambient | 2.7V ~ 3.6V | SMBus | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 640nm | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU7EV-L2FFVC1156E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Free Hanging (In-Line) | 1156-BBGA, FCBGA | - | Aluminum Alloy | 1156-FCBGA (35x35) | CA310 | Silver | ITT Cannon, LLC | 360 | Bulk | Metal | Active | 50V | -55°C ~ 125°C | MIL-DTL-5015, CA | Crimp | Plug, Male Pins | 10 | Olive Drab | Threaded | 22A | N (Normal) | - | IP65 - Dust Tight, Water Resistant | Olive Drab Cadmium | 18-19 | 533MHz, 600MHz, 1.3GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | Shrink Boot Adapter | - | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-L1FSVE1156I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | PEI-Genesis | 366 | Bulk | Active | -40°C ~ 100°C (TJ) | * | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LS1046AMN3T1A | Teledyne LeCroy | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU46DR-2FSVH1760E | AMD | Datasheet | 653 |
| Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | -- | AMD | 574 | Tray | Active | 0°C ~ 100°C (TJ) | -- | Active | 533MHz, 1.333GHz | 256KB | -- | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU5EG-3FBVB900E | AMD | Datasheet | 417 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU5 | AMD | 204 | Tray | Active | 0°C ~ 100°C (TJ) | * | Active | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3 | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - |
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XCZU6CG-2FFVC900I
AMD
Package:Embedded - System On Chip (SoC)
3,352.744742
-
XCZU6EG-L1FFVC900I
AMD
Package:Embedded - System On Chip (SoC)
3,172.857515
-
XC7Z012S-1CLG485C
AMD
Package:Embedded - System On Chip (SoC)
112.694319
-
M2S050T-FGG484I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU11EG-L2FFVC1156E
AMD
Package:Embedded - System On Chip (SoC)
5,821.503789
-
M2S025T-FG484I
Microchip
Package:Embedded - System On Chip (SoC)
167.620958
-
XCZU9EG-L1FFVC900I
AMD
Package:Embedded - System On Chip (SoC)
3,903.442446
-
XCZU2EG-1SFVA625E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU6CG-1FFVC900I
AMD
Package:Embedded - System On Chip (SoC)
2,581.108071
-
XCZU6CG-2FFVB1156I
AMD
Package:Embedded - System On Chip (SoC)
3,788.667774
-
XCZU15EG-1FFVC900E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFC023R25A1I1V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU7EG-L1FFVF1517I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU48DR-1FSVE1156I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU46DR-L2FSVH1760I
AMD
Package:Embedded - System On Chip (SoC)
41,674.753939
-
XCZU7EV-L2FFVC1156E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU48DR-L1FSVE1156I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
LS1046AMN3T1A
Teledyne LeCroy
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU46DR-2FSVH1760E
AMD
Package:Embedded - System On Chip (SoC)
27,281.099924
-
XCZU5EG-3FBVB900E
AMD
Package:Embedded - System On Chip (SoC)
3,972.092654