The category is 'Embedded - System On Chip (SoC)'
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- Package / Case
- Number of I/Os
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- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Material | Shape | Number of Terminals | 1st Connector Mounting Type | 2nd Connector Mounting Type | 1st Connector Mounting Feature | 1st Contact Gender | 2nd Connector Mounting Feature | 2nd Contact Gender | Base Product Number | Brand | Cable Types | Current - Saturation (Isat) | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Frequency-Max | Frequency-Self-Resonant | Ihs Manufacturer | Inductance Frequency-Test | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Material-Core | Maximum Clock Frequency | Mfr | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Overall Impedance | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Voltage Rated | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | Part Status | Number of Terminations | Termination | Temperature Coefficient | Type | Resistance | Composition | Color | Applications | Power (Watts) | HTS Code | Capacitance | Subcategory | Current Rating (Amps) | Technology | Voltage - Supply | Terminal Position | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Style | Reach Compliance Code | Frequency | Frequency Stability | Output | JESD-30 Code | Function | Base Resonator | Current - Supply (Max) | Number of Outputs | Qualification Status | Failure Rate | Lead Spacing | Power Supplies | Temperature Grade | Current - Supply (Disable) (Max) | Inductance | DC Resistance (DCR) | Speed | RAM Size | Lead Style | Core Processor | Peripherals | Program Memory Size | Spread Spectrum Bandwidth | Connectivity | Q @ Freq | Usage | Reset | Architecture | Voltage - Threshold | Number of Voltages Monitored | Reset Timeout | Number of Inputs | Seated Height-Max | Programmable Logic Type | Shelf Life | Adhesive | Storage/Refrigeration Temperature | Product Type | Shelf Life Start | Backing, Carrier | 1st Connector | 2nd Connector | Gain | Frequency Range | Outline | RF Family/Standard | Antenna Type | Absolute Pull Range (APR) | VSWR | Primary Attributes | Number of Bands | Frequency Group | Frequency (Center/Band) | Number of Logic Cells | Thermal Conductivity | Number of Cores | Return Loss | Flash Size | Features | Thermal Resistivity | Product Category | Height Seated (Max) | Length | Width | Thickness (Max) | Thickness | Height (Max) | Ratings |
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 | Mfr Part No 10AS016E4F27I3LG | ALTERA | Datasheet | 512 |
| Min: 1 Mult: 1 | 0805 (2012 Metric) | YES | 0805 | 672 | RN732A | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS016E4F27I3LG | 1.2 GHz | KOA Speer Electronics, Inc. | Yes | SMD/SMT | 240 | 20000 LAB | 160000 LE | 100 °C | -40 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | BGA, BGA672,26X26,40 | BGA672,26X26,40 | SQUARE | GRID ARRAY | 964721 | Active | Obsolete | NOT SPECIFIED | 5.47 | Non-Compliant | Yes | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -55°C ~ 155°C | Tray | RN73 | 0.079 L x 0.049 W (2.00mm x 1.25mm) | ±0.1% | Active | 2 | ±5ppm/°C | 56 kOhms | Thin Film | 0.1W, 1/10W | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B672 | 240 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 3.25 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 160K Logic Elements | 160000 | 2 Core | -- | Moisture Resistant | SoC FPGA | 0.024 (0.60mm) | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MCIMX7S3DVK08SB | NXP | Datasheet | - | - | Min: 1 Mult: 1 | C&K | Bulk | Obsolete | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CYW54591RKUBGT | Cypress | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS016E4F27E3SG | ALTERA | Datasheet | 636 |
| Min: 1 Mult: 1 | 672-BBGA, FCBGA | 672-FBGA (27x27) | Silicone, Ceramic Filled | Square | A17883 | Intel / Altera | - | 1 | 2 x 32 kB | 2 x 32 kB | Intel | 1.2 GHz | Laird Technologies - Thermal Materials | Yes | SMD/SMT | 240 | 20000 LAB | 160000 LE | Bulk | 964702 | Active | Non-Compliant | Arria 10 SoC | 0°C ~ 100°C (TJ) | Tray | Tflex™ HD80000 | Active | Gap Filler Pad, Sheet | Teal | SOC - Systems on a Chip | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | 12 Months | - | 32°F ~ 95°F (0°C ~ 35°C) | SoC FPGA | Date of Certification | - | 228.60mm x 228.60mm | FPGA - 160K Logic Elements | 6.0W/m-K | 2 Core | -- | - | SoC FPGA | 0.150 (3.81mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB012R24B2I3V | Intel | Datasheet | 726 |
| Min: 1 Mult: 1 | - | - | Intel | 768 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS027H3F35I2SG | ALTERA | Datasheet | 725 |
| Min: 1 Mult: 1 | FBGA-1152 | YES | 1152 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS027H3F35I2SG | 1.2 GHz | Yes | SMD/SMT | 384 | 33750 LAB | 270000 LE | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 965286 | Active | NOT SPECIFIED | 5.43 | Non-Compliant | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 384 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z030-2FBG676I | AMD | Datasheet | 2224 |
| Min: 1 Mult: 1 | 676-BBGA, FCBGA | 676-FCBGA (27x27) | XC7Z030 | AMD | 130 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq®-7000 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 125K Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA023R25A3E3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 480 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFC019R25A2E3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 480 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU47DR-L1FSVG1517I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Connector Mount | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | EXS148 | TE Connectivity Laird | 561 | Bulk | Obsolete | -40°C ~ 100°C (TJ) | EXS | MX | - | - | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | 148MHz ~ 155MHz | - | Whip, Straight | - | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | 1 | VHF (f < 300MHz) | 151MHz | - | - | - | 4.390 (111.51mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU46DR-2FSVH1760I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 1206 (3216 Metric) | 1206 | - | 100MHz | 25 MHz | Ferrite | Taiyo Yuden | 574 | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C | LK | 0.126 L x 0.063 W (3.20mm x 1.60mm) | ±20% | Multilayer | 150 mA | Shielded | 820 nH | 900mOhm Max | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 25 @ 25MHz | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | - | 0.055 (1.40mm) | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU46DR-1FFVH1760I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | D38999/24WD | Souriau-Sunbank by Eaton | 574 | Bag | Active | -40°C ~ 100°C (TJ) | * | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU47DR-1FFVE1156E | Xilinx | Datasheet | 96 | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Panel Mount | Panel Mount | Bulkhead - Front Side Nut | Female | Bulkhead - Front Side Nut | Female | Q-1T04E0 | RG-174 | 11 GHz | Amphenol Custom Cable | 366 | 50 Ohms | Bag | Active | - | - | Black | - | N-Type to TNC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | N-Type Jack | TNC Jack | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | Shielded | 18.00 (457.20mm) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU46DR-2FFVH1760E | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | 120086 | Molex | 574 | Bulk | Active | 0°C ~ 100°C (TJ) | * | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU49DR-L2FFVF1760I | Xilinx | Datasheet | 33 | - | Min: 1 Mult: 1 | Surface Mount | 6-SMD, No Lead | 1760-FCBGA (42.5x42.5) | 531AA | Skyworks Solutions Inc. | 622 | Strip | Active | -40°C ~ 85°C | Si531 | 0.276 L x 0.197 W (7.00mm x 5.00mm) | XO (Standard) | 3.3V | 250 MHz | ±50ppm | LVPECL | Enable/Disable | Crystal | 121mA | 75mA | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | - | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | 0.071 (1.80mm) | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU49DR-L2FSVF1760I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount, MLCC | 1206 (3216 Metric) | 1760-FCBGA (42.5x42.5) | Vishay Vitramon | 622 | Tape & Reel (TR) | Obsolete | 50V | -55°C ~ 150°C | GA | 0.126 L x 0.063 W (3.20mm x 1.60mm) | ±0.5pF | C0G, NP0 | Automotive | 1.2 pF | - | - | 533MHz, 1.333GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | Epoxy Mountable, High Temperature | - | 0.067 (1.70mm) | AEC-Q200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-2FSVE1156I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 0805 (2012 Metric) | 0805 | RN732A | KOA Speer Electronics, Inc. | 366 | Tape & Reel (TR) | Obsolete | -55°C ~ 155°C | RN73 | 0.079 L x 0.049 W (2.00mm x 1.25mm) | ±0.1% | 2 | ±5ppm/°C | 76.8 kOhms | Thin Film | 0.1W, 1/10W | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | Moisture Resistant | 0.024 (0.60mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-2FSVG1517E | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 10-TFSOP, 10-MSOP (0.118, 3.00mm Width) | 10-uMAX/uSOP | MAX16055 | Analog Devices Inc./Maxim Integrated | 561 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | - | Multi-Voltage Supervisor | Open Drain or Open Collector | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Active Low | MCU, FPGA | 6 Selectable Threshold Combinations | 6 | 140ms Minimum | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU49DR-2FFVF1760E | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1206 (3216 Metric) | 1206 | D55342 | Vishay Dale Thin Film | 622 | Tray | Active | -55°C ~ 150°C | Military, MIL-PRF-55342, RM1206 | 0.126 L x 0.063 W (3.20mm x 1.60mm) | ±1% | 2 | ±100ppm/°C | 178 Ohms | Thin Film | 0.25W, 1/4W | P (0.1%) | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | Military, Non-Inductive | 0.033 (0.84mm) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-L1FFVG1517I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | 090635 | Molex | 561 | Bulk | Active | -40°C ~ 100°C (TJ) | * | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - |
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10AS016E4F27I3LG
ALTERA
Package:Embedded - System On Chip (SoC)
902.234696
-
MCIMX7S3DVK08SB
NXP
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
CYW54591RKUBGT
Cypress
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
10AS016E4F27E3SG
ALTERA
Package:Embedded - System On Chip (SoC)
678.818442
-
AGFB012R24B2I3V
Intel
Package:Embedded - System On Chip (SoC)
9,654.120839
-
10AS027H3F35I2SG
ALTERA
Package:Embedded - System On Chip (SoC)
2,087.320778
-
XC7Z030-2FBG676I
AMD
Package:Embedded - System On Chip (SoC)
382.285832
-
AGFA023R25A3E3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFC019R25A2E3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU47DR-L1FSVG1517I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU46DR-2FSVH1760I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU46DR-1FFVH1760I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU47DR-1FFVE1156E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU46DR-2FFVH1760E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU49DR-L2FFVF1760I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU49DR-L2FSVF1760I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU48DR-2FSVE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU48DR-2FSVG1517E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU49DR-2FFVF1760E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU48DR-L1FFVG1517I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire