The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Brand | Capacitance - nF | Capacitance - uF | Case Code - in | Case Code - mm | Class | Data RAM Size | Duty Cycle - Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Resistor Values | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Unit Weight | Voltage Rating DC | Voltage, Rating | Operating Temperature | Packaging | Series | Tolerance | Part Status | Termination | Temperature Coefficient | Type | Resistance | HTS Code | Capacitance | Subcategory | Power Rating | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Depth | Style | Reach Compliance Code | Current Rating | Frequency | Frequency Stability | Termination Style | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Dielectric | Lead Spacing | Power Supplies | Temperature Grade | Inductance | Ripple Current | Load Capacitance | Speed | RAM Size | Core Processor | Number of Resistors | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Drive Level | Circuit Type | Seated Height-Max | Programmable Logic Type | Product Type | Operating Temperature Range | ESR | Output Format | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Product | Features | Product Category | Diameter | Height | Length | Width |
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 | Mfr Part No 10AS066N2F40E1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | YES | 1517-FCBGA (40x40) | 1517 | INTEL CORP | Intel Corporation | 10AS066N2F40E1SG | 588 | 100 °C | PLASTIC/EPOXY | BGA | 40 X 40 MM, ROHS COMPLIANT, FBGA-1517 | BGA1517,39X39,40 | SQUARE | GRID ARRAY | Obsolete | NOT SPECIFIED | 5.46 | Yes | 0.93 V | 0.87 V | 0.9 V | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | Discontinued at Digi-Key | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1517 | 588 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 588 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 660K Logic Elements | 660000 | -- | 40 mm | 40 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS066K4F35E3LG | ALTERA | Datasheet | 449 |
| Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FBGA (35x35) | 1152 | Intel / Altera | - | 24 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS066K4F35E3LG | 1.2 GHz | Yes | SMD/SMT | 396 | 82500 LAB | 660000 LE | 100 °C | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 973545 | Active | NOT SPECIFIED | 5.46 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 396 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 660K Logic Elements | 660000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MCIMX7D3DVK10SB | NXP | Datasheet | - | - | Min: 1 Mult: 1 | CTS Electronic Components | 3000 | CTS | Details | Reel | 520 | Oscillators | TCXO | Clipped Sine Wave | TCXO Oscillators | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGIB027R29B1E2VR3 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | TE Connectivity / Laird External Antennas | 1 | TE Connectivity | Intel | - | Tray | Active | 0°C ~ 100°C (TJ) | Agilex I | Antennas | Dish | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | Antennas | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA023R25A3E4X | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 5 mm x 3.2 mm | - | CTS Electronic Components | 55 % | 1000 | CTS | + 85 C | Intel | - 40 C | 480 | Tray | Active | Details | 3.46 V | 3.13 V | 0°C ~ 100°C (TJ) | Reel | 653 | Oscillators | 45 mA | 312.5 MHz | 50 PPM | SMD/SMT | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Standard Oscillators | LVDS | FPGA - 2.3M Logic Elements | - | Standard Clock Oscillators | 1.2 mm | 5 mm | 3.2 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1302-2LLEVSVD1760 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 7 mm x 5 mm | 1760-FCBGA (40x40) | CTS Electronic Components | 55 % | 1000 | CTS | + 70 C | AMD Xilinx | - 20 C | 402 | Tray | Active | Details | 2.62 V | 2.37 V | 0°C ~ 100°C (TJ) | Reel | 637 | Oscillators | 55 mA | 155.52 MHz | 25 PPM | SMD/SMT | 700 mV | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Standard Oscillators | LVPECL | Versal™ Prime FPGA, 70k Logic Cells | - | Standard Clock Oscillators | 2 mm | 7 mm | 5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1402-2LLEVSVD1760 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | ITT Cannon | 1 | ITT Cannon | + 110 C | AMD Xilinx | 0 C | 726 | Tray | 110704-0148 | Active | 0°C ~ 100°C (TJ) | KPT | D-Sub Connectors | 700 mV | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | D-Sub Connectors - Standard Density | Versal™ Prime FPGA, 1.2M Logic Cells | - | D-Sub Standard Connectors | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1302-1LSIVSVD1760 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | TE Connectivity / Holsworthy | 0805 | 2012 | 5000 | TE Connectivity | + 155 C | AMD Xilinx | - 55 C | PCB Mount | 402 | Tray | 5-1614959-1 | Active | Details | 0.000225 oz | 100 V | -40°C ~ 100°C (TJ) | MouseReel | CPF | 0.1 % | 25 PPM / C | High Stability Thin Film Precision Resistor | 1.37 MOhms | Resistors | 100 mW (1/10 W) | Thin Film | SMD/SMT | 700 mV | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Thin Film Resistors | Versal™ Prime FPGA, 70k Logic Cells | - | Precision Resistors Thin Film SMD | - | Thin Film Resistors - SMD | 0.55 mm | 2 mm | 1.25 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1302-1LLIVSVD1760 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | Glenair | 1 | Glenair | + 110 C | AMD Xilinx | - 40 C | 402 | Tray | Active | -40°C ~ 100°C (TJ) | 928 | Power | 700 mV | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Lighting Connectors | Versal™ Prime FPGA, 70k Logic Cells | - | Lighting Connectors | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1902-1LLIVSVA2197-5098 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 110 C | - 40 C | Compliant | 40 % | SOC - Systems on a Chip | 7.5 mm | 700 mV | 5.8 µH | System-On-Modules - SOM | SoC FPGA | 7.5 mm | 9.4 mm | 6.5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU67DR-1FSVE1156IES9919 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1.6 mm x 1.2 mm | CTS Electronic Components | 3000 | CTS | + 70 C | - 20 C | Details | Reel | 416 | 15 PPM | Crystals | 50 MHz | 15 PPM | SMD/SMT | 18 pF | Crystals | 100 Ohms | Crystals | 1.6 mm | 1.2 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM2202-1MSEVSVC2197 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 0402 (1005 metric) | 8 | CTS Electronic Components | 10000 | CTS | + 125 C | - 55 C | 82 kOhms | Details | 0.000023 oz | MouseReel | 74x | 5 % | 200 PPM / C | Resistors | SMD/SMT | 800 mV | 4 | Isolated | Resistor Networks & Arrays | - 55 C to + 125 C | Arrays | Resistor Networks & Arrays | 0.4 mm | 2 mm | 1 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM2202-1LLIVSVC2197 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | HC-49/US | ABRACON | 200 | ABRACON | + 70 C | - 20 C | Through Hole | Details | Bulk | ABL | 10 PPM | Microprocessor Crystal | Crystals | 18.432 MHz | 10 PPM | Radial | 700 mV | 18 pF | 100 uW | Crystals | 40 Ohms | Crystals | - | 3.5 mm | 11.5 mm | 5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVE1752-2MLIVSVA1596 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xicon | 60 | Xicon | + 155 C | - 55 C | PCB Mount | Details | Bulk | PRM-RC | 5 % | 350 PPM / C | Cement Power Resistor | 180 Ohms | Resistors | 10 W | Wirewound | Radial | 800 mV | 5 mm | Wirewound Resistors | - 55 C to + 155 C | Power Resistors Wirewound Cement Filled Ceramic | - | Wirewound Resistors - Through Hole | 50 mm | 12.5 mm | 9 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1702-2LSEVSVA2197 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 5 mm x 3.2 mm | 2197-FCBGA (45x45) | CTS Electronic Components | 1000 | CTS | + 70 C | AMD Xilinx | - 20 C | SMD/SMT | 608 | Tray | Active | Details | 0.001764 oz | 0°C ~ 100°C (TJ) | MouseReel | 445 | 30 PPM | SMD Quartz | Crystals | 25 MHz | 20 PPM | SMD/SMT | 700 mV | 8 pF | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | 100 uW | Crystals | 40 Ohms | Versal™ AI Core FPGA, 1M Logic Cells | - | Crystals | 1.35 mm | 5 mm | 3.2 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1702-1LSIVSVG1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1.6 mm x 1.2 mm | CTS Electronic Components | 3000 | CTS | + 60 C | - 10 C | Details | Reel | 416 | 30 PPM | Crystals | 40 MHz | 50 PPM | SMD/SMT | 700 mV | 18 pF | Crystals | 100 Ohms | Crystals | 1.6 mm | 1.2 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVE2202-2LLESFVA784 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1206 (3216 metric) | Vishay / Vitramon | 1.2 nF | 0.0012 uF | 1206 | 3216 | Class 1 | 15000 | Vishay | + 125 C | - 55 C | Details | 0.000952 oz | 50 VDC | Reel | VJ W1BC Basic Comm | 10 % | Flexible (Soft) | 1200 pF | Capacitors | SMD/SMT | 700 mV | C0G (NP0) | Ceramic Capacitors | General Type MLCCs | Multilayer Ceramic Capacitors MLCC - SMD/SMT | 0.8 mm | 3.2 mm | 1.6 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVE2102-1LLISFVA784 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | TE Connectivity / Holsworthy | 0805 | 2012 | 1000 | TE Connectivity | + 155 C | - 55 C | PCB Mount | 2-1879274-3 | Details | 0.000166 oz | 150 V | MouseReel | RP73 | 0.1 % | 15 PPM / C | SMD High Power Precision Resistors | 1.37 kOhms | Resistors | 125 mW (1/8 W) | Thin Film | SMD/SMT | 700 mV | Thin Film Resistors | - 55 C to+ 155 C | Precision Resistors Thin Film SMD | - | Thin Film Resistors - SMD | 0.55 mm | 2 mm | 1.25 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVE2002-1MLISFVA784 | Xilinx | Datasheet | 1084 | - | Min: 1 Mult: 1 | Cornell Dubilier - CDE | 1 | Cornell Dubilier | + 85 C | - 40 C | Details | 250 VDC | Bulk | FAS | - 10 %, + 50 % | 220 uF | Capacitors | 800 mV | 0.5 in | 1 A | Electrolytic Capacitors | 1.05 Ohms | Aluminum Electrolytic Capacitors | Aluminum Electrolytic Capacitors - Screw Terminal | 1.375 in | 2.125 in | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1802-1MSEVFVC1760-5189 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 100 C | 0 C | SOC - Systems on a Chip | 800 mV | System-On-Modules - SOM | SoC FPGA |
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10AS066N2F40E1SG
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS066K4F35E3LG
ALTERA
Package:Embedded - System On Chip (SoC)
4,035.029075
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MCIMX7D3DVK10SB
NXP
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGIB027R29B1E2VR3
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA023R25A3E4X
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM1302-2LLEVSVD1760
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM1402-2LLEVSVD1760
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM1302-1LSIVSVD1760
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM1302-1LLIVSVD1760
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVC1902-1LLIVSVA2197-5098
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU67DR-1FSVE1156IES9919
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM2202-1MSEVSVC2197
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM2202-1LLIVSVC2197
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVE1752-2MLIVSVA1596
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVC1702-2LSEVSVA2197
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVC1702-1LSIVSVG1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVE2202-2LLESFVA784
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVE2102-1LLISFVA784
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVE2002-1MLISFVA784
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM1802-1MSEVFVC1760-5189
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire