The category is 'Embedded - System On Chip (SoC)'
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- Package / Case
- Number of I/Os
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- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Number of Pins | Contact Shape | Shell Material | Supplier Device Package | Insert Material | Number of Terminals | Approvals | Base Product Number | Brand | Contact Sizes | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Voltage | Mfr | Moisture Sensitive | Mounting | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Voltage Rated | Voltage Rating (DC) | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | JESD-609 Code | Part Status | Number of Terminations | Termination | ECCN Code | Temperature Coefficient | Connector Type | Type | Resistance | Number of Positions | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Composition | Applications | Power (Watts) | HTS Code | Capacitance | Fastening Type | Subcategory | Contact Type | Technology | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Depth | Reach Compliance Code | Current Rating | Frequency | Base Part Number | Shell Finish | Shell Size - Insert | JESD-30 Code | Number of Outputs | Qualification Status | Lead Pitch | Voltage - Input (Max) | Housing Color | Output Type | Operating Supply Voltage | ESR (Equivalent Series Resistance) | Failure Rate | Lead Spacing | Power Supplies | Temperature Grade | Note | Lead Diameter | Interface | Ripple Current | Memory Size | Life (Hours) | Speed | Output Configuration | RAM Size | Shell Size, MIL | Lead Style | Current - Output | Core Processor | Peripherals | Power Line Protection | Program Memory Size | Connectivity | Voltage - Breakdown (Min) | Control Features | Power - Peak Pulse | Current - Peak Pulse (10/1000μs) | Voltage - Output (Min/Fixed) | Voltage - Clamping (Max) @ Ipp | Number of Regulators | Data Rate | Architecture | Voltage - Reverse Standoff (Typ) | Protection Features | Current - Quiescent (Iq) | Voltage Dropout (Max) | Number of Inputs | Organization | PSRR | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Bidirectional Channels | Includes | Core Architecture | Capacitance @ Frequency | Voltage - Output (Max) | Max Frequency | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Primary Attributes | Number of CLBs | Number of Logic Cells | Number of Cores | Flash Size | Features | Nominal Input Voltage (AC) | Product Category | IP Rating | Diameter | Height Seated (Max) | Length | Width | Thickness (Max) | Material Flammability Rating | Ratings |
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 | Mfr Part No XCVM1302-1MLINBVB1024 | AMD | Datasheet | 556 |
| Min: 1 Mult: 1 | 1024-BFBGA | 1024-BGA (31x31) | AMD | 316 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS016E3F27E1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 672-BBGA, FCBGA | YES | 672-FBGA (27x27) | 672 | INTEL CORP | Brady | RAG24150 | 240 | 100 °C | PLASTIC/EPOXY | BGA | 27 X 27 MM, ROHS COMPLIANT, FBGA-672 | BGA672,26X26,40 | SQUARE | GRID ARRAY | Obsolete | NOT SPECIFIED | 5.68 | Non-Compliant | Yes | 0.93 V | 0.87 V | 0.9 V | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | Discontinued at Digi-Key | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B672 | 240 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 3.25 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 160K Logic Elements | 160000 | -- | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS027H2F35E2LG | ALTERA | Datasheet | 512 |
| Min: 1 Mult: 1 | Front Mount | FBGA-1152 | YES | 3 | 1152 | CSA, UL | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Turck | U0957-45 | 1.2 GHz | 250 VAC, 250 VDC | Yes | SMD/SMT | 384 | 33750 LAB | 270000 LE | 100 °C | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 964930 | Active | NOT SPECIFIED | 5.43 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 4 A | S-PBGA-B1152 | 384 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | SoC FPGA | IP67 | 0.2 m | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS057H4F34E3SG | ALTERA | Datasheet | 639 |
| Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | Intel / Altera | - | 24 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Johnson Controls | VS016410B-S0000 | 1.2 GHz | Yes | Panel | SMD/SMT | 492 | 71250 LAB | 570000 LE | 100 °C | JHSN_DRIV_VSD-II_OPEN | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 965308 | Active | NOT SPECIFIED | 5.45 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | 8.73 | compliant | S-PBGA-B1152 | 492 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | 320 Hz | FPGA - 570K Logic Elements | 570000 | 2 Core | -- | 480 VAC | SoC FPGA | IP21 | 35 mm | 5.67 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1502-1LLINFVB1369 | AMD | Datasheet | 736 | - | Min: 1 Mult: 1 | Surface Mount, MLCC | 0508 (1220 Metric) | KYOCERA AVX | 478 | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | Active | 25V | -55°C ~ 125°C | IDC, W | 0.050 L x 0.080 W (1.27mm x 2.03mm) | ±20% | X7R | Bypass, Decoupling | 0.047 µF | - | 400MHz, 1GHz | 256KB | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1M Logic Cells | - | Low ESL (Multi-Terminal) | - | 0.022 (0.55mm) | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB006R16A2E2V | Intel | Datasheet | 490 | - | Min: 1 Mult: 1 | Surface Mount | 4-XDFN Exposed Pad | 4-HXSON (1x1) | LD683 | NXP USA Inc. | 384 | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C | - | 5.5V | Fixed | 1.4GHz | Positive | 256KB | 300mA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Enable | 2.2V | 1 | MPU, FPGA | Over Current, Over Temperature, Soft Start | 75 µA | 0.24V @ 300mA (Typ) | 75dB (1kHz) | - | FPGA - 573K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA006R24C2E1V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 576 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU7EG-1FBVB900I | AMD | Datasheet | 435 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU7 | AMD | 204 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVP1802-2MLELSVC4072 | AMD | Datasheet | 501 |
| Min: 1 Mult: 1 | AMD | 780 | Tray | Active | 0°C ~ 100°C (TJ) | Versal® Premium | - | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB014R24C2I3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Tin | Through Hole | - | - | Intel | 744 | Tray | Active | Compliant | 200 V | -40°C ~ 100°C (TJ) | Bulk | Agilex F | 20 % | Radial | 105 °C | -40 °C | 47 µF | 7.5 mm | 4 Ω | 800 µm | 210 mA | 3000 hours | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | 16 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA027R25A1E1V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | DO-214AB, SMC | DO-214AB (SMCJ) | MDE Semiconductor Inc | 624 | Tape & Reel (TR) | Active | -55°C ~ 150°C (TJ) | 5.0SMDJ | Zener | General Purpose | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | No | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 86.7V | 5000W (5kW) | 39.7A | 126V | MPU, FPGA | 78V | 1 | - | FPGA - 2.7M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSXFC6D6F31I7NES | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 0603 (1608 Metric) | 896 | 0603 | RN731J | KOA Speer Electronics, Inc. | MCU - 181, FPGA - 288 | Tape & Reel (TR) | Obsolete | Compliant | -55°C ~ 155°C | Tray | RN73 | 0.063 L x 0.031 W (1.60mm x 0.80mm) | ±0.05% | Obsolete | 2 | ±25ppm/°C | 1.91 kOhms | 100 °C | -40 °C | Thin Film | 0.063W, 1/16W | 800 MHz | 5CSXFC6 | 1.13 V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 6 MB | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 3.125 Gbps | MCU, FPGA | 110000 | ARM | 41509 | 7 | 9 | FPGA - 110K Logic Elements | -- | Moisture Resistant | 0.022 (0.55mm) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB014R24C2E3VAA | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150TS-1FC1152M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Axial | YES | Axial | 1152 | RNC55 | MICROSEMI CORP | Microsemi Corporation | M2S150TS-1FC1152M | Vishay Dale | 574 | 125 °C | -55 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.84 | No | 1.26 V | 1.14 V | 1.2 V | -65°C ~ 175°C | Military, MIL-PRF-55182/01, RNC55 | 0.094 Dia x 0.250 L (2.39mm x 6.35mm) | ±1% | e0 | 2 | 3A001.A.2.C | ±25ppm/°C | 3.65 kOhms | Tin/Lead (Sn/Pb) | Metal Film | 0.125W, 1/8W | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B1152 | 574 | Not Qualified | S (0.001%) | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | Military, Moisture Resistant, Weldable | - | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5ASXBB3D4F31I5N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 896-BBGA, FCBGA | YES | 896-FBGA (31x31) | 896 | INTEL CORP | Intel Corporation | 5ASXBB3D4F31I5N | MCU - 208, FPGA - 250 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | End Of Life | NOT SPECIFIED | 5.28 | Yes | 1.13 V | 1.07 V | 1.1 V | -40°C ~ 100°C (TJ) | Tray | Arria V SX | e1 | Active | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 5ASXBB3 | S-PBGA-B896 | 250 | INDUSTRIAL | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 250 | 13207 CLBS | 2.7 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 350K Logic Elements | 13207 | 350000 | -- | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5ASXBB5D4F35C6N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FBGA (35x35) | 1152 | INTEL CORP | Intel Corporation | 5ASXBB5D4F35C6N | MCU - 208, FPGA - 385 | 85 °C | PLASTIC/EPOXY | BGA | FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Obsolete | NOT SPECIFIED | 5.28 | Yes | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | Arria V SX | e1 | Obsolete | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 5ASXBB5 | S-PBGA-B1152 | 385 | COMMERCIAL EXTENDED | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 385 | 17434 CLBS | 2.7 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 462K Logic Elements | 17434 | 462000 | -- | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPF050-1FG896M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Free Hanging (In-Line) | - | Circular | Aluminum | - | D38999/26WF | 20 | Amphenol Aerospace Operations | Bulk | Active | -65°C ~ 175°C | Military, MIL-DTL-38999 Series III, Tri-Start™ TV | Plug Housing | For Female Sockets | 32 | Threaded | Crimp | A | Shielded | Environment Resistant | Cadmium | 19-32 | Olive Drab | Contacts Not Included | F | - | Coupling Nut, Self Locking | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU11EG-L1FFVB1517I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | XCZU11 | Knowles Syfer | 488 | Tape & Reel (TR) | Active | -40°C ~ 100°C (TJ) | * | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LS1046AAE3T1A | Teledyne LeCroy | Datasheet | - | - | Min: 1 Mult: 1 | Glenair | Retail Package | Active | * | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No NRF5340-QKAA-AB0-R | Nordic | Datasheet | - | - | Min: 1 Mult: 1 | PEI-Genesis | Bulk | Active | * |
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XCVM1302-1MLINBVB1024
AMD
Package:Embedded - System On Chip (SoC)
4,898.134646
-
10AS016E3F27E1SG
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
10AS027H2F35E2LG
ALTERA
Package:Embedded - System On Chip (SoC)
2,432.888697
-
10AS057H4F34E3SG
ALTERA
Package:Embedded - System On Chip (SoC)
2,709.289612
-
XCVM1502-1LLINFVB1369
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFB006R16A2E2V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFA006R24C2E1V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU7EG-1FBVB900I
AMD
Package:Embedded - System On Chip (SoC)
3,076.706500
-
XCVP1802-2MLELSVC4072
AMD
Package:Embedded - System On Chip (SoC)
61,841.631936
-
AGFB014R24C2I3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFA027R25A1E1V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5CSXFC6D6F31I7NES
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFB014R24C2E3VAA
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S150TS-1FC1152M
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5ASXBB3D4F31I5N
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5ASXBB5D4F35C6N
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
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MPF050-1FG896M
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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Package:Embedded - System On Chip (SoC)
Price: please inquire
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Teledyne LeCroy
Package:Embedded - System On Chip (SoC)
Price: please inquire
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Nordic
Package:Embedded - System On Chip (SoC)
Price: please inquire