The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Housing Material | Number of Terminals | Approvals | Base Product Number | Case Size | Case Style | Connections | Data RAM Size | Display | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Mfr | Minimum Operating Supply Voltage | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Logic Elements | Number of Outlets | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Range | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Shaft Type | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Timing Range | Typical Operating Supply Voltage | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | Part Status | Termination | Terminal Finish | Applications | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Depth | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Output | Pin Count | JESD-30 Code | Function | Number of Outputs | Qualification Status | Output Voltage | Output Type | Power Supplies | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Max Frequency | Speed Grade | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Mode of Operation | Nominal Input Voltage (AC) | Input Voltage | Contacts | Bearings | IP Rating | Mating Connector | Length | Width | Lead Free |
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 | Mfr Part No 5CSXFC2C6U23I7LN | ALTERA | Datasheet | 1989 |
| Min: 1 Mult: 1 | Tray | * | Active | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU4CG-1FBVB900I | AMD | Datasheet | 779 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU4 | Cutler Hammer, Div of Eaton Co | XTAE080FS1TD5E100 | 0.892 V | AMD | 0.808 V | 204 | Tray | Active | 0.8500 V | -40 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025-1FG484I | Microchip | Datasheet | 1681 | - | Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S025 | 64 kB | - | - | Clarostat-Honeywell | 73JA500 | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | SMD/SMT | 267 | 27696 LE | Tray | Active | 1.2000 V | -40 to 100 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 25K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060T-FCSG325I | Microchip | Datasheet | 1752 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | DIN Rail,Surface | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | CSA, UL | M2S060 | MICROSEMI CORP | Syrelec, Brand of Crouzet Control | SHS1S24A | 1.26 V | Microchip Technology | 1.14 V | 3 | 200 | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 2.36 | No | Yes | 8542390000 | 1.26 V | 1.14 V | 1.2 V | 1 | 1.2000 V | -40 to 100 °C | SmartFusion®2 | e1 | 0.250 in Flat Blade | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | 40 | S-PBGA-B325 | 200 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 60K Logic Modules | 56520 | 256KB | Interval | Solid State | IP66 | 11 mm | 11 mm | Lead Free | |||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150-FCG1152 | Microchip | Datasheet | 2374 | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | M2S150 | Danaher Controls | HS350100G134C | Microchip Technology | Hollowshaft | 574 | Tray | Active | Hollow | 1.2000 V | -40 to 70 Degrees C | SmartFusion®2 | 6 ft Cable | 5~26 VDC | Differential | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 150K Logic Modules | 512KB | 5~26 VDC | Yes | IP67 | Not Included | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU17EG-2FFVC1760E | AMD | Datasheet | 559 | - | Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | XCZU17 | Miscellaneous | AMD | 512 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU7EV-3FFVF1517E | AMD | Datasheet | 669 |
| Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | XCZU7 | No Display | Siemens Building Technologies | QAA1011.AATU | 0.927 V | AMD | 0.873 V | 464 | Tray | Active | 0.9000 V | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EV | Indoor | 1 kOhm Platinum RTD | Temperature | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3 | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150T-FCS536I | Microchip | Datasheet | 1826 | - | Min: 1 Mult: 1 | 536-LFBGA, CSPBGA | YES | 536-CSPBGA (16x16) | 536 | M2S150 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S150T-FCS536I | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | 293 | 146124 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-536 | BGA536,30X30,20 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.81 | No | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | not_compliant | 536 | S-PBGA-B536 | 293 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 293 | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060TS-1VFG400T2 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 400-LFBGA | 400-VFBGA (17x17) | M2S060 | MICROSEMI CORP | Miscellaneous | IRTR68 | Microchip Technology | 3 | 207 | Tray | , | Active | Active | 40 | 5.8 | Yes | -40°C ~ 125°C (TJ) | Automotive, AEC-Q100, SmartFusion®2 | e1 | Yes | Tin/Silver/Copper (Sn/Ag/Cu) | 250 | compliant | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 60K Logic Modules | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060TS-1FGG676T2 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 676-BGA | 676-FBGA (27x27) | M2S060 | Johnson Controls | VS027431B-SM1P3 | Microchip Technology | Panel | 387 | JHSN_DRIV_VSD-II | Active | -40°C ~ 125°C (TJ) | Automotive, AEC-Q100, SmartFusion®2 | 15.3125 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 320 Hz | 1 | FPGA - 60K Logic Modules | 256KB | 480 VAC | 9.40625 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050T-VFG400 | Microchip | Datasheet | 1688 | - | Min: 1 Mult: 1 | 400-LFBGA | 400-VFBGA (17x17) | M2S050 | 2.5 | Lower Mount | 1/4 NPT | 64 kB | - | - | NOSHOK | 25-410-1500-psi/kg/cm2 | 166 MHz | Microchip Technology | SMD/SMT | 207 | 56340 LE | Tray | Active | 0-1,500 psi | 1.2000 V | 0 to 85 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 50K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU19EG-L1FFVC1760I | AMD | Datasheet | 532 |
| Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | XCZU19 | Cutler Hammer, Div of Eaton Co | MUBADP330 | AMD | 512 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU11EG-L1FFVC1760I | AMD | Datasheet | 670 |
| Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | Aluminum | XCZU11 | Grace Technologies | P-E5P1-M3RF0 | AMD | 512 | (2) GFCI | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | IP65 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU11EG-1FFVB1517I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | XCZU11 | Turck | U-91485 | 0.892 V | AMD | 0.808 V | 488 | Tray | Active | 0.8500 V | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU9EG-3FFVB1156E | AMD | Datasheet | 525 |
| Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | XCZU9 | Bridgeport Fittings Inc | 0.927 V | AMD | 0.873 V | 328 | Tray | Active | 0.9000 V | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3 | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU7CG-2FFVF1517E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | XCZU7 | Murrelektronik | M1D458FRRJ45BM-1M | AMD | 464 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU11EG-L1FFVF1517I | AMD | Datasheet | 790 | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | XCZU11 | 4 | Center Back Mount | 1/2 NPT | NOSHOK | 40-410-30-vac/bar | AMD | 464 | Tray | Active | -30 Hg-0 psi | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3F-1FG256 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | 256-FPBGA (17x17) | A2F200 | Klockner-Moeller, Div of Eaton | DIL2MKV-00(24V50/60HZ) | Microchip Technology | MCU - 25, FPGA - 66 | Tray | Active | 0°C ~ 85°C (TJ) | SmartFusion® | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z007S-2CLG400I | AMD | Datasheet | 77 |
| Min: 1 Mult: 1 | 400-LFBGA, CSPBGA | 400-CSPBGA (17x17) | XC7Z007 | 1.05 V | AMD | 0.95 V | 100 | Tray | Active | 1.0000 V | -40 to 100 °C | Zynq®-7000 | 766MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Artix™-7 FPGA, 23K Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGID019R18A1E1V | Intel | Datasheet | 723 |
| Min: 1 Mult: 1 | - | - | Intel | 480 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex I | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - |
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5CSXFC2C6U23I7LN
ALTERA
Package:Embedded - System On Chip (SoC)
227.509292
-
XCZU4CG-1FBVB900I
AMD
Package:Embedded - System On Chip (SoC)
1,705.907575
-
M2S025-1FG484I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060T-FCSG325I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S150-FCG1152
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU17EG-2FFVC1760E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU7EV-3FFVF1517E
AMD
Package:Embedded - System On Chip (SoC)
6,596.879758
-
M2S150T-FCS536I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060TS-1VFG400T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060TS-1FGG676T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050T-VFG400
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU19EG-L1FFVC1760I
AMD
Package:Embedded - System On Chip (SoC)
7,961.845752
-
XCZU11EG-L1FFVC1760I
AMD
Package:Embedded - System On Chip (SoC)
7,176.887193
-
XCZU11EG-1FFVB1517I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU9EG-3FFVB1156E
AMD
Package:Embedded - System On Chip (SoC)
6,898.088916
-
XCZU7CG-2FFVF1517E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU11EG-L1FFVF1517I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F200M3F-1FG256
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z007S-2CLG400I
AMD
Package:Embedded - System On Chip (SoC)
85.486450
-
AGID019R18A1E1V
Intel
Package:Embedded - System On Chip (SoC)
29,433.157960