The category is 'Embedded - System On Chip (SoC)'
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- Packaging
- Series
- Package / Case
- Number of I/Os
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- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Brand | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Operating Temperature | Packaging | Series | JESD-609 Code | Part Status | Terminal Finish | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Product Type | Number of Transceivers | Primary Attributes | Number of CLBs | Number of Logic Cells | Number of Cores | Flash Size | Product Category | Length | Width |
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 | Mfr Part No 10AS027H1F34E1HG | ALTERA | Datasheet | 501 |
| Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel / Altera | - | 24 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS027H1F34E1HG | 1.2 GHz | + 100 C | 0 C | Yes | SMD/SMT | 384 | 33750 LAB | 270000 LE | 964941 | Active | 5.64 | Details | Yes | Arria 10 SoC | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | SOC - Systems on a Chip | unknown | 950 mV | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | 24 Transceiver | FPGA - 270K Logic Elements | 2 Core | -- | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5ASXMB5E4F31I5N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 896-BBGA, FCBGA | YES | 896-FBGA (31x31) | 896 | INTEL CORP | Intel Corporation | 5ASXMB5E4F31I5N | MCU - 208, FPGA - 250 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | End Of Life | NOT SPECIFIED | 5.28 | Yes | 1.13 V | 1.07 V | 1.1 V | -40°C ~ 100°C (TJ) | Tray | Arria V SX | e1 | Active | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 5ASXMB5 | S-PBGA-B896 | 250 | INDUSTRIAL | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 250 | 17434 CLBS | 2.7 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 462K Logic Elements | 17434 | 462000 | -- | 31 mm | 31 mm | |||||||||||||||||||||||||||||||
| Mfr Part No 5CSXFC5D6F31C6N | ALTERA | Datasheet | 1619 |
| Min: 1 Mult: 1 | 896-BGA | YES | 896-FBGA (31x31) | 896 | INTEL CORP | Intel Corporation | 5CSXFC5D6F31C6N | MCU - 181, FPGA - 288 | 85 °C | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | NOT SPECIFIED | 5.57 | Yes | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SX | Active | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 5CSXFC5 | S-PBGA-B896 | 288 | Not Qualified | 1.1,1.2/3.3,2.5 V | OTHER | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | 2 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 85K Logic Elements | 85000 | -- | 31 mm | 31 mm | |||||||||||||||||||||||||||||||
| Mfr Part No 5CSEBA6U19A7N | ALTERA | Datasheet | 2379 |
| Min: 1 Mult: 1 | 484-FBGA | 484-UBGA (19x19) | MCU - 151, FPGA - 66 | -40°C ~ 125°C (TJ) | Tray | Automotive, AEC-Q100, Cyclone® V SE | Active | 5CSEBA6 | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 110K Logic Elements | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEBA2U23I7LN | ALTERA | Datasheet | 1855 |
| Min: 1 Mult: 1 | Tray | * | Active | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5ASXBB5D4F35C5N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | MCU - 208, FPGA - 385 | 0°C ~ 85°C (TJ) | Tray | Arria V SX | Active | 5ASXBB5 | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 462K Logic Elements | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSXFC6C6U23A7N | ALTERA | Datasheet | 2193 |
| Min: 1 Mult: 1 | 672-FBGA | 672-UBGA (23x23) | MCU - 181, FPGA - 145 | -40°C ~ 125°C (TJ) | Tray | Automotive, AEC-Q100, Cyclone® V SE | Active | 5CSXFC6 | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 110K Logic Elements | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z030-3SBG485E | AMD | Datasheet | 2066 |
| Min: 1 Mult: 1 | 484-FBGA, FCBGA | 484-FCBGA (19x19) | XC7Z030 | AMD | 130 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq®-7000 | 1GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 125K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB022R24C3E3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU9CG-L2FFVC900E | AMD | Datasheet | 492 | - | Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU9 | AMD | 204 | Bulk | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1502-1LSINFVB1369 | AMD | Datasheet | 424 |
| Min: 1 Mult: 1 | AMD | 478 | Tray | Active | Versal™ Prime | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1402-2MSINBVB1024 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1024-BFBGA | 1024-BGA (31x31) | Xilinx | 1 | Xilinx | + 110 C | AMD Xilinx | - 40 C | 424 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ Prime | SOC - Systems on a Chip | 800 mV | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | System-On-Modules - SOM | Versal™ Prime FPGA, 1.2M Logic Cells | - | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1302-1MLINBVB1024 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1024-BFBGA | 1024-BGA (31x31) | Xilinx | 1 | Xilinx | + 110 C | AMD Xilinx | - 40 C | 316 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ Prime | SOC - Systems on a Chip | 800 mV | 600MHz, 1.3GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | System-On-Modules - SOM | Versal™ Prime FPGA, 70k Logic Cells | - | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1302-1LSENBVB1024 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1024-BFBGA | 1024-BGA (31x31) | Xilinx | 1 | Xilinx | + 100 C | AMD Xilinx | 0 C | 316 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ Prime | SOC - Systems on a Chip | 700 mV | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | System-On-Modules - SOM | Versal™ Prime FPGA, 70k Logic Cells | - | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1302-1LSINBVB1024 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1024-BFBGA | 1024-BGA (31x31) | Xilinx | 1 | Xilinx | + 110 C | AMD Xilinx | - 40 C | 316 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ Prime | SOC - Systems on a Chip | 700 mV | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | System-On-Modules - SOM | Versal™ Prime FPGA, 70k Logic Cells | - | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1402-2MLINBVB1024 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1024-BFBGA | 1024-BGA (31x31) | Xilinx | 1 | Xilinx | + 110 C | AMD Xilinx | - 40 C | 424 | Active | -40°C ~ 100°C (TJ) | SOC - Systems on a Chip | 800 mV | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | System-On-Modules - SOM | Versal™ Prime FPGA, 1.2M Logic Cells | - | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1802-2LLEVFVC1760-5189 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 110 C | 0 C | SOC - Systems on a Chip | 700 mV | System-On-Modules - SOM | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFC023R25A3E4X | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 480 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU11EG-2FFVC1156I | AMD | Datasheet | 452 |
| Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | XCZU11 | AMD | 360 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGIB027R31B2I3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 720 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex I | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - |
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10AS027H1F34E1HG
ALTERA
Package:Embedded - System On Chip (SoC)
2,355.273121
-
5ASXMB5E4F31I5N
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5CSXFC5D6F31C6N
ALTERA
Package:Embedded - System On Chip (SoC)
372.294565
-
5CSEBA6U19A7N
ALTERA
Package:Embedded - System On Chip (SoC)
370.829436
-
5CSEBA2U23I7LN
ALTERA
Package:Embedded - System On Chip (SoC)
162.918184
-
5ASXBB5D4F35C5N
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5CSXFC6C6U23A7N
ALTERA
Package:Embedded - System On Chip (SoC)
513.297481
-
XC7Z030-3SBG485E
AMD
Package:Embedded - System On Chip (SoC)
439.612239
-
AGFB022R24C3E3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU9CG-L2FFVC900E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1502-1LSINFVB1369
AMD
Package:Embedded - System On Chip (SoC)
8,505.116860
-
XCVM1402-2MSINBVB1024
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1302-1MLINBVB1024
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM1302-1LSENBVB1024
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1302-1LSINBVB1024
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1402-2MLINBVB1024
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1802-2LLEVFVC1760-5189
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFC023R25A3E4X
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU11EG-2FFVC1156I
AMD
Package:Embedded - System On Chip (SoC)
5,853.601172
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AGIB027R31B2I3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire