The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Package / Case | Supplier Device Package | Base Product Number | Body Orientation | Data RAM Size | Device Logic Units | I/O Voltage | Instruction Set Architecture | Interface Type | L1 Cache Data Memory | L1 Cache Instruction Memory | Maximum Clock Frequency | Maximum Number of User I/Os | Maximum Operating Supply Voltage | Mfr | Minimum Operating Supply Voltage | Mounting | Number of CPU Cores | Number of I/Os | Number of Logic Elements | Package | Product Status | Supplier Package | Termination Method | Typical Operating Supply Voltage | Usage Level | Operating Temperature | Packaging | Series | Part Status | Gender | Pin Count | Operating Supply Voltage | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Data Bus Width | Screening Level | Speed Grade | Primary Attributes | Number of Registers | Number of Cores | Flash Size | Product Length | Device Core |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No XCVM1502-1LSEVSVA2197 | AMD | Datasheet | 638 |
| Min: 1 Mult: 1 | AMD | Tray | Active | * | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA022R24C3E3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||
| Mfr Part No 1SX065HH3F35I3XG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel | 392 | Tray | Active | -40°C ~ 100°C (TJ) | Stratix® 10 SX | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 650K Logic Elements | - | ||||||||||||||||||||||||||||||||||
| Mfr Part No AGIB022R31B3E3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 720 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex I | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||
| Mfr Part No XCVE1752-2MSIVSVA1596 | AMD | Datasheet | 584 |
| Min: 1 Mult: 1 | AMD | Tray | Active | * | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU19EG-2FFVC1760I | AMD | Datasheet | 1408 | - | Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | XCZU19 | AMD | 512 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | |||||||||||||||||||||||||||||||||
| Mfr Part No AGFA014R24C2I2V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | ||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1302-2MLINSVF1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD Xilinx | 316 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | ||||||||||||||||||||||||||||||||||
| Mfr Part No XCVE1752-2LLENSVG1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD Xilinx | 500 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ AI Core | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - | ||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z045-2FBG676CES | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 676-BBGA, FCBGA | 676-FCBGA (27x27) | XC7Z045 | AMD | 130 | Tray | Obsolete | 0°C ~ 85°C (TJ) | Zynq®-7000 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 350K Logic Cells | - | |||||||||||||||||||||||||||||||||
| Mfr Part No AGFA027R25A3E4X | Intel | Datasheet | 788 |
| Min: 1 Mult: 1 | - | - | Intel | 624 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | ||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z045-2FBG676E | AMD | Datasheet | 21 | - | Min: 1 Mult: 1 | 676-BBGA, FCBGA | 676-FCBGA (27x27) | XC7Z045 | AMD | 130 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq®-7000 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 350K Logic Cells | - | |||||||||||||||||||||||||||||||||
| Mfr Part No XCZU46DR-DIE4058 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU47DR-1FFVG1517IES9819 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | - | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | 533 MHz, 1.3 GHz | 930300 LE | XCZU47DR | - | 6 Core | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z100-1FF900I | AMD | Datasheet | 478 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XC7Z100 | Straight | 1.5, 2, 2.5 V | RISC | CAN/I2C/SPI/UART | AMD | Flange Mount | 2 | 130 | Tray | Active | FBGA | Solder | -40 to 100 °C | Zynq®-7000 | Plug | 900 | 1, 1.8 V | 667MHz | 256 KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32 Bit | Kintex™-7 FPGA, 444K Logic Cells | - | 86.1 mm | ARM Cortex A9 | |||||||||||||||||||
| Mfr Part No XA7Z010-1CLG400I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 400-LFBGA, CSPBGA | 400-CSPBGA (17x17) | 1.8, 3.3 V | RISC | CAN/GPIO/SPI/UART | AMD | Surface Mount | 1 | 130 | Tray | Active | CSBGA | -40 to 100 °C | Automotive, AEC-Q100, Zynq®-7000 XA | 400 | 1 V | 667MHz | 256 KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32 Bit | Artix™-7 FPGA, 28K Logic Cells | - | ARM Cortex A9 | ||||||||||||||||||||||||
| Mfr Part No AGIA040R39A1I2VB | Intel | Datasheet | 503 |
| Min: 1 Mult: 1 | 3948-BFBGA Exposed Pad | 3948-BGA (56x56) | 576 | -40°C ~ 100°C (TJ) | Tray | Agilex I | Active | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 4.047M Logic Elements | ||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z035-1FFG900I | AMD | Datasheet | 588 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XC7Z035 | 275,000 | 362 | 1.05 V | AMD | 0.95 V | Surface Mount | 130 | Tray | Active | FCBGA | 1.0000 V | Industrial grade | -40 to 100 °C | Zynq®-7000 | 900 | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Industrial | 1 | Kintex™-7 FPGA, 275K Logic Cells | 343,800 | - | |||||||||||||||||||||
| Mfr Part No AGFA023R31C3E3V | Intel | Datasheet | 533 |
| Min: 1 Mult: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 480 | 0°C ~ 100°C (TJ) | Tray | Agilex F | Active | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | ||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB023R31C2E3E | Intel | Datasheet | 549 |
| Min: 1 Mult: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 480 | 0°C ~ 100°C (TJ) | Tray | Agilex F | Active | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements |
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XCVM1502-1LSEVSVA2197
AMD
Package:Embedded - System On Chip (SoC)
8,489.849889
-
AGFA022R24C3E3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
1SX065HH3F35I3XG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGIB022R31B3E3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVE1752-2MSIVSVA1596
AMD
Package:Embedded - System On Chip (SoC)
24,693.017646
-
XCZU19EG-2FFVC1760I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFA014R24C2I2V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1302-2MLINSVF1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVE1752-2LLENSVG1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z045-2FBG676CES
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFA027R25A3E4X
Intel
Package:Embedded - System On Chip (SoC)
21,590.445224
-
XC7Z045-2FBG676E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU46DR-DIE4058
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU47DR-1FFVG1517IES9819
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z100-1FF900I
AMD
Package:Embedded - System On Chip (SoC)
3,649.555373
-
XA7Z010-1CLG400I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGIA040R39A1I2VB
Intel
Package:Embedded - System On Chip (SoC)
57,876.358043
-
XC7Z035-1FFG900I
AMD
Package:Embedded - System On Chip (SoC)
2,035.950054
-
AGFA023R31C3E3V
Intel
Package:Embedded - System On Chip (SoC)
12,379.989783
-
AGFB023R31C2E3E
Intel
Package:Embedded - System On Chip (SoC)
24,319.219108