The category is 'Embedded - System On Chip (SoC)'
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- Package / Case
- Number of I/Os
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- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | 1st Connector Mounting Type | 2nd Connector Mounting Type | 1st Connector Mounting Feature | 1st Contact Gender | 2nd Connector Mounting Feature | 2nd Contact Gender | Base Product Number | Cable Impedance | Cable Types | Data RAM Size | Frequency-Max | Ihs Manufacturer | Interface Type | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Mounting Styles | MSL | Number of I/Os | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | JESD-609 Code | Part Status | Number of Terminations | Temperature Coefficient | Resistance | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Composition | Color | Power (Watts) | HTS Code | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Style | Reach Compliance Code | Frequency | Base Part Number | JESD-30 Code | Function | Number of Outputs | Operating Supply Voltage | Failure Rate | Temperature Grade | Interface | Memory Size | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Data Bus Width | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | 1st Connector | 2nd Connector | Core Architecture | Max Frequency | Number of Logic Blocks (LABs) | Speed Grade | Primary Attributes | Number of CLBs | Number of Logic Cells | Flash Size | Number of Taps/Steps | Number of Independent Delays | Delay to 1st Tap | Available Total Delays | Features | Tap Increment | Device Core | Height Seated (Max) | Length | Width | Lead Free | Ratings |
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 | Mfr Part No 5CSEMA4U23C6N | ALTERA | Datasheet | 1621 |
| Min: 1 Mult: 1 | 672-FBGA | 484 | 672-UBGA (23x23) | MCU - 181, FPGA - 145 | Compliant | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | Active | 85 °C | 0 °C | 925 MHz | 5CSEMA4 | 1.1 V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 2.9 MB | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 40000 | ARM | FPGA - 40K Logic Elements | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS066N3F40I2SGES | ALTERA | Datasheet | 19 | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | YES | 1517-FCBGA (40x40) | 1517 | INTEL CORP | Intel Corporation | 10AS066N3F40I2SGES | 588 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | 5.66 | 0.93 V | 0.87 V | 0.9 V | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | Discontinued at Digi-Key | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 660K Logic Elements | -- | 40 mm | 40 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5ASXBB3D4F35I5N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FBGA (35x35) | 1152 | INTEL CORP | Intel Corporation | 5ASXBB3D4F35I5N | MCU - 208, FPGA - 385 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | End Of Life | NOT SPECIFIED | 5.28 | Yes | 1.13 V | 1.07 V | 1.1 V | -40°C ~ 100°C (TJ) | Tray | Arria V SX | e1 | Active | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 5ASXBB3 | S-PBGA-B1152 | 385 | INDUSTRIAL | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 385 | 13207 CLBS | 2.7 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 350K Logic Elements | 13207 | 350000 | -- | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU7EG-1FFVF1517I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | XCZU7 | AMD | 464 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1502-1MLINFVB1369 | AMD | Datasheet | 594 | - | Min: 1 Mult: 1 | AMD | 478 | Tray | Active | Versal™ Prime | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEMA5F31C6N | ALTERA | Datasheet | 2040 |
| Min: 1 Mult: 1 | 896-BGA | 896 | 896-FBGA (31x31) | MCU - 181, FPGA - 288 | Compliant | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | Active | 85 °C | 0 °C | 5CSEMA5 | 1.13 V | 556.3 kB | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 85000 | 800 MHz | 32075 | 6 | FPGA - 85K Logic Elements | -- | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB019R25A2I3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 480 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-1FG256M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | 256 | 256-FPBGA (17x17) | A2F500 | MICROSEMI CORP | Microsemi Corporation | A2F500M3G-1FG256M | Microchip Technology | MCU - 25, FPGA - 66 | Tray | Active | Active | 2.54 | Non-Compliant | No | -55°C ~ 125°C (TJ) | SmartFusion® | 125 °C | -55 °C | 8542.39.00.01 | unknown | 100 MHz | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1502-2MLIVSVA2197 | AMD | Datasheet | 524 |
| Min: 1 Mult: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 608 | Tray | Active | Versal™ Prime | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA022R31C2I3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 720 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGID023R18A2E1V | Intel | Datasheet | 581 |
| Min: 1 Mult: 1 | - | - | Intel | 480 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex I | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z035-2FFG900I | AMD | Datasheet | 577 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XC7Z035 | AMD | 130 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq®-7000 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 275K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB027R24C2E3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU7EG-2FBVB900I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU7 | AMD | 204 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MAX32655GXG | Analog Devices | Datasheet | 561 |
| Min: 1 Mult: 1 | 81-LFBGA | 81-CTBGA (8x8) | MAX32655 | 128 kB | GPIO, I2C, PWM, SPI, UART, USB | 100 MHz | + 105 C | Analog Devices Inc./Maxim Integrated | - 40 C | SMD/SMT | MSL 3 - 168 hours | 52 | Strip | Active | 1.89 V | 1.71 V | -40°C ~ 105°C | - | I2C, I2S, SPI, UART | 100MHz | 128KB | ARM® Cortex®-M4 | I²S, PWM, WDT | 512KB | 1-Wire, Bluetooth, I²C, SPI, UART/USART | MCU | 32bit | - | 512KB | ARM Cortex-M4F | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA023R25A1I1V | Intel | Datasheet | 571 |
| Min: 1 Mult: 1 | Surface Mount | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8-uMAX/uSOP | DS1100 | Analog Devices Inc./Maxim Integrated | 480 | Tube | Obsolete | -40°C ~ 85°C | - | 4.75V ~ 5.25V | Nonprogrammable | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | 5 | 1 | 100ns | 500ns | 100 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFC019R25A2I3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 0402 (1005 Metric) | 0402 | RN73H1E | KOA Speer Electronics, Inc. | 480 | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | Active | -55°C ~ 155°C | RN73H | 0.039 L x 0.020 W (1.00mm x 0.50mm) | ±0.5% | 2 | ±50ppm/°C | 10.1 Ohms | Metal Film | 0.063W, 1/16W | - | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | Automotive AEC-Q200, Moisture Resistant | 0.016 (0.40mm) | AEC-Q200 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB027R31C2I3V | Intel | Datasheet | 577 | - | Min: 1 Mult: 1 | - | - | Free Hanging (In-Line) | Free Hanging (In-Line) | - | Female | - | Female | UFL-2HF | 50 Ohms | 1.13mm OD Coaxial Cable | 6 GHz | Hirose Electric Co Ltd | 720 | Bulk | Active | -40°C ~ 90°C | U.FL | Gray | - | U.FL (UMCC) to U.FL (UMCC) | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | U.FL (UMCC) Plug, Right Angle | U.FL (UMCC) Plug, Right Angle | FPGA - 2.7M Logic Elements | - | - | 2.756 (70.00mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU3CG-1SFVA625E | AMD | Datasheet | 1742 | - | Min: 1 Mult: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | XCZU3 | Honeywell Sensing and Productivity Solutions | 180 | Bulk | Obsolete | 0°C ~ 100°C (TJ) | - | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU2EG-2SFVA625I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | 74AHC30 | NXP Semiconductors | 180 | Bulk | Active | -40°C ~ 100°C (TJ) | * | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - |
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5CSEMA4U23C6N
ALTERA
Package:Embedded - System On Chip (SoC)
182.181622
-
10AS066N3F40I2SGES
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5ASXBB3D4F35I5N
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU7EG-1FFVF1517I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1502-1MLINFVB1369
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5CSEMA5F31C6N
ALTERA
Package:Embedded - System On Chip (SoC)
298.083915
-
AGFB019R25A2I3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F500M3G-1FG256M
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1502-2MLIVSVA2197
AMD
Package:Embedded - System On Chip (SoC)
11,787.040308
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AGFA022R31C2I3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGID023R18A2E1V
Intel
Package:Embedded - System On Chip (SoC)
34,291.361250
-
XC7Z035-2FFG900I
AMD
Package:Embedded - System On Chip (SoC)
2,170.235968
-
AGFB027R24C2E3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU7EG-2FBVB900I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
MAX32655GXG
Analog Devices
Package:Embedded - System On Chip (SoC)
8.980569
-
AGFA023R25A1I1V
Intel
Package:Embedded - System On Chip (SoC)
24,576.083838
-
AGFC019R25A2I3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFB027R31C2I3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU3CG-1SFVA625E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU2EG-2SFVA625I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire