The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Package / Case | Surface Mount | Supplier Device Package | Material | Number of Terminals | Base Product Number | Brand | Core | Country of Origin | Data RAM Size | Distributed RAM | ECCN | Factory Pack QuantityFactory Pack Quantity | I/O Voltage | Ihs Manufacturer | Instruction Set Architecture | Interface Type | JTAG Support | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of CPU Cores | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | Part Status | ECCN Code | Terminal Finish | Applications | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Interface | Speed | RAM Size | Core Processor | Illumination | Peripherals | Program Memory Size | Connectivity | Architecture | Data Bus Width | Number of Inputs | Seated Height-Max | Programmable Logic Type | Product Type | Screening Level | Speed Grade | Number of Transceivers | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Language | Product Category | Device Core | Length | Width |
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 | Mfr Part No XCZU11EG-2FFVB1517I | AMD | Datasheet | 696 |
| Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | XCZU11 | AMD | 488 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU11EG-1FFVC1760E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | XCZU11 | AMD | 512 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005-VF256I | Microchip | Datasheet | 38 |
| Min: 1 Mult: 1 | 256-LFBGA | YES | 256-FPBGA (14x14) | 256 | M2S005 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S005-VF256I | 166 MHz | Microchip Technology | SMD/SMT | 161 | 6060 LE | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-256 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.84 | No | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B256 | 161 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 161 | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 6060 | 1 Core | 128KB | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150T-1FC1152M | Microchip | Datasheet | 774 | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | M2S150 | MICROSEMI CORP | Cully-Minerallac | NC16 | Microchip Technology | 574 | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.81 | No | 1.26 V | 1.14 V | 1.2 V | -55°C ~ 125°C (TJ) | SmartFusion®2 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B1152 | 574 | Not Qualified | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB023R25A2E3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 480 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU9CG-2FFVB1156I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | XCZU9 | AMD | 328 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU2CG-2SBVA484I | AMD | Datasheet | 1686 |
| Min: 1 Mult: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | XCZU2 | AMD | 82 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFD023R25A2E3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 480 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU49DR-2FSVF1760I | AMD | Datasheet | 785 |
| Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | 1.8/2.5/3.3 V | RISC | CAN/Serial I2C/SPI/UART/USB | Yes | AMD | Surface Mount | 6 | 622 | Tray | Active | FCBGA | Industrial grade | -40 to 100 °C | Zynq® UltraScale+™ RFSoC | 0.85 V | CAN/Serial I2C/SPI/U | 533MHz, 1.333GHz | 256 KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 64 Bit | Industrial | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ARM Cortex-A53/Arm Cortex-R5 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150-1FCVG484 | Microchip | Datasheet | 1614 |
| Min: 1 Mult: 1 | 484-BFBGA | YES | 484-FBGA (19x19) | 484 | M2S150 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S150-1FCVG484 | 166 MHz | Microchip Technology | 4 | 273 | 146124 LE | 85 °C | Tray | PLASTIC/EPOXY | FBGA | VFBGA-484 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | Active | 40 | 5.77 | Yes | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B484 | 273 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 273 | 3.15 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | 19 mm | 19 mm | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS048H1F34I1HG | ALTERA | Datasheet | 634 |
| Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel / Altera | - | 24 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS048H1F34I1HG | 1.2 GHz | + 100 C | - 40 C | Yes | SMD/SMT | 492 | 60000 LAB | 480000 LE | 965036 | Active | 5.68 | Details | Yes | This product may require additional documentation to export from the United States. | Arria 10 SoC | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | SOC - Systems on a Chip | unknown | 950 mV | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | 24 Transceiver | FPGA - 480K Logic Elements | 2 Core | -- | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060T-FCS325I | Microchip | Datasheet | 2184 | - | Min: 1 Mult: 1 | 325-TFBGA, FCBGA | 325-FCBGA (11x11) | Polystyrene | M2S060 | US | 64 kB | EAR99 | - | - | 166 MHz | Microchip Technology | 200 | 56520 LE | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion®2 | Facility Identification | 166MHz | 64KB | ARM® Cortex®-M3 | Not Illuminated | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | English | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010-1FGG484 | Microchip | Datasheet | 20 |
| Min: 1 Mult: 1 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2S010 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S010-1FGG484 | 166 MHz | Microchip Technology | 3 | SMD/SMT | 233 | 12084 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.77 | Yes | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 233 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 233 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU43DR-2FSVE1156E | AMD | Datasheet | 405 |
| Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | 366 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-1FFVG1517E | AMD | Datasheet | 642 |
| Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | 561 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU49DR-1FSVF1760I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD | 622 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU43DR-2FFVE1156E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | 366 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS250T-1FCG1152EES | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | Microchip Technology | MCU - 136, FPGA - 372 | Tray | Active | 0°C ~ 100°C | PolarFire™ | - | 2.2MB | RISC-V | DMA, PCI, PWM | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 128kB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU49DR-2FFVF1760E5051 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-1760 | ARM Cortex A53, ARM Cortex R5F | 256 kB | 13 Mb | 1 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | + 100 C | 0 C | SMD/SMT | 674 I/O | 53160 LAB | 930300 LE | 850 mV | 16 Transceiver | 6 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU28DR-L2FFVG1517I5023 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-1517 | ARM Cortex A53, ARM Cortex R5F | 256 kB | 13 Mb | 1 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | + 100 C | - 40 C | SMD/SMT | 597 I/O | 53160 LAB | 930300 LE | 720 mV | 16 Transceiver | 6 Core |
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XCZU11EG-2FFVB1517I
AMD
Package:Embedded - System On Chip (SoC)
7,167.744796
-
XCZU11EG-1FFVC1760E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005-VF256I
Microchip
Package:Embedded - System On Chip (SoC)
36.305453
-
M2S150T-1FC1152M
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFB023R25A2E3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU9CG-2FFVB1156I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU2CG-2SBVA484I
AMD
Package:Embedded - System On Chip (SoC)
444.286731
-
AGFD023R25A2E3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU49DR-2FSVF1760I
AMD
Package:Embedded - System On Chip (SoC)
32,684.182238
-
M2S150-1FCVG484
Microchip
Package:Embedded - System On Chip (SoC)
228.172952
-
10AS048H1F34I1HG
ALTERA
Package:Embedded - System On Chip (SoC)
5,317.485291
-
M2S060T-FCS325I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010-1FGG484
Microchip
Package:Embedded - System On Chip (SoC)
98.186041
-
XCZU43DR-2FSVE1156E
AMD
Package:Embedded - System On Chip (SoC)
19,629.649639
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XCZU48DR-1FFVG1517E
AMD
Package:Embedded - System On Chip (SoC)
19,809.252945
-
XCZU49DR-1FSVF1760I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU43DR-2FFVE1156E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
MPFS250T-1FCG1152EES
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU49DR-2FFVF1760E5051
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU28DR-L2FFVG1517I5023
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire