The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Base Product Number | Brand | Capacitance Tolerance | Clock Frequency-Max | Data RAM Size | Distributed RAM | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Output Frequency | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Schedule B | Shipping Restrictions | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | Part Status | ECCN Code | Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Capacitance | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Base Part Number | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Interface | Memory Size | Load Capacitance | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Core Architecture | Max Frequency | Number of Logic Blocks (LABs) | Speed Grade | Primary Attributes | Number of CLBs | Number of Logic Cells | Number of Cores | Output Level | Flash Size | Product Category | Product Length | Product Width | Length | Width | Lead Free |
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 | Mfr Part No 5CSEMA5U23C8N | ALTERA | Datasheet | 2038 |
| Min: 1 Mult: 1 | 672-FBGA | YES | 672-UBGA (23x23) | 672 | INTEL CORP | Intel Corporation | 5CSEMA5U23C8N | MCU - 181, FPGA - 145 | 85 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA672,28X28,32 | BGA672,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | NOT SPECIFIED | 5.25 | Yes | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | Active | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | 5CSEMA5 | S-PBGA-B672 | 145 | Not Qualified | 1.1,1.2/3.3,2.5 V | OTHER | 600MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 1.85 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 85K Logic Elements | 85000 | -- | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEBA5U23C8N | ALTERA | Datasheet | 2086 |
| Min: 1 Mult: 1 | 672-FBGA | YES | 672-UBGA (23x23) | 672 | INTEL CORP | Intel Corporation | 5CSEBA5U23C8N | MCU - 181, FPGA - 145 | 85 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA672,28X28,32 | BGA672,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | NOT SPECIFIED | 2 | Yes | FPGA - Field Programmable Gate Array Cyclone V SE dual -core ARM Cortex-A9 | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | e1 | Active | TIN SILVER COPPER | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | 5CSEBA5 | S-PBGA-B672 | 145 | Not Qualified | 1.1,1.2/3.3,2.5 V | OTHER | 600MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 1.85 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 85K Logic Elements | 85000 | -- | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEMA6U23C6N | ALTERA | Datasheet | 1944 |
| Min: 1 Mult: 1 | 672-FBGA | YES | 672-UBGA (23x23) | 672 | INTEL CORP | Intel Corporation | 5CSEMA6U23C6N | MCU - 181, FPGA - 145 | 85 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA672,28X28,32 | BGA672,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | NOT SPECIFIED | 5.56 | Yes | FPGA - Field Programmable Gate Array Cyclone V SE dual -core ARM Cortex-A9 | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | Active | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | 5CSEMA6 | S-PBGA-B672 | 145 | Not Qualified | 1.1,1.2/3.3,2.5 V | OTHER | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 1.85 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 110K Logic Elements | 110000 | -- | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEBA5U23I7N | ALTERA | Datasheet | 1918 | - | Min: 1 Mult: 1 | 672-FBGA | YES | 672 | 672-UBGA (23x23) | 672 | 622 MHz | INTEL CORP | Intel Corporation | 5CSEBA5U23I7N | 3 | MCU - 181, FPGA - 145 | PLASTIC/EPOXY | FBGA | FBGA, BGA672,28X28,32 | BGA672,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | NOT SPECIFIED | 1.99 | Compliant | Yes | 8542390000 | 1.13 V | 1.07 V | 1.1 V | -40°C ~ 100°C (TJ) | Tray | Cyclone® V SE | e1 | Active | 3A991 | Tin/Silver/Copper (Sn/Ag/Cu) | 100 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | 800 MHz | 5CSEBA5 | S-PBGA-B672 | 145 | Not Qualified | 1.13 V | 1.1,1.2/3.3,2.5 V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 556.3 kB | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 1.85 mm | FIELD PROGRAMMABLE GATE ARRAY | 85000 | ARM | 800 MHz | 32075 | 7 | FPGA - 85K Logic Elements | 85000 | -- | 23 mm | 23 mm | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS250T-1FCVG484T2 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | Microchip Technology | MCU - 136, FPGA - 108 | Tray | Active | -40°C ~ 125°C (TJ) | - | - | 2.2MB | RISC-V | DMA, PCI, PWM | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050-FGG896 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 896-BGA | 896-FBGA (31x31) | M2S050 | 10% | 64 kB | - | - | 166 MHz | + 85 C | Microchip Technology | 0 C | SMD/SMT | 377 | 56340 LE | Tray | Active | 1.2000 V | 0 to 85 °C | SmartFusion®2 | 1 uF | 896 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 50K Logic Modules | 1 Core | 256KB | 3.2 mm | 3.2 x 2.5 x 2.79 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025TS-1FGG484M | Microchip | Datasheet | 2071 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 484-BGA | 484-FPBGA (23x23) | M2S025 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 267 | 27696 LE | Tray | Active | Compliant | -55°C ~ 125°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050T-1FGG896 | Microchip | Datasheet | 2203 | - | Min: 1 Mult: 1 | 896-BGA | 896-FBGA (31x31) | M2S050 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 377 | 56340 LE | Tray | Active | 1.2000 V | 0 to 85 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 50K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060TS-1FG484M | Microchip | Datasheet | 1833 |
| Min: 1 Mult: 1 | BGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S060 | Microchip Technology / Atmel | 64 kB | 1314 kbit | 60 | MICROSEMI CORP | - | - | Microchip | M2S060TS-1FG484M | 166 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 267 I/O | 4710 LAB | 56520 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.84 | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | 0.326090 oz | -55°C ~ 125°C (TJ) | Tray | SmartFusion2 | e0 | Yes | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | SOC - Systems on a Chip | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | SoC FPGA | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005-FGG484 | Microchip | Datasheet | 60 |
| Min: 1 Mult: 1 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2S005 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S005-FGG484 | 166 MHz | 1.26 V | + 85 C | Microchip Technology | 1.14 V | 0 C | 3 | SMD/SMT | 209 | 6060 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 2.39 | Yes | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 85 °C | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 209 | Not Qualified | 1.2 V | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 209 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 5K Logic Modules | 6060 | 1 Core | 128KB | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050-FG484 | Microchip | Datasheet | 1625 | - | Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S050 | 64 kB | - | - | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | SMD/SMT | 267 | 56340 LE | Tray | Active | 1.2000 V | 0 to 85 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 50K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-VFG400I | Microchip | Datasheet | 9 | - | Min: 1 Mult: 1 | 400-LFBGA | 400-VFBGA (17x17) | M2S005 | 64 kB | - | - | 166 MHz | Microchip Technology | 169 | 6060 LE | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 5K Logic Modules | 1 Core | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-TQG144I | Microchip | Datasheet | 50 | - | Min: 1 Mult: 1 | TQFP-144 | 144-TQFP (20x20) | M2S005 | Microchip Technology / Atmel | 64 kB | 60 | - | - | Microchip | 166 MHz | Microchip Technology | Yes | SMD/SMT | 84 | 505 LAB | 6060 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 0.046530 oz | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | SOC - Systems on a Chip | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | SoC FPGA | FPGA - 5K Logic Modules | 1 Core | 128KB | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010-TQG144 | Microchip | Datasheet | 2146 | - | Min: 1 Mult: 1 | 144-LQFP | 144-TQFP (20x20) | M2S010 | Microchip Technology / Atmel | 64 kB | 400 kbit | 60 | - | - | Microchip | 166 MHz | + 85 C | Microchip Technology | 0 C | Yes | SMD/SMT | 84 | 1007 LAB | 12084 LE | Tray | Active | Details | 0.035380 oz | 0°C ~ 85°C (TJ) | Tray | SmartFusion®2 | SOC - Systems on a Chip | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | SoC FPGA | FPGA - 10K Logic Modules | 1 Core | 256KB | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010-TQ144I | Microchip | Datasheet | 2151 | - | Min: 1 Mult: 1 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | MICROSEMI CORP | Microsemi Corporation | M2S010-TQ144I | Microchip Technology | 3 | Surface Mount | 84 | 38.4 MHz | Tray | PLASTIC/EPOXY | LFQFP | TQFP-144 | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | Obsolete | 30 | 5.85 | No | SMD | 1.26 V | 1.14 V | 1.2 V | -40 to 85 °C | SmartFusion®2 | e0 | Temperature Compensated Crystal Oscillator (TCXO) | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | QUAD | GULL WING | 240 | 0.5 mm | not_compliant | 4 | S-PQFP-G144 | 84 | Not Qualified | 1.2 V | 10 pF | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 84 | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | Clipped Sinewave | 256KB | 20 mm | 20 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5ASXMB3E4F31I3N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 896-BBGA, FCBGA | YES | 896-FBGA (31x31) | 896 | INTEL CORP | Intel Corporation | 5ASXMB3E4F31I3N | MCU - 208, FPGA - 250 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | End Of Life | NOT SPECIFIED | 5.28 | Compliant | Yes | 1.18 V | 1.12 V | 1.15 V | -40°C ~ 100°C (TJ) | Tray | Arria V SX | e1 | Active | Tin/Silver/Copper (Sn/Ag/Cu) | 100 °C | -40 °C | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 800 MHz | 5ASXMB3 | S-PBGA-B896 | 540 | INDUSTRIAL | EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 540 | 13207 CLBS | 2.7 mm | FIELD PROGRAMMABLE GATE ARRAY | ARM | FPGA - 350K Logic Elements | 13207 | 350000 | -- | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5ASXBB5D4F35I5N | ALTERA | Datasheet | 8 | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FBGA (35x35) | 1152 | INTEL CORP | Intel Corporation | 5ASXBB5D4F35I5N | MCU - 208, FPGA - 385 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | End Of Life | NOT SPECIFIED | 5.27 | Yes | 1.13 V | 1.07 V | 1.1 V | -40°C ~ 100°C (TJ) | Tray | Arria V SX | e1 | Active | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 5ASXBB5 | S-PBGA-B1152 | 385 | INDUSTRIAL | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 385 | 17434 CLBS | 2.7 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 462K Logic Elements | 17434 | 462000 | -- | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060T-1VFG400I | Microchip | Datasheet | 2057 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 400-LFBGA | YES | 400 | 400-VFBGA (17x17) | 400 | M2S060 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S060T-1VFG400I | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | 3 | 207 | 56520 LE | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.81 | Compliant | Yes | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 100 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B400 | 207 | Not Qualified | 1.2 V | 1.2 V | 166MHz | 164.3 kB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA014R24B2E4F | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | 121010 | Molex | 768 | Bulk | Active | 0°C ~ 100°C (TJ) | * | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS016E3F29E2SG | ALTERA | Datasheet | 680 |
| Min: 1 Mult: 1 | 780-BBGA, FCBGA | YES | 780-FBGA (29x29) | 780 | INTEL CORP | Intel Corporation | 10AS016E3F29E2SG | 288 | 100 °C | PLASTIC/EPOXY | BGA | BGA, BGA780,28X28,40 | BGA780,28X28,40 | SQUARE | GRID ARRAY | Active | NOT SPECIFIED | 1.97 | Non-Compliant | Yes | 0.93 V | 0.87 V | 0.9 V | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B780 | 288 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | 3.35 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 160K Logic Elements | 160000 | -- | 29 mm | 29 mm |
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5CSEMA5U23C8N
ALTERA
Package:Embedded - System On Chip (SoC)
199.277048
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5CSEBA5U23C8N
ALTERA
Package:Embedded - System On Chip (SoC)
191.568787
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5CSEMA6U23C6N
ALTERA
Package:Embedded - System On Chip (SoC)
400.703179
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5CSEBA5U23I7N
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
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MPFS250T-1FCVG484T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050-FGG896
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025TS-1FGG484M
Microchip
Package:Embedded - System On Chip (SoC)
331.211791
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M2S050T-1FGG896
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S060TS-1FG484M
Microchip
Package:Embedded - System On Chip (SoC)
363.010354
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M2S005-FGG484
Microchip
Package:Embedded - System On Chip (SoC)
23.437201
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M2S050-FG484
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S005S-VFG400I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S005S-TQG144I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010-TQG144
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010-TQ144I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5ASXMB3E4F31I3N
ALTERA
Package:Embedded - System On Chip (SoC)
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5ASXBB5D4F35I5N
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M2S060T-1VFG400I
Microchip
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AGFA014R24B2E4F
Intel
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10AS016E3F29E2SG
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Package:Embedded - System On Chip (SoC)
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