The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Core | Data RAM Size | Distributed RAM | Embedded Block RAM - EBR | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Instruction Set Architecture | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Processing Unit | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Type | Terminal Finish | Additional Feature | HTS Code | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | JESD-30 Code | Function | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Speed | RAM Size | Core Processor | Peripherals | Program Memory Type | Program Memory Size | Connectivity | Architecture | Data Bus Width | Number of Inputs | Seated Height-Max | Programmable Logic Type | Speed Grade | Number of Transceivers | RF Type | Primary Attributes | Secondary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Device Core | Length | Width |
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 | Mfr Part No M2S050-1FCS325 | Microchip Technology | Datasheet | 1761 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | FCBGA-325 | YES | 325-FCBGA (11x11) | 325 | M2S050 | ARM Cortex M3 | 64 kB | 176 | MICROSEMI CORP | - | - | M2S050-1FCS325 | 166 MHz | Microchip Technology | Yes | SMD/SMT | 200 | 4695 LAB | 56340 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.81 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | S-PBGA-B325 | 200 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 11 mm | 11 mm | ||||||||||||||||||||||||||
| Mfr Part No M2S025T-VFG256 | Microchip Technology | Datasheet | 2357 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 256-LFBGA | YES | 256-FPBGA (14x14) | 256 | M2S025 | ARM Cortex M3 | 64 kB | 119 | MICROSEMI CORP | - | - | M2S025T-VFG256 | 166 MHz | + 85 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 138 I/O | 2308 LAB | 27696 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-256 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.77 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B256 | 138 | Not Qualified | 1.2 V | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Modules | 27696 | 1 Core | 256KB | 14 mm | 14 mm | |||||||||||||||||||||||
| Mfr Part No M2S025-1FGG484I | Microchip Technology | Datasheet | 1830 |
| Min: 1 Mult: 1 | FPBGA-484 | 484-FPBGA (23x23) | M2S025 | ARM Cortex M3 | 64 kB | 60 | - | - | 166 MHz | Microchip Technology | Yes | SMD/SMT | 267 | 2308 LAB | 27696 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 25K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025TS-1FCSG325 | Microchip Technology | Datasheet | 1921 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | FCBGA-325 | 325-FCBGA (11x11) | M2S025 | ARM Cortex M3 | 64 kB | 176 | - | - | 166 MHz | Microchip Technology | Yes | SMD/SMT | 180 | 2308 LAB | 27696 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025TS-1VF256 | Microchip Technology | Datasheet | 1893 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | VFPBGA-256 | 256-FPBGA (14x14) | M2S025 | ARM Cortex M3 | 64 kB | 119 | - | - | 166 MHz | Microchip Technology | Yes | SMD/SMT | 138 | 2308 LAB | 27696 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-1FG484 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S005 | ARM Cortex M3 | 64 kB | 60 | MICROSEMI CORP | - | - | M2S005S-1FG484 | 166 MHz | Microchip Technology | Yes | 3 | SMD/SMT | 209 | 505 LAB | 6060 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.87 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 209 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 209 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 6060 | 1 Core | 128KB | 23 mm | 23 mm | |||||||||||||||||||||||||||
| Mfr Part No M2S060TS-1FGG484I | Microchip Technology | Datasheet | 2098 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2S060 | ARM Cortex M3 | 64 kB | 60 | MICROSEMI CORP | - | - | M2S060TS-1FGG484I | 166 MHz | Microchip Technology | Yes | 3 | 267 | 4710 LAB | 56520 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.81 | Details | Yes | IC FPGA SOC 60K LUTS | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | 1.2000 V | 0.418384 oz | -40 to 100 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 23 mm | 23 mm | ||||||||||||||||||||||||
| Mfr Part No M2S060T-1VF400 | Microchip Technology | Datasheet | 1740 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | M2S060 | ARM Cortex M3 | 64 kB | 90 | MICROSEMI CORP | - | - | M2S060T-1VF400 | 166 MHz | Microchip Technology | Yes | 207 | 4710 LAB | 56520 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.88 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 207 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 17 mm | 17 mm | |||||||||||||||||||||||||||
| Mfr Part No M2S090T-FGG484 | Microchip Technology | Datasheet | 2118 |
| Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S090 | ARM Cortex M3 | 64 kB | 60 | - | - | 166 MHz | Microchip Technology | Yes | 267 | 7193 LAB | 86316 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 90K Logic Modules | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150TS-1FCV484 | Microchip Technology | Datasheet | 484 |
| Min: 1 Mult: 1 | 484-BFBGA | 484-FBGA (19x19) | M2S150 | ARM Cortex M3 | 64 kB | 84 | - | - | 166 MHz | Microchip Technology | Yes | 273 | 12177 LAB | 146124 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 150K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050T-1FG484I | Microchip Technology | Datasheet | 1609 |
| Min: 1 Mult: 1 | FPBGA-484 | 484-FPBGA (23x23) | M2S050 | ARM Cortex M3 | 64 kB | 60 | - | - | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | SMD/SMT | 267 | 4695 LAB | 56340 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.2000 V | -40 to 100 °C | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 50K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090T-1FG484 | Microchip Technology | Datasheet | 2214 |
| Min: 1 Mult: 1 | FPBGA-484 | 484-FPBGA (23x23) | M2S090 | ARM Cortex M3 | 64 kB | 60 | - | - | 166 MHz | Microchip Technology | Yes | SMD/SMT | 267 | 7193 LAB | 86316 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 90K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090-FGG484I | Microchip Technology | Datasheet | 2001 | - | Min: 1 Mult: 1 | FPBGA-484 | 484-FPBGA (23x23) | M2S090 | ARM Cortex M3 | 64 kB | 60 | - | - | 166 MHz | + 100 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 273 I/O | 7193 LAB | 86316 LE | Tray | Active | Details | 1.2000 V | 0.766018 oz | -40 to 100 °C | Tray | SmartFusion2 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 90K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060-1FG676 | Microchip Technology | Datasheet | 1963 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 676-BGA | YES | 676-FBGA (27x27) | 676 | M2S060 | ARM Cortex M3 | 64 kB | 40 | MICROSEMI CORP | - | - | M2S060-1FG676 | 166 MHz | Microchip Technology | Yes | 3 | 387 | 4710 LAB | 56520 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.88 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B676 | 387 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 387 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 27 mm | 27 mm | ||||||||||||||||||||||||||
| Mfr Part No ST4SI2S0009AKI8T | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | - | - | - | ST4SI2 | 15000 | RISC | + 80 C | STMicroelectronics | - 25 C | SMD/SMT | Bulk | Microcontroller | Active | Not Applicable | 1.8 V, 3 V, 5 V | 1.8 V, 3 V, 5 V | Bulk | ST4SIM-200S | LTE-M | - | Bias Network | Flash | 32 bit | 2G, 3G, 4G, CDMA, LTE | SIM and Smart Card Interface | ARM SC300 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU4CG-L1FBVB900I4560 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FCBGA-900 | ARM Cortex A53, ARM Cortex R5 | - | 2.6 Mbit | 4.5 Mbit | 1 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | 600 MHz, 1.5 GHz | + 100 C | - 40 C | SMD/SMT | 204 I/O | 10980 LAB | 192150 LE | This product may require additional documentation to export from the United States. | Zynq UltraScale+ | XCZU4CG | 720 mV/850 mV | - | 16 Transceiver | 4 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU6CG-L1FFVB1156I4560 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FCBGA-1156 | ARM Cortex A53, ARM Cortex R5 | - | 6.9 Mbit | 25.1 Mbit | 1 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | 600 MHz, 1.5 GHz | + 100 C | - 40 C | SMD/SMT | 328 I/O | 26825.5 LAB | 469446 LE | This product may require additional documentation to export from the United States. | Zynq UltraScale+ | XCZU6CG | 720 mV/850 mV | - | 24 Transceiver | 4 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU4EV-L1FBVB900I4560 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FCBGA-900 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | - | 2.6 Mbit | 4.5 Mbit | 1 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | 600 MHz, 667 MHz, 1.5 GHz | SMD/SMT | 204 I/O | 10980 LAB | 192150 LE | This product may require additional documentation to export from the United States. | Zynq UltraScale+ | XCZU4EV | - | 16 Transceiver | 7 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU5EG-L1SFVC784I4560 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FCBGA-784 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | - | 3.5 Mbit | 5.1 Mbit | 1 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | 600 MHz, 667 MHz, 1.5 GHz | + 100 C | - 40 C | SMD/SMT | 252 I/O | 14640 LAB | 256200 LE | This product may require additional documentation to export from the United States. | Zynq UltraScale+ | XCZU5EG | 720 mV/850 mV | - | 4 Transceiver | 7 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU15EG-L1FFVB1156I4560 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FCBGA-1156 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | - | 11.3 Mbit | 26.2 Mbit | 1 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | 600 MHz, 667 MHz, 1.5 GHz | + 100 C | - 40 C | SMD/SMT | 328 I/O | 42660 LAB | 746550 LE | This product may require additional documentation to export from the United States. | Zynq UltraScale+ | XCZU15EG | 720 mV/850 mV | - | 24 Transceiver | 7 Core |
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M2S050-1FCS325
Microchip Technology
Package:Embedded - System On Chip (SoC)
168.505096
-
M2S025T-VFG256
Microchip Technology
Package:Embedded - System On Chip (SoC)
131.167175
-
M2S025-1FGG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
173.833601
-
M2S025TS-1FCSG325
Microchip Technology
Package:Embedded - System On Chip (SoC)
134.632739
-
M2S025TS-1VF256
Microchip Technology
Package:Embedded - System On Chip (SoC)
159.193014
-
M2S005S-1FG484
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060TS-1FGG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
291.309251
-
M2S060T-1VF400
Microchip Technology
Package:Embedded - System On Chip (SoC)
235.666187
-
M2S090T-FGG484
Microchip Technology
Package:Embedded - System On Chip (SoC)
280.383439
-
M2S150TS-1FCV484
Microchip Technology
Package:Embedded - System On Chip (SoC)
619.120732
-
M2S050T-1FG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
190.636175
-
M2S090T-1FG484
Microchip Technology
Package:Embedded - System On Chip (SoC)
402.832158
-
M2S090-FGG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060-1FG676
Microchip Technology
Package:Embedded - System On Chip (SoC)
240.137940
-
ST4SI2S0009AKI8T
STMicroelectronics
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU4CG-L1FBVB900I4560
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU6CG-L1FFVB1156I4560
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU4EV-L1FBVB900I4560
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU5EG-L1SFVC784I4560
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU15EG-L1FFVB1156I4560
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire