The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Clock Frequency-Max | Core | Data RAM Size | Development Kit | Distributed RAM | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Interface Type | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Processor Series | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | Terminal Finish | Additional Feature | HTS Code | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Operating Supply Current | Speed | RAM Size | Core Processor | Peripherals | Program Memory Type | Program Memory Size | Connectivity | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Operating Temperature Range | Number of Gates | Speed Grade | Number of Transceivers | Number of ADC Channels | Primary Attributes | Number of CLBs | Number of Logic Cells | Number of Cores | Number of Equivalent Gates | Flash Size | Length | Width |
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 | Mfr Part No XCVC1802-2HSIVIVA1596 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | 1 | + 110 C | AMD Xilinx | - 40 C | 500 | Tray | Active | Details | -40°C ~ 100°C (TJ) | Versal™ AI Core | 880 mV | 800MHz, 1.65GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1902-2LSEVSVD1760 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | 1 | + 110 C | AMD Xilinx | 0 C | 692 | Tray | Active | Details | 0°C ~ 100°C (TJ) | Versal™ AI Core | 700 mV | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU49DR-2FSVF1760I5149 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-1760 | ARM Cortex A53, ARM Cortex R5F | 256 kB | 13 Mb | 1 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | + 100 C | - 40 C | SMD/SMT | 674 I/O | 53160 LAB | 930300 LE | 850 mV | 16 Transceiver | 6 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1802-1LSEVFVC1760 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | 1 | + 100 C | AMD Xilinx | 0 C | 500 | Active | Details | 0°C ~ 100°C (TJ) | 700 mV | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1802-2MSEVFVC1760 | Xilinx | Datasheet | 2400 | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | 1 | + 110 C | AMD Xilinx | 0 C | 500 | Tray | Active | Details | 0°C ~ 100°C (TJ) | Versal™ Prime | 800 mV | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1902-2MLIVIVA1596 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | 1 | + 110 C | AMD Xilinx | - 40 C | 500 | Tray | Active | Details | -40°C ~ 100°C (TJ) | Versal™ AI Core | 800 mV | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU15EG-2FFVB1156E4498 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-1156 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | 256 kB | 11.3 Mb | 1 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | + 100 C | 0 C | SMD/SMT | 353 I/O | 42660 LAB | 746550 LE | 850 mV | 24 Transceiver | 7 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No PIC32CX1025SG41100T-I/E5X | Microchip Technology | Datasheet | 489 | - | Min: 1 Mult: 1 | TQFP-100 | EV06X38A | 90 | CAN, Ethernet, USB | 120 MHz | + 85 C | Microchip Technology | - 40 C | SMD/SMT | 81 I/O | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | PIC32CX | Active | Details | 3.63 V | 1.71 V | Reel | - | 1.71 V to 3.63 V | Flash | 1 MB | - 40 C to + 85 C | 32 Channel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No PIC32CX1025SG41100T-E/E5X | Microchip Technology | Datasheet | 967 |
| Min: 1 Mult: 1 | TQFP-100 | EV06X38A | 90 | CAN, Ethernet, USB | 120 MHz | + 125 C | Microchip Technology | - 40 C | SMD/SMT | 81 I/O | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | PIC32CX | Active | Details | 3.63 V | 1.71 V | Reel | - | 1.71 V to 3.63 V | Flash | 1 MB | - 40 C to + 125 C | 32 Channel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No PIC32CX1025SG41100-E/E5X | Microchip Technology | Datasheet | 100 |
| Min: 1 Mult: 1 | TQFP-100 | EV06X38A | 1000 | CAN, Ethernet, USB | 120 MHz | + 125 C | Microchip Technology | - 40 C | SMD/SMT | 81 I/O | Tray | PIC32CX | Active | Details | 3.63 V | 1.71 V | Tray | - | 1.71 V to 3.63 V | Flash | 1 MB | - 40 C to + 125 C | 32 Channel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No PIC32CX1025SG41128T-E/Z2X | Microchip Technology | Datasheet | 297 |
| Min: 1 Mult: 1 | TQFP-128 | EV06X38A | 1000 | CAN, Ethernet, USB | 120 MHz | + 125 C | Microchip Technology | - 40 C | SMD/SMT | 99 I/O | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | PIC32CX | Active | Details | 3.63 V | 1.71 V | Reel | - | 1.71 V to 3.63 V | Flash | 1 MB | - 40 C to + 125 C | 32 Channel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No PIC32CX1025SG41128T-I/Z2X | Microchip Technology | Datasheet | 452 |
| Min: 1 Mult: 1 | TQFP-128 | EV06X38A | 1000 | CAN, Ethernet, USB | 120 MHz | + 85 C | Microchip Technology | - 40 C | SMD/SMT | 99 I/O | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | PIC32CX | Active | Details | 3.63 V | 1.71 V | Reel | - | 1.71 V to 3.63 V | Flash | 1 MB | - 40 C to + 85 C | 32 Channel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3F-1FG484 | Microchip Technology | Datasheet | 1948 |
| Min: 1 Mult: 1 | FPBGA-484 | 484-FPBGA (23x23) | A2F200 | ARM Cortex M3 | 64 kB | 60 | - | - | 100 MHz | + 85 C | Microchip Technology | 0 C | Yes | SMD/SMT | 161 I/O | - | 2000 LE | Tray | Active | N | SmartFusion | 0°C ~ 85°C (TJ) | Tray | A2F200 | 1 mA | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 256 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 200000 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3F-1CSG288 | Microchip Technology | Datasheet | 15 | - | Min: 1 Mult: 1 | 288-TFBGA, CSPBGA | YES | 288-CSP (11x11) | 288 | A2F200 | 100 MHz | ARM Cortex M3 | 64 kB | 176 | MICROSEMI CORP | - | - | A2F200M3F-1CSG288 | 100 MHz | Microchip Technology | Yes | 3 | MCU - 31, FPGA - 78 | - | 2000 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, BGA288,21X21,20 | BGA288,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 5.24 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | SmartFusion | 0°C ~ 85°C (TJ) | Tray | A2F200 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | S-PBGA-B288 | 78 | Not Qualified | 1.5,1.8,2.5,3.3 V | OTHER | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 256 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 78 | 4608 CLBS, 200000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 4608 | 4608 | 1 Core | 200000 | 256KB | 11 mm | 11 mm | |||||||||||||||||||||||||
| Mfr Part No M2S090-FG676 | Microchip Technology | Datasheet | 1659 |
| Min: 1 Mult: 1 | 676-BGA | YES | 676-FBGA (27x27) | 676 | M2S090 | ARM Cortex M3 | 64 kB | 40 | MICROSEMI CORP | - | - | M2S090-FG676 | 166 MHz | Microchip Technology | Yes | 3 | 425 | 7193 LAB | 86316 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.83 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B676 | 425 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 425 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 27 mm | 27 mm | |||||||||||||||||||||||||||
| Mfr Part No M2S060-1FG484I | Microchip Technology | Datasheet | 2243 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 484-BGA | 484-FPBGA (23x23) | M2S060 | ARM Cortex M3 | 64 kB | 60 | - | - | 166 MHz | Microchip Technology | Yes | 267 | 4710 LAB | 56520 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | SmartFusion2 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150TS-FCS536I | Microchip Technology | Datasheet | 2392 | - | Min: 1 Mult: 1 | 536-LFBGA, CSPBGA | YES | 536-CSPBGA (16x16) | 536 | M2S150 | ARM Cortex M3 | 64 kB | 90 | MICROSEMI CORP | - | - | M2S150TS-FCS536I | 166 MHz | Microchip Technology | Yes | 293 | 12177 LAB | 146124 LE | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.84 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | Tray | SmartFusion2 | e0 | No | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 240 | not_compliant | 536 | S-PBGA-B536 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 150K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090T-FCS325 | Microchip Technology | Datasheet | 1946 |
| Min: 1 Mult: 1 | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x13.5) | 325 | M2S090 | ARM Cortex M3 | 64 kB | 176 | MICROSEMI CORP | - | - | M2S090T-FCS325 | 166 MHz | Microchip Technology | Yes | 180 | 7193 LAB | 86316 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.83 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | R-PBGA-B325 | 180 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | 1.16 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 13.5 mm | 11 mm | |||||||||||||||||||||||||||||
| Mfr Part No M2S010-VFG400 | Microchip Technology | Datasheet | 20 | - | Min: 1 Mult: 1 | VFPBGA-400 | 400-VFBGA (17x17) | M2S010 | ARM Cortex M3 | 64 kB | 90 | - | - | 166 MHz | 1.26 V | + 85 C | Microchip Technology | 1.14 V | 0 C | Yes | SMD/SMT | 233 I/O | 1007 LAB | 12084 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 0.034371 oz | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 10K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060TS-VF400 | Microchip Technology | Datasheet | 2175 |
| Min: 1 Mult: 1 | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | M2S060 | ARM Cortex M3 | 64 kB | 90 | MICROSEMI CORP | - | - | M2S060TS-VF400 | 166 MHz | Microchip Technology | Yes | 207 | 4710 LAB | 56520 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.87 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 207 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 17 mm | 17 mm |
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XCVC1802-2HSIVIVA1596
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVC1902-2LSEVSVD1760
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU49DR-2FSVF1760I5149
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM1802-1LSEVFVC1760
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM1802-2MSEVFVC1760
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1902-2MLIVIVA1596
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU15EG-2FFVB1156E4498
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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PIC32CX1025SG41100T-I/E5X
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
PIC32CX1025SG41100T-E/E5X
Microchip Technology
Package:Embedded - System On Chip (SoC)
4.005918
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PIC32CX1025SG41100-E/E5X
Microchip Technology
Package:Embedded - System On Chip (SoC)
4.449866
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PIC32CX1025SG41128T-E/Z2X
Microchip Technology
Package:Embedded - System On Chip (SoC)
4.299034
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PIC32CX1025SG41128T-I/Z2X
Microchip Technology
Package:Embedded - System On Chip (SoC)
2.508879
-
A2F200M3F-1FG484
Microchip Technology
Package:Embedded - System On Chip (SoC)
109.537548
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A2F200M3F-1CSG288
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S090-FG676
Microchip Technology
Package:Embedded - System On Chip (SoC)
329.646043
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M2S060-1FG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S150TS-FCS536I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S090T-FCS325
Microchip Technology
Package:Embedded - System On Chip (SoC)
274.209024
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M2S010-VFG400
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S060TS-VF400
Microchip Technology
Package:Embedded - System On Chip (SoC)
236.047262