The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
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- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Brand | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Operating Temperature | Series | JESD-609 Code | Terminal Finish | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Speed | RAM Size | Core Processor | Peripherals | Connectivity | Architecture | Data Bus Width | Number of Inputs | Seated Height-Max | Programmable Logic Type | Product Type | Primary Attributes | Number of Logic Cells | Flash Size | Product Category | Length | Width |
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 | Mfr Part No AGFA008R24C3E3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 576 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1902-2LLEVSVA2197 | AMD | Datasheet | 600 |
| Min: 1 Mult: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 770 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ AI Core | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA012R24B1E1V | Intel | Datasheet | 593 |
| Min: 1 Mult: 1 | - | - | Intel | 768 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU5EV-1SFVC784I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | XCZU5 | AMD | 252 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EV | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1502-1MSENFVB1369 | AMD | Datasheet | 724 |
| Min: 1 Mult: 1 | AMD | 478 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1902-2LLEVIVA1596 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | AMD | 500 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ AI Core | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA006R16A2I3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 384 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1502-1MSENSVG1369 | AMD | Datasheet | 788 |
| Min: 1 Mult: 1 | AMD | 478 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 800k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA008R24C2E4X | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 576 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB012R24C2E4X | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA012R24C3I3E | Intel | Datasheet | 656 |
| Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA012R24C2E1V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1902-2LLIVSVA2197 | AMD | Datasheet | 596 | - | Min: 1 Mult: 1 | - | - | AMD | 770 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ AI Core | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA027R25A2E4X | Intel | Datasheet | 535 |
| Min: 1 Mult: 1 | - | - | Intel | 624 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TDA4VM88TGBALFRQ1 | Texas Instruments | Datasheet | 2064 |
| Min: 1 Mult: 1 | 827-BFBGA, FCBGA | 827-FCBGA (24x24) | Texas Instruments | 250 | Texas Instruments | 2 GHz | + 125 C | Texas Instruments | - 40 C | Yes | SMD/SMT | 226 | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | Active | -40°C ~ 125°C (TJ) | Automotive, AEC-Q100 | Microcontrollers - MCU | 760 mV to 840 mV | 2GHz, 1GHz, 1.35GHz, 1GHz | 1.5MB | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | DMA, PWM, WDT | MCAN, MMC/SDSD/IOI²C, SPI, UART, USB | DSP, MCU, MPU | 64 bit | ARM Microcontrollers - MCU | - | - | ARM Microcontrollers - MCU | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TDA4VM88TGBALFR | Texas Instruments | Datasheet | 2034 |
| Min: 1 Mult: 1 | 827-BFBGA, FCBGA | 827-FCBGA (24x24) | Texas Instruments | 250 | Texas Instruments | Texas Instruments | 226 | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | Active | -40°C ~ 105°C (TJ) | Automotive, AEC-Q100 | Microcontrollers - MCU | 2GHz, 1GHz, 1.35GHz, 1GHz | 1.5MB | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | DMA, PWM, WDT | MCAN, MMC/SDSD/IOI²C, SPI, UART, USB | DSP, MCU, MPU | ARM Microcontrollers - MCU | - | - | ARM Microcontrollers - MCU | ||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU7EV-2FBVB900I | AMD | Datasheet | 514 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU7 | AMD | 204 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EV | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA023R25A2E3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 480 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-1TQ144 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | MICROSEMI CORP | Microsemi Corporation | M2S005S-1TQ144 | Microchip Technology | 3 | 84 | 85 °C | Tray | PLASTIC/EPOXY | LFQFP | TQFP-144 | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | Obsolete | 30 | 5.88 | No | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | QUAD | GULL WING | 240 | 0.5 mm | not_compliant | S-PQFP-G144 | 84 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 84 | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 6060 | 128KB | 20 mm | 20 mm | |||||||||||||
| Mfr Part No AGFA008R16A2I3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 384 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - |
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AGFA008R24C3E3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1902-2LLEVSVA2197
AMD
Package:Embedded - System On Chip (SoC)
42,561.450399
-
AGFA012R24B1E1V
Intel
Package:Embedded - System On Chip (SoC)
12,000.450666
-
XCZU5EV-1SFVC784I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1502-1MSENFVB1369
AMD
Package:Embedded - System On Chip (SoC)
5,630.718470
-
XCVC1902-2LLEVIVA1596
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFA006R16A2I3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1502-1MSENSVG1369
AMD
Package:Embedded - System On Chip (SoC)
12,222.107359
-
AGFA008R24C2E4X
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFB012R24C2E4X
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFA012R24C3I3E
Intel
Package:Embedded - System On Chip (SoC)
11,701.223741
-
AGFA012R24C2E1V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1902-2LLIVSVA2197
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFA027R25A2E4X
Intel
Package:Embedded - System On Chip (SoC)
25,191.681916
-
TDA4VM88TGBALFRQ1
Texas Instruments
Package:Embedded - System On Chip (SoC)
180.113379
-
TDA4VM88TGBALFR
Texas Instruments
Package:Embedded - System On Chip (SoC)
155.179856
-
XCZU7EV-2FBVB900I
AMD
Package:Embedded - System On Chip (SoC)
4,585.684290
-
AGFA023R25A2E3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005S-1TQ144
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFA008R16A2I3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire