The category is 'Embedded - System On Chip (SoC)'
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- Package / Case
- Number of I/Os
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- Peripherals
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- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Clock Frequency-Max | Core | Data RAM Size | Distributed RAM | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Schedule B | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Operating Temperature | Packaging | Series | JESD-609 Code | Part Status | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Interface | Memory Size | Analog IC - Other Type | Speed | RAM Size | Core Processor | Peripherals | Connectivity | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Core Architecture | Max Frequency | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Primary Attributes | Number of CLBs | Number of Logic Cells | Number of Cores | Flash Size | Length | Width | Lead Free |
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 | Mfr Part No XQZU42DR-L1FSQE1156I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | BGA-1156 | ARM Cortex A53, ARM Cortex R5F | 256 kB | 6.8 Mb | 1 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | + 100 C | - 40 C | SMD/SMT | 27960 LAB | 489300 LE | 850 mV | 8 Transceiver | 6 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU11EG-2FFVC1760I4524 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-1760 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | 256 kB | 9.1 Mb | 1 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | + 100 C | - 40 C | SMD/SMT | 560 I/O | 37320 LAB | 653100 LE | 850 mV | 48 Transceiver | 7 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU19EG-2FFVC1760E5187 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-1760 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | 256 kB | 9.8 Mb | 1 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | + 100 C | 0 C | SMD/SMT | 560 I/O | 65340 LAB | 1143450 LE | 850 mV | 72 Transceiver | 7 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU3CG-2UBVA530E | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-530 | 530-FCBGA (16x9.5) | ARM Cortex A53, ARM Cortex R5F | 256 kB | 1.8 Mb | 1 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | + 100 C | AMD Xilinx | 0 C | SMD/SMT | 82 I/O | 8820 LAB | 154350 LE | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 850 mV | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | 4 Core | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU3CG-2UBVA530I | Xilinx | Datasheet | 1699 | - | Min: 1 Mult: 1 | FBGA-530 | 530-FCBGA (16x9.5) | ARM Cortex A53, ARM Cortex R5F | 256 kB | 1.8 Mb | 1 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | + 100 C | AMD Xilinx | - 40 C | SMD/SMT | 82 I/O | 8820 LAB | 154350 LE | Tray | Active | -40°C ~ 100°C (TJ) | - | 850 mV | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | 4 Core | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU19EG-2FFVC1760E5106 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-1760 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | 256 kB | 9.8 Mb | 1 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | + 100 C | 0 C | SMD/SMT | 560 I/O | 65340 LAB | 1143450 LE | 850 mV | 72 Transceiver | 7 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU3EG-L1UBVA530IES9818 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-530 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | 256 kB | 1.8 Mb | 1 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | + 100 C | - 40 C | SMD/SMT | 82 I/O | 8820 LAB | 154350 LE | 850 mV | 7 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU2EG-2UBVA530I | Xilinx | Datasheet | 1695 | - | Min: 1 Mult: 1 | FBGA-530 | 530-FCBGA (16x9.5) | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | 256 kB | 1.2 Mb | 1 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | + 100 C | AMD Xilinx | - 40 C | SMD/SMT | 82 I/O | 5904 LAB | 103320 LE | Tray | Active | -40°C ~ 100°C (TJ) | - | 850 mV | 533MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | 7 Core | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU2EG-1UBVA530I | Xilinx | Datasheet | 1693 | - | Min: 1 Mult: 1 | FBGA-530 | 530-FCBGA (16x9.5) | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | 256 kB | 1.2 Mb | 1 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | + 100 C | AMD Xilinx | - 40 C | SMD/SMT | 82 I/O | 5904 LAB | 103320 LE | Tray | Active | -40°C ~ 100°C (TJ) | - | 850 mV | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | 7 Core | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 71M6531F-IMR/F3 | Maxim Integrated | Datasheet | - | - | Min: 1 Mult: 1 | SILERGY CORP | 71M6531F-IMR/F3 | , | Contact Manufacturer | NOT SPECIFIED | 5.4 | Yes | EAR99 | 8542.39.00.01 | NOT SPECIFIED | compliant | POWER SUPPLY MANAGEMENT CIRCUIT | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 71M6403-IGT | Maxim Integrated | Datasheet | - | - | Min: 1 Mult: 1 | TERIDIAN SEMICONDUCTOR CORP | 71M6403-IGT | Transferred | 5.64 | unknown | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5ASXMB3E4F31I3N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 896-BBGA, FCBGA | YES | 896-FBGA (31x31) | 896 | INTEL CORP | Intel Corporation | 5ASXMB3E4F31I3N | MCU - 208, FPGA - 250 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | End Of Life | NOT SPECIFIED | 5.28 | Compliant | Yes | 1.18 V | 1.12 V | 1.15 V | -40°C ~ 100°C (TJ) | Tray | Arria V SX | e1 | Active | Tin/Silver/Copper (Sn/Ag/Cu) | 100 °C | -40 °C | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 800 MHz | 5ASXMB3 | S-PBGA-B896 | 540 | INDUSTRIAL | EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 540 | 13207 CLBS | 2.7 mm | FIELD PROGRAMMABLE GATE ARRAY | ARM | FPGA - 350K Logic Elements | 13207 | 350000 | -- | 31 mm | 31 mm | |||||||||||||||||||||||||||||||||||
| Mfr Part No 5ASXBB5D4F35I5N | ALTERA | Datasheet | 8 | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FBGA (35x35) | 1152 | INTEL CORP | Intel Corporation | 5ASXBB5D4F35I5N | MCU - 208, FPGA - 385 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | End Of Life | NOT SPECIFIED | 5.27 | Yes | 1.13 V | 1.07 V | 1.1 V | -40°C ~ 100°C (TJ) | Tray | Arria V SX | e1 | Active | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 5ASXBB5 | S-PBGA-B1152 | 385 | INDUSTRIAL | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 385 | 17434 CLBS | 2.7 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 462K Logic Elements | 17434 | 462000 | -- | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5ASTFD5K3F40I3N | ALTERA | Datasheet | 1 | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | YES | 1517-FBGA (40x40) | 1517 | INTEL CORP | Intel Corporation | 5ASTFD5K3F40I3N | MCU - 208, FPGA - 540 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | FBGA-1517 | BGA1517,39X39,40 | SQUARE | GRID ARRAY | End Of Life | NOT SPECIFIED | 5.29 | Yes | 1.18 V | 1.12 V | 1.15 V | -40°C ~ 100°C (TJ) | Tray | Arria V ST | e1 | Active | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 5ASTFD5 | S-PBGA-B1517 | 540 | INDUSTRIAL | 1.05GHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 540 | 17434 CLBS | 2.7 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 462K Logic Elements | 17434 | 462000 | -- | 40 mm | 40 mm | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5ASXBB3D4F40I5N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | YES | 1517-FBGA (40x40) | 1517 | INTEL CORP | Intel Corporation | 5ASXBB3D4F40I5N | MCU - 208, FPGA - 540 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | FBGA-1517 | BGA1517,39X39,40 | SQUARE | GRID ARRAY | End Of Life | NOT SPECIFIED | 5.27 | Yes | 1.13 V | 1.07 V | 1.1 V | -40°C ~ 100°C (TJ) | Tray | Arria V SX | e1 | Active | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 5ASXBB3 | S-PBGA-B1517 | 540 | INDUSTRIAL | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 540 | 13207 CLBS | 2.7 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 350K Logic Elements | 13207 | 350000 | -- | 40 mm | 40 mm | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEBA5U23I7 | ALTERA | Datasheet | 2163 |
| Min: 1 Mult: 1 | 672-FBGA | YES | 672-UBGA (23x23) | 672 | INTEL CORP | Intel Corporation | 5CSEBA5U23I7 | MCU - 181, FPGA - 145 | PLASTIC/EPOXY | FBGA | FBGA, BGA672,28X28,32 | BGA672,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | NOT SPECIFIED | 5.55 | No | 1.13 V | 1.07 V | 1.1 V | -40°C ~ 100°C (TJ) | Tray | Cyclone® V SE | Active | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | S-PBGA-B672 | 145 | Not Qualified | 1.1,1.2/3.3,2.5 V | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 1.85 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 85K Logic Elements | 85000 | -- | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEMA5U23C8N | ALTERA | Datasheet | 2038 |
| Min: 1 Mult: 1 | 672-FBGA | YES | 672-UBGA (23x23) | 672 | INTEL CORP | Intel Corporation | 5CSEMA5U23C8N | MCU - 181, FPGA - 145 | 85 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA672,28X28,32 | BGA672,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | NOT SPECIFIED | 5.25 | Yes | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | Active | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | 5CSEMA5 | S-PBGA-B672 | 145 | Not Qualified | 1.1,1.2/3.3,2.5 V | OTHER | 600MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 1.85 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 85K Logic Elements | 85000 | -- | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEBA5U23C8N | ALTERA | Datasheet | 2086 |
| Min: 1 Mult: 1 | 672-FBGA | YES | 672-UBGA (23x23) | 672 | INTEL CORP | Intel Corporation | 5CSEBA5U23C8N | MCU - 181, FPGA - 145 | 85 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA672,28X28,32 | BGA672,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | NOT SPECIFIED | 2 | Yes | FPGA - Field Programmable Gate Array Cyclone V SE dual -core ARM Cortex-A9 | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | e1 | Active | TIN SILVER COPPER | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | 5CSEBA5 | S-PBGA-B672 | 145 | Not Qualified | 1.1,1.2/3.3,2.5 V | OTHER | 600MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 1.85 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 85K Logic Elements | 85000 | -- | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEMA6U23C6N | ALTERA | Datasheet | 1944 |
| Min: 1 Mult: 1 | 672-FBGA | YES | 672-UBGA (23x23) | 672 | INTEL CORP | Intel Corporation | 5CSEMA6U23C6N | MCU - 181, FPGA - 145 | 85 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA672,28X28,32 | BGA672,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | NOT SPECIFIED | 5.56 | Yes | FPGA - Field Programmable Gate Array Cyclone V SE dual -core ARM Cortex-A9 | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | Active | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | 5CSEMA6 | S-PBGA-B672 | 145 | Not Qualified | 1.1,1.2/3.3,2.5 V | OTHER | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 1.85 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 110K Logic Elements | 110000 | -- | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEBA5U23I7N | ALTERA | Datasheet | 1918 | - | Min: 1 Mult: 1 | 672-FBGA | YES | 672 | 672-UBGA (23x23) | 672 | 622 MHz | INTEL CORP | Intel Corporation | 5CSEBA5U23I7N | 3 | MCU - 181, FPGA - 145 | PLASTIC/EPOXY | FBGA | FBGA, BGA672,28X28,32 | BGA672,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | NOT SPECIFIED | 1.99 | Compliant | Yes | 8542390000 | 1.13 V | 1.07 V | 1.1 V | -40°C ~ 100°C (TJ) | Tray | Cyclone® V SE | e1 | Active | 3A991 | Tin/Silver/Copper (Sn/Ag/Cu) | 100 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | 800 MHz | 5CSEBA5 | S-PBGA-B672 | 145 | Not Qualified | 1.13 V | 1.1,1.2/3.3,2.5 V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 556.3 kB | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 1.85 mm | FIELD PROGRAMMABLE GATE ARRAY | 85000 | ARM | 800 MHz | 32075 | 7 | FPGA - 85K Logic Elements | 85000 | -- | 23 mm | 23 mm | Lead Free |
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XQZU42DR-L1FSQE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU11EG-2FFVC1760I4524
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU19EG-2FFVC1760E5187
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU3CG-2UBVA530E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU3CG-2UBVA530I
Xilinx
Package:Embedded - System On Chip (SoC)
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XCZU19EG-2FFVC1760E5106
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU3EG-L1UBVA530IES9818
Xilinx
Package:Embedded - System On Chip (SoC)
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XCZU2EG-2UBVA530I
Xilinx
Package:Embedded - System On Chip (SoC)
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XCZU2EG-1UBVA530I
Xilinx
Package:Embedded - System On Chip (SoC)
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71M6531F-IMR/F3
Maxim Integrated
Package:Embedded - System On Chip (SoC)
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71M6403-IGT
Maxim Integrated
Package:Embedded - System On Chip (SoC)
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5ASXMB3E4F31I3N
ALTERA
Package:Embedded - System On Chip (SoC)
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5ASXBB5D4F35I5N
ALTERA
Package:Embedded - System On Chip (SoC)
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5ASTFD5K3F40I3N
ALTERA
Package:Embedded - System On Chip (SoC)
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5ASXBB3D4F40I5N
ALTERA
Package:Embedded - System On Chip (SoC)
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5CSEBA5U23I7
ALTERA
Package:Embedded - System On Chip (SoC)
318.923179
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5CSEMA5U23C8N
ALTERA
Package:Embedded - System On Chip (SoC)
199.277048
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5CSEBA5U23C8N
ALTERA
Package:Embedded - System On Chip (SoC)
191.568787
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5CSEMA6U23C6N
ALTERA
Package:Embedded - System On Chip (SoC)
400.703179
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5CSEBA5U23I7N
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire