The category is 'Embedded - System On Chip (SoC)'
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- Package / Case
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Contact Shape | Shell Material | Supplier Device Package | Material | Housing Material | Insert Material | Body Material | Number of Terminals | Backshell Material, Plating | Contact Material - Plating | Base Product Number | Brand | Contact Finish Mating | Contact Materials | Contact Sizes | Data RAM Size | Device Logic Gates | Factory Pack QuantityFactory Pack Quantity | I/O Voltage | Ihs Manufacturer | Instruction Set Architecture | Interface Type | JTAG Support | L1 Cache Data Memory | L1 Cache Instruction Memory | Lead Free Status / RoHS Status | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Mounting | Mounting Styles | Number of CPU Cores | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Primary Material | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Usage Level | Voltage Rated | Voltage, Rating | Operating Temperature | Packaging | Series | Size / Dimension | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Termination | ECCN Code | Connector Type | Type | Number of Positions | Terminal Finish | Color | Applications | Number of Rows | Gender | HTS Code | Fastening Type | Subcategory | Contact Type | Current Rating (Amps) | Pitch | Technology | Voltage - Supply | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Reach Compliance Code | Frequency | Frequency Stability | Insulation Color | Output | Shell Finish | Shell Size - Insert | JESD-30 Code | Function | Base Resonator | Current - Supply (Max) | Number of Outputs | Qualification Status | Housing Color | Operating Supply Voltage | Power Supplies | Temperature Grade | Current - Supply (Disable) (Max) | Note | Interface | Connector Style | Speed | RAM Size | Shell Size, MIL | Core Processor | Peripherals | Program Memory Size | Spread Spectrum Bandwidth | Connectivity | Cable Opening | Architecture | Data Bus Width | Number of Inputs | Seated Height-Max | Programmable Logic Type | Thread Size | Product Type | Number of Positions/Contacts | Includes | Internal Switch(s) | Screening Level | Speed Grade | Number of Transceivers | Legend | Connector Usage | Absolute Pull Range (APR) | Primary Attributes | Number of Logic Cells | Number of Cores | Body Color | Panel Hole Size | Industry Recognized Mating Diameter | Actual Diameter | Signal Lines | Flash Size | Mating Length/Depth | Features | Mesh Length | Product Category | Device Core | Height Seated (Max) | Length | Width | Contact Finish Thickness - Mating | Material Flammability Rating | Ratings |
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 | Mfr Part No MPFS250T-1FCVG484T2 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | Microchip Technology | MCU - 136, FPGA - 108 | Tray | Active | -40°C ~ 125°C (TJ) | - | - | 2.2MB | RISC-V | DMA, PCI, PWM | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS016C3U19E2LG | ALTERA | Datasheet | 422 |
| Min: 1 Mult: 1 | Panel Mount | 484-BFBGA, FCBGA | YES | Flange | Circular | Polyamide (PA66), Nylon 6/6 | 484-UBGA (19x19) | - | 484 | C01610C006 | Intel / Altera | 1.6mm | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS016C3U19E2LG | 1.2 GHz | Amphenol Tuchel Industrial | Yes | SMD/SMT | 192 | 20000 LAB | 160000 LE | 100 °C | Bulk | PLASTIC/EPOXY | FBGA | FBGA, BGA484,22X22,32 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | 964565 | Active | Active | NOT SPECIFIED | 5.47 | Non-Compliant | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 0.423288 oz | -40°C ~ 125°C | Tray | ecomate® Plastic | Active | Receptacle Housing | For Male Pins | 7 (6 + PE) | 8542.39.00.01 | Threaded | SOC - Systems on a Chip | Crimp | CMOS | BOTTOM | Keyed | BALL | Unshielded | NOT SPECIFIED | IP65/IP67 - Dust Tight, Water Resistant, Waterproof | 0.8 mm | compliant | - | - | S-PBGA-B484 | 192 | Not Qualified | Black | 0.9 V | OTHER | Contacts Not Included | 1.5GHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 192 | 3.25 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | - | FPGA - 160K Logic Elements | 160000 | 2 Core | -- | - | SoC FPGA | 19 mm | 19 mm | UL94 V-0 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU65DR-2FFVE1156I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Panel Mount | Bulkhead - Front Side Nut | Composite | Thermoplastic | - | CTVS07RF | Gold | Copper Alloy | Amphenol Aerospace Operations | Bulk | Composite | Active | - | -65°C ~ 200°C | MIL-DTL-38999 Series III, Tri-Start™ TV | Crimp | Receptacle, Male Pins | 5 | Silver | Aviation, Marine, Military | Threaded | - | B | Shielded | Environment Resistant | Electroless Nickel | 11-5 | - | - | - | 50.0µin (1.27µm) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU65DR-1FSVE1156I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | EDAC Inc. | Bulk | Active | * | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150T-1FCSG536I | Microchip | Datasheet | 2252 | - | Min: 1 Mult: 1 | 536-LFBGA, CSPBGA | 536-CSPBGA (16x16) | M2S150 | 64 kB | - | - | 166 MHz | PEI-Genesis | 293 | 146124 LE | Bulk | Active | -40°C ~ 100°C (TJ) | * | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 150K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU43DR-L2FSVE1156I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | PEI-Genesis | 366 | Bulk | Active | -40°C ~ 100°C (TJ) | * | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU43DR-2FSVG1517E | AMD | Datasheet | 542 |
| Min: 1 Mult: 1 | Panel Mount | 1517-BBGA, FCBGA | Flange | Circular | Aluminum | 1517-FCBGA (40x40) | - | TVP00RW | 22D | Amphenol Aerospace Operations | 561 | Bulk | Active | -65°C ~ 175°C | MIL-DTL-38999 Series III, Tri-Start™ TV | Receptacle Housing | For Female Sockets | 66 | Threaded | Crimp | C | Shielded | Environment Resistant | Cadmium | 19-35 | Olive Drab | Contacts Not Included | 533MHz, 1.333GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3F-FG256 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | 256-FPBGA (17x17) | A2F200 | 200000 | Cooper | SKT12516 | 1.575 V | Microchip Technology | 1.425 V | MCU - 25, FPGA - 66 | Tray | Active | 1.5000 V | 0 to 85 °C | SmartFusion® | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | STD | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | 17 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150T-1FC1152M | Microchip | Datasheet | 774 | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | M2S150 | MICROSEMI CORP | Cully-Minerallac | NC16 | Microchip Technology | 574 | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.81 | No | 1.26 V | 1.14 V | 1.2 V | -55°C ~ 125°C (TJ) | SmartFusion®2 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B1152 | 574 | Not Qualified | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3FCSG288 | Microsemi Actel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | SG-8101 | EPSON | Tape & Reel (TR) | Active | -40°C ~ 85°C | SG-8101 | 0.276 L x 0.197 W (7.00mm x 5.00mm) | XO (Standard) | 1.8V ~ 3.3V | 67.4 MHz | ±15ppm | CMOS | Enable/Disable | Crystal | 6.8mA (Typ) | 3.5mA | - | - | 0.055 (1.40mm) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BCM47622LA1KFEBG | Broadcom | Datasheet | 33 |
| Min: 1 Mult: 1 | - | - | Broadcom / Avago | 588 | Broadcom Limited | Broadcom Limited | - | Tray | Active | Details | - | - | Communication & Networking ICs | 1.5GHz | - | ARM® Cortex®-A7 | DDR3, DDR4, LED | Ethernet, I²C, PCIe, SPI, UART/USART, USB, Wifi | MPU | Network Controller & Processor ICs | - | - | Network Controller & Processor ICs | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-1FFVG1517I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | 1.8, 2.5, 3.3 V | RISC | CAN/Serial I2C/SPI/UART/USB | Yes | AMD | Surface Mount | 6 | 561 | Tray | Active | Industrial grade | -40 to 100 °C | Zynq® UltraScale+™ RFSoC | 2, 15 V | CAN/Serial I2C/SPI/U | 500MHz, 1.2GHz | 256 KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 64 Bit | Industrial | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050T-VFG400I | Microchip | Datasheet | 2112 | - | Min: 1 Mult: 1 | 400-LFBGA | 400-VFBGA (17x17) | M2S050 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 207 | 56340 LE | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 50K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-L2FSVG1517I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | 561 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU49DR-2FSVF1760E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD | 622 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS048H1F34I1HG | ALTERA | Datasheet | 634 |
| Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel / Altera | - | 24 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS048H1F34I1HG | 1.2 GHz | + 100 C | - 40 C | Yes | SMD/SMT | 492 | 60000 LAB | 480000 LE | 965036 | Active | 5.68 | Details | Yes | This product may require additional documentation to export from the United States. | Arria 10 SoC | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | SOC - Systems on a Chip | unknown | 950 mV | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | 24 Transceiver | FPGA - 480K Logic Elements | 2 Core | -- | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-VF256I | Microchip | Datasheet | 4 | - | Min: 1 Mult: 1 | -- | 256-LFBGA | 256-FPBGA (14x14) | M2S005 | 64 kB | - | - | -- | 166 MHz | Microchip Technology | SMD/SMT | 161 | 6060 LE | Tray | Active | -40°C ~ 100°C (TJ) | -- | -- | Active | -- | -- | 8 | -- | -- | -- | -- | Drawer | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | Plug | FPGA - 5K Logic Modules | 1 Core | 128KB | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150T-FCV484 | Microchip | Datasheet | 728 | - | Min: 1 Mult: 1 | 484-BFBGA | 484-FBGA (19x19) | M2S150 | 64 kB | - | - | 166 MHz | Microchip Technology | 273 | 146124 LE | Tray | Active | 0°C ~ 85°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 150K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-2FFVE1156I | AMD | Datasheet | 465 | - | Min: 1 Mult: 1 | Through Hole | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | -- | Copper Alloy | Tin | Copper Alloy | 1.8, 2.5, 3.3 V | RISC | CAN/Serial I2C/SPI/UART/USB | Yes | -- | AMD | Surface Mount | 366 | Tray | Active | Industrial grade | -- | -20°C ~ 65°C | Bulk | -- | Obsolete | Solder | Phono (RCA) Jack | Female | Unshielded | Black | 3.4, 5.5 V | CAN/Serial I2C/SPI/U | 533MHz, 1.333GHz | 256 KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | -- | MCU, FPGA | 64 Bit | -- | 2 Conductors, 2 Contacts | -- | Does Not Contain Switch | Industrial | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | Silver | -- | 3.20mm ID, 9.00mm OD (RCA) | -- | Mono | - | -- | Mounting Hardware | ARM Cortex-A53/ARM Cortex-R5 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050-1VF400 | Microchip | Datasheet | 2199 | - | Min: 1 Mult: 1 | 400-LFBGA | YES | 400-VFBGA (17x17) | Polystyrene | 400 | M2S050 | 64 kB | MICROSEMI CORP | - | - | Brady | 119817 | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | SMD/SMT | 207 | 56340 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.84 | No | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 85 °C | SmartFusion®2 | e0 | Fire/Emergency Signs | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 160 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 160 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | Emergency Fire Alarm | FPGA - 50K Logic Modules | 48672 | 1 Core | 256KB | 17 mm | 17 mm |
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MPFS250T-1FCVG484T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
10AS016C3U19E2LG
ALTERA
Package:Embedded - System On Chip (SoC)
967.074551
-
XCZU65DR-2FFVE1156I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU65DR-1FSVE1156I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S150T-1FCSG536I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU43DR-L2FSVE1156I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU43DR-2FSVG1517E
AMD
Package:Embedded - System On Chip (SoC)
22,632.251779
-
A2F200M3F-FG256
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S150T-1FC1152M
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F200M3FCSG288
Microsemi Actel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
BCM47622LA1KFEBG
Broadcom
Package:Embedded - System On Chip (SoC)
23.118730
-
XCZU48DR-1FFVG1517I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S050T-VFG400I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU48DR-L2FSVG1517I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU49DR-2FSVF1760E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
10AS048H1F34I1HG
ALTERA
Package:Embedded - System On Chip (SoC)
5,317.485291
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M2S005S-VF256I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S150T-FCV484
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU48DR-2FFVE1156I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S050-1VF400
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire