The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Brand | Capacitance Tolerance | Data RAM Size | Data Rate Architecture | Distributed RAM | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/O Lines | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Number of Words | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Qualification | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Timing Type | Tradename | Typical Operating Supply Voltage | Unit Weight | Usage Level | Voltage, Rating | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | ECCN Code | Temperature Coefficient | Type | Resistance | Terminal Finish | HTS Code | Capacitance | Subcategory | Power Rating | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Resistor Type | Reach Compliance Code | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Number of Ports | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Family | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Address Bus Width | Product Type | Density | Screening Level | Speed Grade | Resistance Tolerance | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Product Category | Product Length | Product Width | Length | Width |
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![]() | Mfr Part No XCVM1502-1MSEVFVC1760 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 100 C | 0 C | 100.0000 ppm/°C | 150 kOhm | SOC - Systems on a Chip | 0.25 W | High Reliability, MIL-PRF-39017 | 800 mV | System-On-Modules - SOM | 1 | SoC FPGA | 7.62 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVC1502-3HSEVBVA1024 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 100 C | 0 C | SOC - Systems on a Chip | 880 mV | System-On-Modules - SOM | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVM1302-1MSEVSVF1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | Xilinx | + 100 C | 0 C | SOC - Systems on a Chip | 250 mW | High Reliability, MIL-PRF-39017 | 800 mV | System-On-Modules - SOM | 1 | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVM1302-1MLIVFVB1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | Xilinx | + 110 C | - 40 C | 200 ppm/K | 147 kOhm | SOC - Systems on a Chip | 0.05 W | General Purpose | 800 mV | System-On-Modules - SOM | 1 | SoC FPGA | 0.6 mm | 0.3 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVC1502-2HSIVSVA1596 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 110 C | - 40 C | 50.0000 ppm/°C | 301 Ohm | SOC - Systems on a Chip | 0.1 W | 880 mV | System-On-Modules - SOM | 1 | SoC FPGA | 7.06 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVM1402-1MLIVSVF1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | Xilinx | + 110 C | - 40 C | Guide Module | SOC - Systems on a Chip | 800 mV | System-On-Modules - SOM | SoC FPGA | 14.5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVM1302-2MLIVSVF1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | SDR | Xilinx | 3.6 V | + 110 C | 3 V | - 40 C | Surface Mount | 16 Bit | 256 Kb | TSOP-II | Asynchronous | 3.3 V | Commercial grade | 0 to 70 °C | SOC - Systems on a Chip | 44 | 800 mV | 1 | 14 Bit | System-On-Modules - SOM | 4 Mbit | Commercial | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVC1502-2HSIVBVA1024 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 110 C | - 40 C | SOC - Systems on a Chip | 880 mV | High Frequency Relays | System-On-Modules - SOM | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVM1302-2MLEVSVF1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | Xilinx | + 110 C | 0 C | 50.0000 ppm/°C | 40.2 kOhm | SOC - Systems on a Chip | 0.25 W | High Reliability, MIL-PRF-55182 | 800 mV | System-On-Modules - SOM | 1 | SoC FPGA | 8.89 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVM1502-1LLIVFVB1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | Xilinx | + 110 C | - 40 C | 50 ppm/°C | 57.6 kOhm | SOC - Systems on a Chip | 0.15 W | High Reliability | 700 mV | System-On-Modules - SOM | 1 | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVM1402-1LSEVSVF1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | Xilinx | + 100 C | 0 C | MIL-PRF-55342 | 75 V | 25 ppm/°C | 7.5 kOhm | SOC - Systems on a Chip | 0.15 W | Precision | 700 mV | System-On-Modules - SOM | 0.1 | SoC FPGA | 1.63 mm | 0.81 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVM1402-1MLIVFVB1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | Xilinx | + 110 C | - 40 C | MIL-PRF-39009 | ± 50ppm/°C | 4.02 Ohm | SOC - Systems on a Chip | 30 W | 800 mV | System-On-Modules - SOM | ± 1% | SoC FPGA | 49.99 mm | 28.96 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVM1302-1LSEVSVF1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | Xilinx | + 100 C | 0 C | AEC-Q200 | 100 ppm/K | 178 Ohm | SOC - Systems on a Chip | 0.125 W | General Purpose | 700 mV | System-On-Modules - SOM | 1 | SoC FPGA | 2 mm | 1.25 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S050-FGG896 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 896-BGA | 896-FBGA (31x31) | M2S050 | 10% | 64 kB | - | - | 166 MHz | + 85 C | Microchip Technology | 0 C | SMD/SMT | 377 | 56340 LE | Tray | Active | 1.2000 V | 0 to 85 °C | SmartFusion®2 | 1 uF | 896 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 50K Logic Modules | 1 Core | 256KB | 3.2 mm | 3.2 x 2.5 x 2.79 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S025TS-1FGG484M | Microchip | Datasheet | 2071 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 484-BGA | 484-FPBGA (23x23) | M2S025 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 267 | 27696 LE | Tray | Active | Compliant | -55°C ~ 125°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S050T-1FGG896 | Microchip | Datasheet | 2203 | - | Min: 1 Mult: 1 | 896-BGA | 896-FBGA (31x31) | M2S050 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 377 | 56340 LE | Tray | Active | 1.2000 V | 0 to 85 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 50K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S060TS-1FG484M | Microchip | Datasheet | 1833 |
| Min: 1 Mult: 1 | BGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S060 | Microchip Technology / Atmel | 64 kB | 1314 kbit | 60 | MICROSEMI CORP | - | - | Microchip | M2S060TS-1FG484M | 166 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 267 I/O | 4710 LAB | 56520 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.84 | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | 0.326090 oz | -55°C ~ 125°C (TJ) | Tray | SmartFusion2 | e0 | Yes | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | SOC - Systems on a Chip | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | SoC FPGA | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S005-FGG484 | Microchip | Datasheet | 60 |
| Min: 1 Mult: 1 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2S005 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S005-FGG484 | 166 MHz | 1.26 V | + 85 C | Microchip Technology | 1.14 V | 0 C | 3 | SMD/SMT | 209 | 6060 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 2.39 | Yes | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 85 °C | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 209 | Not Qualified | 1.2 V | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 209 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 5K Logic Modules | 6060 | 1 Core | 128KB | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S050-FG484 | Microchip | Datasheet | 1625 | - | Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S050 | 64 kB | - | - | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | SMD/SMT | 267 | 56340 LE | Tray | Active | 1.2000 V | 0 to 85 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 50K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S005S-VFG400I | Microchip | Datasheet | 9 | - | Min: 1 Mult: 1 | 400-LFBGA | 400-VFBGA (17x17) | M2S005 | 64 kB | - | - | 166 MHz | Microchip Technology | 169 | 6060 LE | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 5K Logic Modules | 1 Core | 128KB |
XCVM1502-1MSEVFVC1760
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVC1502-3HSEVBVA1024
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVM1302-1MSEVSVF1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVM1302-1MLIVFVB1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVC1502-2HSIVSVA1596
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVM1402-1MLIVSVF1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVM1302-2MLIVSVF1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVC1502-2HSIVBVA1024
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVM1302-2MLEVSVF1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVM1502-1LLIVFVB1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVM1402-1LSEVSVF1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVM1402-1MLIVFVB1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVM1302-1LSEVSVF1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S050-FGG896
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S025TS-1FGG484M
Microchip
Package:Embedded - System On Chip (SoC)
331.211791
M2S050T-1FGG896
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S060TS-1FG484M
Microchip
Package:Embedded - System On Chip (SoC)
363.010354
M2S005-FGG484
Microchip
Package:Embedded - System On Chip (SoC)
23.437201
M2S050-FG484
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S005S-VFG400I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
