The category is 'Embedded - System On Chip (SoC)'
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- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Brand | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | I/O Voltage | Ihs Manufacturer | Instruction Set Architecture | Interface Type | JTAG Support | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Mfr | Mounting | Mounting Styles | Number of CPU Cores | Number of I/Os | Number of Logic Elements | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Usage Level | Voltage Rating AC | Voltage Rating DC | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | JESD-609 Code | Number of Terminations | Temperature Coefficient | Resistance | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Composition | HTS Code | Subcategory | Power Rating | Max Power Dissipation | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Military Standard | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Approval Agency | Operating Supply Voltage | Power Supplies | Interface | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Data Bus Width | Number of Inputs | Seated Height-Max | Programmable Logic Type | Filter Type | Max Frequency | Screening Level | Number of Lines | DC Resistance (DCR) (Max) | Current Rating (Max) | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Disconnect Type | Features | Nominal Input Voltage (AC) | Product Category | Device Core | IP Rating | Diameter | Length | Width | Height (Max) | Lead Free | Ratings |
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 | Mfr Part No XCZU47DR-L1FSVG1517I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | KPT06 | ITT Cannon, LLC | 561 | Bulk | Active | -40°C ~ 100°C (TJ) | KPT | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA022R25A2I2V | Intel | Datasheet | 500 |
| Min: 1 Mult: 1 | - | - | Intel | 624 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z030-1FBG676I | AMD | Datasheet | 1739 |
| Min: 1 Mult: 1 | 676-BBGA, FCBGA | 676-FCBGA (27x27) | XC7Z030 | AMD | 130 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq®-7000 | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 125K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU46DR-1FFVH1760E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | PEI-Genesis | 574 | Bulk | Active | 0°C ~ 100°C (TJ) | * | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU43DR-L1FFVG1517I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | 561 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU43DR-2FFVE1156I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | 1.8/2.5/3.3 V | RISC | CAN/Serial I2C/SPI/UART/USB | Yes | AMD | Surface Mount | 6 | 366 | Tray | Active | Industrial grade | -40 to 100 °C | Zynq® UltraScale+™ RFSoC | 1156 | 0.85 V | CAN/Serial I2C/SPI/U | 533MHz, 1.333GHz | 256 KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 64 Bit | Industrial | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ARM Cortex-A53/ARM Cortex-R5 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050TS-FGG896I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Lead, Tin | Through Hole | 896-BGA | YES | 896-FBGA (31x31) | 896 | M2S050 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S050TS-FGG896I | 166 MHz | Microchip Technology | SMD/SMT | 377 | 56340 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.82 | Compliant | Yes | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | Tape & Reel (TR) | SmartFusion®2 | 1 % | e1 | 2 | 50 ppm/°C | 1.62 MΩ | Tin/Silver/Copper (Sn/Ag/Cu) | 175 °C | -65 °C | Metal Film | 8542.39.00.01 | Field Programmable Gate Arrays | 250 mW | 250 mW | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | MIL-R-10509 | S-PBGA-B896 | 377 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 377 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | Flame Retardant Coating, Military, Moisture Resistant | 3.68 mm | 8.7376 mm | 3.68 mm | Contains Lead | ||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z020-2CLG400E | AMD | Datasheet | 2178 |
| Min: 1 Mult: 1 | 400-LFBGA, CSPBGA | 400-CSPBGA (17x17) | XC7Z020 | AMD | 130 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq®-7000 | 766MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 85K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA027R24C2E4X | Intel | Datasheet | 467 |
| Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1802-2LSEVSVD1760 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | ABB | ACH550-BCR-032A-6+B058 | AMD | Panel, Wall | 726 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ Prime | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | 60 Hz | Versal™ Prime FPGA, 1.9M Logic Cells | - | Circuit Breaker | 575 VAC | IP58 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-L2FFVG1517I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole | Vertical, No Base, 2 PC Pin | 1517-FCBGA (40x40) | DSO1 | SCHURTER Inc. | 561 | Tape & Reel (TR) | Active | - | 600V | -40°C ~ 125°C | DSO | 1.024 Dia (26.00mm) | IEC, UL | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Power Line | 2 | 140mOhm | 2A | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | - | 1.024 (26.00mm) | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-2FFVG1517E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | KYOCERA AVX | 561 | Tape & Reel (TR) | Active | 0°C ~ 100°C (TJ) | * | CAN/Serial I2C/SPI/U | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-VF400I | Microchip | Datasheet | 4 |
| Min: 1 Mult: 1 | 400-LFBGA | 400-VFBGA (17x17) | M2S005 | PEI-Genesis | 169 | Bulk | Active | -40°C ~ 100°C (TJ) | * | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 5K Logic Modules | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 1SX040HH3F35E2VG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel | 24 | Intel | Intel | 374 | Tray | Active | 0°C ~ 100°C (TJ) | Tray | Stratix® 10 SX | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 400K Logic Elements | - | Intel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA022R25A2E2V | Intel | Datasheet | 436 |
| Min: 1 Mult: 1 | - | - | Intel | 3 | Intel | Intel | 624 | Tray | Active | Details | 0°C ~ 100°C (TJ) | Tray | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | Intel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA027R25A2E2V | Intel | Datasheet | 730 |
| Min: 1 Mult: 1 | - | - | Intel | 3 | Intel | Intel | 624 | Tray | Active | Details | 0°C ~ 100°C (TJ) | Tray | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | Intel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA027R25A2I2V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 3 | Intel | Intel | 624 | Tray | Active | Details | -40°C ~ 100°C (TJ) | Tray | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | Intel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No PIMX8QM6AVUFFAB | NXP | Datasheet | - | - | Min: 1 Mult: 1 | PEI-Genesis | Bulk | Active | * | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-L1FFVG1517I | AMD | Datasheet | 643 |
| Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | 561 | Tray | Active | Non-Compliant | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LS1046AMN8T1A | Teledyne LeCroy | Datasheet | - | - | Min: 1 Mult: 1 |
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XCZU47DR-L1FSVG1517I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFA022R25A2I2V
Intel
Package:Embedded - System On Chip (SoC)
22,887.128077
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XC7Z030-1FBG676I
AMD
Package:Embedded - System On Chip (SoC)
371.703419
-
XCZU46DR-1FFVH1760E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU43DR-L1FFVG1517I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU43DR-2FFVE1156I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050TS-FGG896I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XC7Z020-2CLG400E
AMD
Package:Embedded - System On Chip (SoC)
193.082010
-
AGFA027R24C2E4X
Intel
Package:Embedded - System On Chip (SoC)
30,569.188892
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XCVM1802-2LSEVSVD1760
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU48DR-L2FFVG1517I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU48DR-2FFVG1517E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S005S-VF400I
Microchip
Package:Embedded - System On Chip (SoC)
48.936545
-
1SX040HH3F35E2VG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA022R25A2E2V
Intel
Package:Embedded - System On Chip (SoC)
19,085.190933
-
AGFA027R25A2E2V
Intel
Package:Embedded - System On Chip (SoC)
22,428.056203
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AGFA027R25A2I2V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
PIMX8QM6AVUFFAB
NXP
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU48DR-L1FFVG1517I
AMD
Package:Embedded - System On Chip (SoC)
27,869.851546
-
LS1046AMN8T1A
Teledyne LeCroy
Package:Embedded - System On Chip (SoC)
Price: please inquire