The category is 'Embedded - System On Chip (SoC)'
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- Package / Case
- Number of I/Os
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- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Number of Pins | Contact Shape | Shell Material | Supplier Device Package | Weight | Insert Material | Number of Terminals | 1st Connector Mounting Type | Cable Material | 2nd Connector Mounting Type | Base Product Number | Brand | Cable Types | Contact Sizes | Data RAM Size | Device Logic Units | Distributed RAM | Factory Pack QuantityFactory Pack Quantity | I/O Voltage | Ihs Manufacturer | Instruction Set Architecture | Interface Type | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Number of User I/Os | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of CPU Cores | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage | Usage Level | Operating Temperature | Packaging | Series | Size / Dimension | JESD-609 Code | Part Status | Connector Type | Type | Number of Positions | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Color | HTS Code | Fastening Type | Subcategory | Contact Type | Technology | Voltage - Supply | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Reach Compliance Code | Frequency | Frequency Stability | Base Part Number | Output | Shell Finish | Pin Count | Shell Size - Insert | JESD-30 Code | Function | Base Resonator | Current - Supply (Max) | Number of Outputs | Qualification Status | Approval Agency | Housing Color | Operating Supply Voltage | Power Supplies | Temperature Grade | Current - Supply (Disable) (Max) | Note | Interface | Memory Size | Speed | RAM Size | Shell Size, MIL | Core Processor | Peripherals | Program Memory Size | Spread Spectrum Bandwidth | Connectivity | Usage | Family | Architecture | Data Bus Width | Number of Inputs | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Includes | 1st Connector Gender | 1st Connector Number of Positions Loaded | 1st Connector Type | 1st Connector Number of Positions | Assembly Configuration | Core Architecture | 2nd Connector Type | 1st Connector Orientation | Display Type | 1st Connector Shell Size - Insert | Screening Level | Speed Grade | Absolute Pull Range (APR) | 2nd Connector Gender | Primary Attributes | Number of Registers | Number of Logic Cells | Number of Characters Per Row | Number of Cores | 2nd Connector Number of Positions | Communications | 2nd Connector Number of Positions Loaded | 2nd Connector Orientation | Number of Inputs and Type | Number of Outputs and Type | Flash Size | 2nd Connector Shell Size - Insert | Expandable | Software | Features | Product Category | Height Seated (Max) | Length | Width | Material Flammability Rating | Ratings |
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 | Mfr Part No 5CSEBA2U19C8N | ALTERA | Datasheet | 1440 |
| Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | YES | 484 | 484-UBGA (19x19) | 484 | SG-8101 | INTEL CORP | Intel Corporation | 5CSEBA2U19C8N | EPSON | MCU - 151, FPGA - 66 | 85 °C | Tape & Reel (TR) | PLASTIC/EPOXY | FBGA | FBGA, BGA484,22X22,32 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | Active | NOT SPECIFIED | 2 | Compliant | Yes | FPGA - Field Programmable Gate Array CycloneV SoC SE dual -core ARM Cortex-A9 | 1.13 V | 1.07 V | 1.1 V | -40°C ~ 105°C | Tray | SG-8101 | 0.197 L x 0.126 W (5.00mm x 3.20mm) | Active | XO (Standard) | 85 °C | 0 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.8V ~ 3.3V | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | 12.223 MHz | ±20ppm | 5CSEBA2 | CMOS | S-PBGA-B484 | Standby (Power Down) | Crystal | 6.8mA (Typ) | 66 | Not Qualified | 1.1 V | 1.1,1.2/3.3,2.5 V | OTHER | 1.1µA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.5 MB | 600MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 66 | 1.9 mm | FIELD PROGRAMMABLE GATE ARRAY | 25000 | ARM | - | FPGA - 25K Logic Elements | 25000 | -- | 0.051 (1.30mm) | 19 mm | 19 mm | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS027H2F34I1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FBGA (35x35) | 1152 | Free Hanging (In-Line) | Polyvinyl Chloride (PVC) | Free Hanging (In-Line) | Round | INTEL CORP | Intel Corporation | 10AS027H2F34I1SG | Tripp Lite | 384 | 100 °C | -40 °C | Box | PLASTIC/EPOXY | BGA | 35 X 35 MM, ROHS COMPLIANT, FBGA-1152 | SQUARE | GRID ARRAY | Obsolete | Active | 5.64 | Non-Compliant | Yes | 0.93 V | 0.87 V | 0.9 V | -40°C ~ 100°C (TJ) | Tray | - | Discontinued at Digi-Key | Blue | 8542.39.00.01 | BOTTOM | BALL | Shielded | IP68 - Dust Tight, Waterproof | 1 mm | compliant | S-PBGA-B1152 | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | Male Pins | All | Receptacle, Right Angle | 8 | Standard | Receptacle | - | M12 | Male Pins | FPGA - 270K Logic Elements | 8 | All | - | -- | M12 | 32.8 (10.00m) | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA022R25A2E4F | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 624 | Tray | Active | Non-Compliant | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU19EG-2FFVE1924I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1924-BBGA, FCBGA | 1924-FCBGA (45x45) | XCZU19 | AMD | 668 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB022R25A3E4X | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 624 | Tray | Active | Non-Compliant | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU6CG-2FFVC900E | AMD | Datasheet | 641 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU6 | AMD | 204 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB027R25A2I3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | DIN Rail | - | - | - | Panasonic Industrial Automation Sales | 624 | Bulk | Active | 0°C ~ 55°C | FP7 | 20.4 ~ 28.8VDC | - | CE, cULus, KC | 16K Words | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | No Display | FPGA - 2.7M Logic Elements | - | RS-232C, Option Cards Available | Option Cards Available | Option Cards Available | - | 16 Modules Max | FPWINGR7, FPWINPRO7 | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010S-1FGG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | MICROSEMI CORP | Microsemi Corporation | M2S010S-1FGG484I | 3 | Active | 30 | 5.77 | Non-Compliant | Yes | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 250 | compliant | FIELD PROGRAMMABLE GATE ARRAY | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150S-1FC1152I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA012R24B2I3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | PEI-Genesis | 768 | Bulk | Active | -40°C ~ 100°C (TJ) | * | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LS1046AAN3Q1A | Teledyne LeCroy | Datasheet | - | - | Min: 1 Mult: 1 | Tape and Reel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSXFC6C6U23I7NTS | ALTERA | Datasheet | 2178 | - | Min: 1 Mult: 1 | Free Hanging (In-Line) | - | Circular | Aluminum | - | D38999/26FD | 20 | Amphenol Aerospace Operations | Bulk | Active | -65°C ~ 200°C | Tray | Military, MIL-DTL-38999 Series III, Tri-Start™ TV | Active | Plug Housing | For Male Pins | 18 | Threaded | Crimp | N (Normal) | Unshielded | Environment Resistant | Electroless Nickel | 15-18 | Silver | Contacts Not Included | D | - | Backshell, Coupling Nut, Self Locking | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z100-1FFG1156I | AMD | Datasheet | 583 |
| Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | XC7Z100 | 1.5, 2, 2.5 V | RISC | CAN/I2C/SPI/UART | AMD | Surface Mount | 2 | 250 | Tray | Active | FBGA | -40 to 100 °C | Zynq®-7000 | 1156 | 1, 1.8 V | CAN/I2C/SPI/UART | 667MHz | 256 KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32 Bit | Kintex™-7 FPGA, 444K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z030-1FFG676C | AMD | Datasheet | 2094 |
| Min: 1 Mult: 1 | 676-BBGA, FCBGA | 676-FCBGA (27x27) | XC7Z030 | 1.2, 3.3 V | Thumb-2 | AMD | Surface Mount | 130 | Tray | Active | FCBGA | 0 to 85 °C | Zynq®-7000 | 676 | 1 V | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32 Bit | Kintex™-7 FPGA, 125K Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z035-1FFG676C | AMD | Datasheet | 574 |
| Min: 1 Mult: 1 | 676-BBGA, FCBGA | 676-FCBGA (27x27) | XC7Z035 | 275,000 | 130 | 1.05 V | AMD | 0.95 V | 130 | Tray | Active | 1.0000 V | Commercial grade | 0 to 85 °C | Zynq®-7000 | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | XC7Z035 | MCU, FPGA | Commercial | 1 | Kintex™-7 FPGA, 275K Logic Cells | 343,800 | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU19EG-L2FFVD1760E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 1760-FCBGA (42.5x42.5) | XCZU19 | AMD | 308 | Tray | Active | -40°C ~ 85°C | Tape & Reel (TR) | SiT8208 | 0.276 L x 0.197 W (7.00mm x 5.00mm) | Active | XO (Standard) | 2.8V | 6MHz | ±10ppm | LVCMOS, LVTTL | Enable/Disable | MEMS | 33mA | 31mA | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | -- | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | 0.039 (1.00mm) | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XAZU3EG-L1SFVA625I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 625-FCBGA (21x21) | XAZU3 | AMD | 128 | Tray | Active | -40°C ~ 85°C | Tape & Reel (TR) | SiT8208 | 0.126 L x 0.098 W (3.20mm x 2.50mm) | Active | XO (Standard) | 1.8V | 4MHz | ±10ppm | LVCMOS, LVTTL | Enable/Disable | MEMS | 31mA | 30mA | 500MHz, 1.2GHz | 1.8MB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, I²C, SPI, UART/USART, USB | MPU, FPGA | 1L | -- | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | 0.032 (0.80mm) | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005-VFG256I | Microchip | Datasheet | 24 | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 256-FPBGA (14x14) | M2S005 | Microchip Technology / Atmel | 64 kB | 191 kbit | 119 | - | - | Microchip | 166 MHz | + 100 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 161 I/O | 505 LAB | 6060 LE | Tray | Active | Details | -40°C ~ 85°C | Tape & Reel (TR) | SiT8209 | 0.276 L x 0.197 W (7.00mm x 5.00mm) | Active | XO (Standard) | SOC - Systems on a Chip | 3.3V | 133.3333MHz | ±10ppm | LVCMOS, LVTTL | Enable/Disable | MEMS | 36mA | 1.2 V | 31mA | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | SoC FPGA | STD | -- | FPGA - 5K Logic Modules | 1 Core | 128KB | SoC FPGA | 0.039 (1.00mm) | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU4EV-2FBVB900E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 900-FCBGA (31x31) | XCZU4 | AMD | 204 | Tray | Active | -40°C ~ 85°C | Tape & Reel (TR) | SiT8209 | 0.126 L x 0.098 W (3.20mm x 2.50mm) | Active | XO (Standard) | 1.8V | 133.3333MHz | ±10ppm | LVCMOS, LVTTL | Enable/Disable | MEMS | 33mA | 30mA | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | -- | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | 0.032 (0.80mm) | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU19EG-3FFVD1760E | AMD | Datasheet | 656 | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 1760-FCBGA (42.5x42.5) | XCZU19 | AMD | 308 | Tray | Active | -40°C ~ 85°C | Tape & Reel (TR) | SiT8209 | 0.126 L x 0.098 W (3.20mm x 2.50mm) | Active | XO (Standard) | 1.8V | 125MHz | ±10ppm | LVCMOS, LVTTL | Enable/Disable | MEMS | 33mA | 30mA | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | -- | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | 0.032 (0.80mm) | -- |
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5CSEBA2U19C8N
ALTERA
Package:Embedded - System On Chip (SoC)
94.768303
-
10AS027H2F34I1SG
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFA022R25A2E4F
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU19EG-2FFVE1924I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFB022R25A3E4X
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU6CG-2FFVC900E
AMD
Package:Embedded - System On Chip (SoC)
2,947.845562
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AGFB027R25A2I3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010S-1FGG484I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S150S-1FC1152I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA012R24B2I3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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LS1046AAN3Q1A
Teledyne LeCroy
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5CSXFC6C6U23I7NTS
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XC7Z100-1FFG1156I
AMD
Package:Embedded - System On Chip (SoC)
3,237.032592
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XC7Z030-1FFG676C
AMD
Package:Embedded - System On Chip (SoC)
372.452455
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XC7Z035-1FFG676C
AMD
Package:Embedded - System On Chip (SoC)
1,308.915834
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XCZU19EG-L2FFVD1760E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XAZU3EG-L1SFVA625I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005-VFG256I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU4EV-2FBVB900E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU19EG-3FFVD1760E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire