The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Number of Pins | Contact Shape | Shell Material | Supplier Device Package | Weight | Insert Material | Number of Terminals | Base Product Number | Clock Frequency-Max | Contact Sizes | Ihs Manufacturer | Lead Free Status / RoHS Status | Manufacturer | Manufacturer Part Number | Mfr | Moisture Sensitivity Levels | Number of I/Os | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Operating Temperature | Packaging | Series | Size / Dimension | Part Status | Moisture Sensitivity Level (MSL) | Connector Type | Type | Number of Positions | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Fastening Type | Subcategory | Contact Type | Technology | Voltage - Supply | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Reach Compliance Code | Frequency | Frequency Stability | Base Part Number | Shell Finish | Shell Size - Insert | JESD-30 Code | Number of Outputs | Qualification Status | Housing Color | Operating Supply Voltage | ESR (Equivalent Series Resistance) | Power Supplies | Temperature Grade | Note | Load Capacitance | Speed | RAM Size | Operating Mode | Shell Size, MIL | Core Processor | Frequency Tolerance | Peripherals | Connectivity | Current - Supply | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Tool Type | Includes | Speed Grade | Primary Attributes | Number of Registers | Number of CLBs | Number of Logic Cells | End - Size | Number of Equivalent Gates | Flash Size | Features | Count | Height Seated (Max) | Length | Width | Material Flammability Rating |
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 | Mfr Part No XCZU28DR-L1FFVE1156I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | AFD57 | TE Connectivity Deutsch Connectors | Bag | Active | Tray | MIL-DTL-26482 G Series II, AFD | Active | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-1PQG208I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Panel Mount | 208-BFQFP | YES | Flange | Circular | Composite | 208-PQFP (28x28) | Plastic | 208 | A2F500 | 100 MHz | 20 | MICROSEMI CORP | -- | Microsemi Corporation | A2F500M3G-1PQG208I | Microchip Technology | 3 | MCU - 22, FPGA - 66 | Tray | PLASTIC/EPOXY | FQFP | FQFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Active | Active | 30 | 5.59 | Yes | 1.575 V | 1.425 V | 1.5 V | -65°C ~ 175°C | Bulk | MIL-DTL-38999 Series III, ACT | Active | -- | Receptacle Housing | For Female Sockets | 10 | Pure Matte Tin (Sn) | 8542.39.00.01 | Threaded | Field Programmable Gate Arrays | Crimp | CMOS | QUAD | B | GULL WING | Shielded | 245 | Environment Resistant | 0.5 mm | compliant | Chromate over Cadmium | 13-98 | S-PQFP-G208 | 66 | Not Qualified | Olive Drab | 1.5,1.8,2.5,3.3 V | Contacts Not Included | 100MHz | 64KB | C | ARM® Cortex®-M3 | DMA, POR, WDT | Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 66 | 11520 CLBS, 500000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | -- | 1 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | 11520 | 500000 | 512KB | -- | 28 mm | 28 mm | -- | |||||||||||||||||||||||||
| Mfr Part No PIMX8QM5AVUDDAA | NXP | Datasheet | 115 | - | Min: 1 Mult: 1 | Panel Mount | Flange | Circular | Composite | Plastic | 12 (12), 16 (12) | -- | -65°C ~ 200°C | Bulk | MIL-DTL-38999 Series III, ACT | Active | -- | Receptacle Housing | For Female Sockets | 24 | Threaded | Crimp | A | Shielded | Environment Resistant | Electroless Nickel | 25-24 | Silver | Contacts Not Included | J | -- | -- | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS022C4U19I3SG | ALTERA | Datasheet | 778 |
| Min: 1 Mult: 1 | Surface Mount | 6-CLCC | YES | 484 | 6-CLCC (7x5) | 484 | INTEL CORP | Intel Corporation | 10AS022C4U19I3SG | 192 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA484,22X22,32 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | NOT SPECIFIED | 5.46 | Compliant | Yes | 0.93 V | 0.87 V | 0.9 V | -40°C ~ 85°C | Tape & Reel (TR) | FemtoClock® NG | Active | VCXO | 100 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 2.375 V ~ 2.625 V | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | 155.52MHz | IDT8N3SV75LC | S-PBGA-B484 | 192 | Not Qualified | 1.8 V | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 120mA | MCU, FPGA | 192 | 3.25 mm | FIELD PROGRAMMABLE GATE ARRAY | 3 | FPGA - 220K Logic Elements | 334920 | 220000 | -- | -- | 19 mm | 19 mm | |||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1502-1LSIVFVC1760 | AMD | Datasheet | 425 |
| Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 500 | Tray | Active | Non-Compliant | Versal™ Prime | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BCM3384EUKFSBGB0T | Broadcom | Datasheet | - | - | Min: 1 Mult: 1 | -- | Broadcom Limited | Tray | Obsolete | -- | Active | Wrench Set | 1-1/8 ~ 1-1/2 | Set of 5, Angled 15° | Assorted | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU6EG-3FFVC900E | AMD | Datasheet | 546 | - | Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU6 | AMD | 204 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3 | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU2EG-L1SFVA625I | AMD | Datasheet | 2217 |
| Min: 1 Mult: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | XCZU2 | AMD | 180 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU17EG-1FFVC1760I | AMD | Datasheet | 747 | - | Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD | 512 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1902-2MLIVIVA1596 | AMD | Datasheet | 721 |
| Min: 1 Mult: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | AMD | 500 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1802-1MLIVSVD1760 | AMD | Datasheet | 734 |
| Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 692 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XAZU11EG-1FFVF1517I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | 464 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU6EG-2FFVC900I | AMD | Datasheet | 564 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU6 | AMD | 204 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU6CG-L2FFVC900E | AMD | Datasheet | 748 | - | Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU6 | AMD | 204 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU9CG-L1FFVB1156I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | XCZU9 | AMD | 328 | Bulk | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010-1VFG400I | Microchip | Datasheet | 32 | - | Min: 1 Mult: 1 | 400-LFBGA | 400-VFBGA (17x17) | M2S010 | Microchip Technology | 195 | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 10K Logic Modules | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090TS-FG484IX456 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | Suntsu Electronics, Inc. | Bulk | Active | -20°C ~ 70°C | SXT324 | 0.126 L x 0.098 W (3.20mm x 2.50mm) | MHz Crystal | 40 MHz | ±25ppm | 40 Ohms | 8pF | Fundamental | ±25ppm | 0.031 (0.80mm) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-L1FSVG1517I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | Glenair | 561 | Retail Package | Active | -40°C ~ 100°C (TJ) | * | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU7EG-L2FFVC1156E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | MB9BF003 | Infineon Technologies | 360 | Bulk | Obsolete | 0°C ~ 100°C (TJ) | * | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU7CG-L1FFVF1517I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | XCZU7 | Amphenol Positronic | 464 | Bulk | Active | -40°C ~ 100°C (TJ) | * | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - |
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XCZU28DR-L1FFVE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F500M3G-1PQG208I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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PIMX8QM5AVUDDAA
NXP
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS022C4U19I3SG
ALTERA
Package:Embedded - System On Chip (SoC)
771.257327
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XCVM1502-1LSIVFVC1760
AMD
Package:Embedded - System On Chip (SoC)
9,939.791964
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BCM3384EUKFSBGB0T
Broadcom
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU6EG-3FFVC900E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU2EG-L1SFVA625I
AMD
Package:Embedded - System On Chip (SoC)
433.956779
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XCZU17EG-1FFVC1760I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVC1902-2MLIVIVA1596
AMD
Package:Embedded - System On Chip (SoC)
41,228.149372
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XCVC1802-1MLIVSVD1760
AMD
Package:Embedded - System On Chip (SoC)
30,870.596508
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XAZU11EG-1FFVF1517I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU6EG-2FFVC900I
AMD
Package:Embedded - System On Chip (SoC)
4,098.617379
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XCZU6CG-L2FFVC900E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU9CG-L1FFVB1156I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010-1VFG400I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S090TS-FG484IX456
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU48DR-L1FSVG1517I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU7EG-L2FFVC1156E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU7CG-L1FFVF1517I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire