The category is 'Embedded - System On Chip (SoC)'
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- Package / Case
- Number of I/Os
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- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Number of Pins | Contact Shape | Shell Material | Supplier Device Package | Weight | Insert Material | Number of Terminals | Base Product Number | Brand | Clock Frequency-Max | Contact Finish Mating | Contact Materials | Contact Sizes | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Lead Free Status / RoHS Status | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Primary Material | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Voltage, Rating | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Termination | Temperature Coefficient | Connector Type | Type | Resistance | Number of Positions | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Composition | Color | Applications | Power (Watts) | HTS Code | Fastening Type | Subcategory | Contact Type | Current Rating (Amps) | Technology | Voltage - Supply | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Shell Finish | Shell Size - Insert | JESD-30 Code | Number of Outputs | Qualification Status | Housing Color | Operating Supply Voltage | Failure Rate | Power Supplies | Temperature Grade | Note | Interface | Speed | RAM Size | Current - Reverse Leakage @ Vr | Shell Size, MIL | Voltage - Forward (Vf) (Max) @ If | Core Processor | Peripherals | Program Memory Type | Program Memory Size | Connectivity | Current - Supply | Architecture | Operating Temperature - Junction | Number of Inputs | Organization | Seated Height-Max | Voltage - DC Reverse (Vr) (Max) | Current - Average Rectified (Io) | Programmable Logic Type | Tool Type | Product Type | Includes | Capacitance @ Vr, F | Speed Grade | Number of Transceivers | Primary Attributes | Number of Registers | Number of CLBs | Number of Logic Cells | Number of Cores | End - Size | Number of Equivalent Gates | Flash Size | Controller Series | Features | Product Category | Count | Height Seated (Max) | Length | Width | Contact Finish Thickness - Mating | Material Flammability Rating | Ratings |
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![]() | Mfr Part No 10AS027E1F29E1HG | ALTERA | Datasheet | 694 |
| Min: 1 Mult: 1 | Panel Mount, Through Hole | 780-BBGA, FCBGA | Flange | Stainless Steel | 780-FBGA (29x29) | Intel / Altera | Gold | Copper Alloy | - | 36 | 2 x 32 kB | 2 x 32 kB | Intel | 1.2 GHz | + 100 C | Glenair | 0 C | Yes | SMD/SMT | 360 | 33750 LAB | 270000 LE | Retail Package | 965040 | Metal | Active | Details | Arria 10 SoC | -65°C ~ 175°C | Tray | 806 | Active | Solder | Plug, Male Pins | Silver | Threaded | SOC - Systems on a Chip | B | Passivated | 22-28 | 950 mV | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | 12 Transceiver | FPGA - 270K Logic Elements | 2 Core | -- | Ground | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS022E4F29I3LG | ALTERA | Datasheet | 780 |
| Min: 1 Mult: 1 | Surface Mount | DO-214AC, SMA | SMA (DO-214AC) | Intel / Altera | - | 1 | 2 x 32 kB | 2 x 32 kB | Intel | 1.2 GHz | SMC Diode Solutions | Yes | SMD/SMT | 288 | 27500 LAB | 220000 LE | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | 965278 | Active | Details | This product may require additional documentation to export from the United States. | Arria 10 SoC | -40°C ~ 100°C (TJ) | Tray | * | Active | SOC - Systems on a Chip | Schottky | No Recovery Time > 500mA (Io) | 256KB | 500 µA @ 100 V | 850 mV @ 1 A | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | -55°C ~ 150°C | 100 V | 1A | SoC FPGA | 35pF @ 4V, 1MHz | FPGA - 220K Logic Elements | 2 Core | -- | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS032H4F34E3SG | ALTERA | Datasheet | 491 |
| Min: 1 Mult: 1 | Surface Mount | 48-VFQFN Exposed Pad | YES | 48-QFN (7x7) | 1152 | CY8C20646 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS032H4F34E3SG | 1.2 GHz | Infineon Technologies | Yes | SMD/SMT | 36 | 40000 LAB | 320000 LE | 100 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 964978 | Active | Obsolete | NOT SPECIFIED | 5.44 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -40°C ~ 85°C | Tray | CapSense® Controllers | Active | Capacitive Sensing | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | 1.71V ~ 5.5V | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 384 | Not Qualified | 0.9 V | OTHER | I²C, SPI, USB | 1.5GHz | 2K x 8 | M8C | DMA, POR, WDT | FLASH (16kB) | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 320K Logic Elements | 320000 | 2 Core | -- | CY8C20xx6A | SoC FPGA | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS016E3F29I2SG | ALTERA | Datasheet | 797 |
| Min: 1 Mult: 1 | 780-BBGA, FCBGA | YES | 780-FBGA (29x29) | 780 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS016E3F29I2SG | 1.2 GHz | Glenair | Yes | SMD/SMT | 288 | 20000 LAB | 160000 LE | 100 °C | -40 °C | Retail Package | PLASTIC/EPOXY | BGA | BGA, BGA780,28X28,40 | BGA780,28X28,40 | SQUARE | GRID ARRAY | 964682 | Active | Active | NOT SPECIFIED | 1.96 | Non-Compliant | Yes | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -40°C ~ 100°C (TJ) | Tray | * | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B780 | 288 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | 3.35 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 160K Logic Elements | 160000 | 2 Core | -- | SoC FPGA | 29 mm | 29 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No PIMX8QM6AVUFFAB | NXP | Datasheet | - | - | Min: 1 Mult: 1 | PEI-Genesis | Bulk | Active | * | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No BCM3384EUKFSBGB0T | Broadcom | Datasheet | - | - | Min: 1 Mult: 1 | -- | Broadcom Limited | Tray | Obsolete | -- | Active | Wrench Set | 1-1/8 ~ 1-1/2 | Set of 5, Angled 15° | Assorted | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU19EG-1FFVD1760I | AMD | Datasheet | 708 | - | Min: 1 Mult: 1 | Free Hanging (In-Line) | 1760-BBGA, FCBGA | - | Circular | Aluminum Alloy | 1760-FCBGA (42.5x42.5) | Plastic | KJB6T | 22D | ITT Cannon, LLC | 308 | Bulk | Active | -65°C ~ 175°C | KJB | Plug Housing | For Male Pins | 6 | Threaded | Crimp | C | Shielded | Environment Resistant | Cadmium over Electroless Nickel | 9-35 | Olive Drab | Contacts Not Included | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | Coupling Nut | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU5EV-2FBVB900I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU5 | PEI-Genesis | 204 | Bulk | Active | -40°C ~ 100°C (TJ) | * | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU7CG-L1FFVF1517I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | XCZU7 | Amphenol Positronic | 464 | Bulk | Active | -40°C ~ 100°C (TJ) | * | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU47DR-L2FSVG1517I | AMD | Datasheet | 600 |
| Min: 1 Mult: 1 | Free Hanging (In-Line) | 1517-BBGA, FCBGA | - | Aluminum Alloy | 1517-FCBGA (40x40) | CA310 | Silver | ITT Cannon, LLC | 561 | Bulk | Metal | Active | 50V | -55°C ~ 125°C | MIL-DTL-5015, CA-B | Solder Cup | Plug, Female Sockets | 5 | Olive Drab | Reverse Bayonet Lock | 41A, 245A | N (Normal) | - | IP67 - Dust Tight, Waterproof | Olive Drab Cadmium | 32-1 | 533MHz, 1.333GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC7Z045-3FFV676E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 676-BBGA, FCBGA | 676-FCBGA (27x27) | AMD | 130 | Bulk | Obsolete | 0°C ~ 100°C (TJ) | Zynq®-7000 | 1GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 350K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVC1502-1MSIVSVA2197 | AMD | Datasheet | 673 |
| Min: 1 Mult: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 586 | Tray | Active | Versal™ AI Core | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 800k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No BCM33843MRKFSBGB0T | Broadcom | Datasheet | - | - | Min: 1 Mult: 1 | - | - | BCM33843 | Broadcom Limited | - | Tray | Active | - | - | 2.4GHz, 5GHz | - | - | - | - | - | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGFB008R16A2E2V | Intel | Datasheet | 787 | - | Min: 1 Mult: 1 | 1206 (3216 Metric) | 1206 | RK73G2B | KOA Speer Electronics, Inc. | 384 | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | Active | -55°C ~ 155°C | RK73G-RT | 0.126 L x 0.063 W (3.20mm x 1.60mm) | ±0.5% | 2 | ±50ppm/°C | 56.2 Ohms | Thick Film | 0.25W, 1/4W | - | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | Anti-Sulfur, Automotive AEC-Q200 | 0.028 (0.70mm) | AEC-Q200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A2F500M3G-1PQG208I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Panel Mount | 208-BFQFP | YES | Flange | Circular | Composite | 208-PQFP (28x28) | Plastic | 208 | A2F500 | 100 MHz | 20 | MICROSEMI CORP | -- | Microsemi Corporation | A2F500M3G-1PQG208I | Microchip Technology | 3 | MCU - 22, FPGA - 66 | Tray | PLASTIC/EPOXY | FQFP | FQFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Active | Active | 30 | 5.59 | Yes | 1.575 V | 1.425 V | 1.5 V | -65°C ~ 175°C | Bulk | MIL-DTL-38999 Series III, ACT | Active | -- | Receptacle Housing | For Female Sockets | 10 | Pure Matte Tin (Sn) | 8542.39.00.01 | Threaded | Field Programmable Gate Arrays | Crimp | CMOS | QUAD | B | GULL WING | Shielded | 245 | Environment Resistant | 0.5 mm | compliant | Chromate over Cadmium | 13-98 | S-PQFP-G208 | 66 | Not Qualified | Olive Drab | 1.5,1.8,2.5,3.3 V | Contacts Not Included | 100MHz | 64KB | C | ARM® Cortex®-M3 | DMA, POR, WDT | Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 66 | 11520 CLBS, 500000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | -- | 1 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | 11520 | 500000 | 512KB | -- | 28 mm | 28 mm | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No PIMX8QM5AVUDDAA | NXP | Datasheet | 115 | - | Min: 1 Mult: 1 | Panel Mount | Flange | Circular | Composite | Plastic | 12 (12), 16 (12) | -- | -65°C ~ 200°C | Bulk | MIL-DTL-38999 Series III, ACT | Active | -- | Receptacle Housing | For Female Sockets | 24 | Threaded | Crimp | A | Shielded | Environment Resistant | Electroless Nickel | 25-24 | Silver | Contacts Not Included | J | -- | -- | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS022C4U19I3SG | ALTERA | Datasheet | 778 |
| Min: 1 Mult: 1 | Surface Mount | 6-CLCC | YES | 484 | 6-CLCC (7x5) | 484 | INTEL CORP | Intel Corporation | 10AS022C4U19I3SG | 192 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA484,22X22,32 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | NOT SPECIFIED | 5.46 | Compliant | Yes | 0.93 V | 0.87 V | 0.9 V | -40°C ~ 85°C | Tape & Reel (TR) | FemtoClock® NG | Active | VCXO | 100 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 2.375 V ~ 2.625 V | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | 155.52MHz | IDT8N3SV75LC | S-PBGA-B484 | 192 | Not Qualified | 1.8 V | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 120mA | MCU, FPGA | 192 | 3.25 mm | FIELD PROGRAMMABLE GATE ARRAY | 3 | FPGA - 220K Logic Elements | 334920 | 220000 | -- | -- | 19 mm | 19 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S150T-FCG1152I | Microchip | Datasheet | 2125 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | M2S150 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S150T-FCG1152I | 166 MHz | + 100 C | Microchip Technology | - 40 C | 4 | SMD/SMT | 574 | 146124 LE | Tray | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 5.77 | Non-Compliant | Yes | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | 40 | S-PBGA-B1152 | 574 | Not Qualified | 1.2 V | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S025T-FGG484 | Microchip | Datasheet | 2186 |
| Min: 1 Mult: 1 | FPBGA-484 | 484-FPBGA (23x23) | M2S025 | Microchip Technology / Atmel | 64 kB | 60 | - | - | Microchip | 166 MHz | 1.26 V | + 85 C | Microchip Technology | 1.14 V | 0 C | Yes | SMD/SMT | 273 I/O | 2308 LAB | 27696 LE | Tray | Active | Details | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | SOC - Systems on a Chip | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | SoC FPGA | STD | FPGA - 25K Logic Modules | 1 Core | 256KB | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S060-1FCSG325 | Microchip | Datasheet | 1631 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | 325-FCBGA (11x11) | M2S060 | 64 kB | - | - | Miscellaneous | 166 MHz | Microchip Technology | 200 | 56520 LE | Tray | Active | Compliant | 1.2000 V | 0 to 85 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 60K Logic Modules | 1 Core | 256KB |
10AS027E1F29E1HG
ALTERA
Package:Embedded - System On Chip (SoC)
1,956.438029
10AS022E4F29I3LG
ALTERA
Package:Embedded - System On Chip (SoC)
1,163.842078
10AS032H4F34E3SG
ALTERA
Package:Embedded - System On Chip (SoC)
1,416.909262
10AS016E3F29I2SG
ALTERA
Package:Embedded - System On Chip (SoC)
875.062355
PIMX8QM6AVUFFAB
NXP
Package:Embedded - System On Chip (SoC)
Price: please inquire
BCM3384EUKFSBGB0T
Broadcom
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCZU19EG-1FFVD1760I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCZU5EV-2FBVB900I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCZU7CG-L1FFVF1517I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCZU47DR-L2FSVG1517I
AMD
Package:Embedded - System On Chip (SoC)
34,419.353505
XC7Z045-3FFV676E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVC1502-1MSIVSVA2197
AMD
Package:Embedded - System On Chip (SoC)
21,228.762446
BCM33843MRKFSBGB0T
Broadcom
Package:Embedded - System On Chip (SoC)
Price: please inquire
AGFB008R16A2E2V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
A2F500M3G-1PQG208I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
PIMX8QM5AVUDDAA
NXP
Package:Embedded - System On Chip (SoC)
Price: please inquire
10AS022C4U19I3SG
ALTERA
Package:Embedded - System On Chip (SoC)
771.257327
M2S150T-FCG1152I
Microchip
Package:Embedded - System On Chip (SoC)
519.887643
M2S025T-FGG484
Microchip
Package:Embedded - System On Chip (SoC)
130.063073
M2S060-1FCSG325
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
