The category is 'Embedded - System On Chip (SoC)'
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- Package / Case
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- Peripherals
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- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mount | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Dielectric Material | Housing Material | Number of Terminals | Base Product Number | Brand | Data RAM Size | Device Logic Units | Factory Pack QuantityFactory Pack Quantity | I/O Voltage | Ihs Manufacturer | Instruction Set Architecture | L1 Cache Data Memory | L1 Cache Instruction Memory | Lead Free Status / RoHS Status | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Number of User I/Os | Maximum Operating Supply Voltage | Mfr | Minimum Operating Supply Voltage | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Number of CPU Cores | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Number of Outlets | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage | Usage Level | Voltage Rating (DC) | Voltage Rating AC | Voltage Rating DC | Voltage, Rating | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | Part Status | Moisture Sensitivity Level (MSL) | Termination | Max Operating Temperature | Min Operating Temperature | Applications | Capacitance | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Depth | Reach Compliance Code | Base Part Number | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Case Code (Metric) | Case Code (Imperial) | Operating Supply Voltage | Dielectric | Lead Spacing | Power Supplies | Temperature Grade | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Data Bus Width | Number of Inputs | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Total RAM Bits | Number of LABs/CLBs | Screening Level | Speed Grade | Primary Attributes | Number of Registers | Number of Logic Cells | Number of Cores | Flash Size | Features | Product Category | IP Rating | Height Seated (Max) | Length | Width | Thickness | Radiation Hardening | Ratings |
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 | Mfr Part No XCZU6CG-L1FFVC900I | AMD | Datasheet | 746 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU6 | 0.892 V | AMD | 0.808 V | 204 | Tray | Active | 0.8500 V | -40 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1L | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z045-1FBG676C | AMD | Datasheet | 656 |
| Min: 1 Mult: 1 | 676-BBGA, FCBGA | 676-FCBGA (27x27) | XC7Z045 | 1.2, 3.3 V | Thumb-2 | AMD | Surface Mount | 2 | 130 | Tray | Active | 0 to 85 °C | Zynq®-7000 | 676 | 1 V | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32 Bit | Kintex™-7 FPGA, 350K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU2CG-2SBVA484E | AMD | Datasheet | 1840 | - | Min: 1 Mult: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | XCZU2 | 0.892 V | AMD | 0.808 V | 82 | Tray | Active | 0.8500 V | 0 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU6EG-2FFVB1156E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | XCZU6 | 0.892 V | AMD | 0.808 V | 328 | Tray | Active | 0.85 V | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA022R31C2E3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Aluminum | Grace Technologies | P-P22#2R2-M3RUV0 | Intel | 720 | (2) Universal International Receptacles | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | IP65 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB006R16A3E3E | Intel | Datasheet | 568 |
| Min: 1 Mult: 1 | - | - | PEI-Genesis | 384 | Bulk | Active | 0°C ~ 100°C (TJ) | * | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S100-FCG1152 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1152 | MICROSEMI CORP | Microsemi Corporation | M2S100-FCG1152 | 4 | 85 °C | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | NOT SPECIFIED | 5.8 | Yes | 1.26 V | 1.14 V | 1.2 V | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 574 | Not Qualified | 1.2 V | OTHER | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | 99512 | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU4EG-L1FBVB900I | AMD | Datasheet | 428 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU4 | 192,150 | 204 | 0.892 V | AMD | 0.808 V | 204 | Tray | Active | FCBGA | 0.8500 V | Industrial grade | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Industrial | 1L | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | 175,680 | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-TQG144 | Microchip | Datasheet | 184 | - | Min: 1 Mult: 1 | 144-LQFP | 144-TQFP (20x20) | M2S005 | Microchip Technology / Atmel | 64 kB | 60 | - | - | Microchip | 166 MHz | Microchip Technology | Yes | 84 | 505 LAB | 6060 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | SOC - Systems on a Chip | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | SoC FPGA | STD | FPGA - 5K Logic Modules | 1 Core | 128KB | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU4EV-L1FBVB900I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU4 | 0.892 V | AMD | 0.808 V | 204 | Tray | Active | 0.85 V | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EV | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1L | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU15EG-3FFVB1156E | AMD | Datasheet | 662 |
| Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | XCZU15 | 0.927 V | AMD | 0.873 V | 328 | Tray | Active | 0.9000 V | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3 | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z007S-1CLG400C5283 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 1152-BBGA, FCBGA | 1152-HBGA, FC (42.5x42.5) | 744 | -40°C ~ 100°C (TJ) | STRATIX® IV E | Active | 0.87 V ~ 0.93 V | EP4SE820 | 813050 | 34093056 | 32522 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No GUT2100 S LKJQ | Intel | Datasheet | 171 | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-2FSVE1156I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | 366 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU15EG-L2FFVC900E | AMD | Datasheet | 541 |
| Min: 1 Mult: 1 | Through Hole | Radial | 900-FCBGA (31x31) | Polypropylene (PP), Metallized | XCZU15 | -- | AMD | 204 | Tray | Active | 900V | 2500V (2.5kV) | -55°C ~ 110°C | Tray | MKP385 | 1.024 L x 0.236 W (26.00mm x 6.00mm) | ±5% | Active | -- | PC Pins | DC Link, DC Filtering; High Frequency, Switching; High Pulse, DV/DT | 620pF | 0.886 (22.50mm) | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | - | -- | 0.472 (12.00mm) | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU7EV-3FFVC1156E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | XCZU7 | AMD | 360 | Tray | Active | Compliant | 100 V | 100 V | 0°C ~ 100°C (TJ) | Tape & Reel | Zynq® UltraScale+™ MPSoC EV | SMD/SMT | 125 °C | -55 °C | 4.3 pF | 810 µm | 1608 | 0603 | C0G | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | 1.6 mm | 812.8 µm | 889 µm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No NRF52832-QFWC-R | Nordic | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU25DR-L2FSVE1156I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 075577 | Molex | Bulk | Active | Tray | * | Active | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU28DR-L1FFVE1156I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | AFD57 | TE Connectivity Deutsch Connectors | Bag | Active | Tray | MIL-DTL-26482 G Series II, AFD | Active | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU46DR-L1FSVH1760I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD | 574 | Tray | Active | Non-Compliant | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - |
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XCZU6CG-L1FFVC900I
AMD
Package:Embedded - System On Chip (SoC)
2,933.375748
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XC7Z045-1FBG676C
AMD
Package:Embedded - System On Chip (SoC)
1,271.350211
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XCZU2CG-2SBVA484E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU6EG-2FFVB1156E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA022R31C2E3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFB006R16A3E3E
Intel
Package:Embedded - System On Chip (SoC)
5,955.303937
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M2S100-FCG1152
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU4EG-L1FBVB900I
AMD
Package:Embedded - System On Chip (SoC)
1,851.845186
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M2S005S-TQG144
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU4EV-L1FBVB900I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU15EG-3FFVB1156E
AMD
Package:Embedded - System On Chip (SoC)
8,300.331752
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XC7Z007S-1CLG400C5283
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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GUT2100 S LKJQ
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU48DR-2FSVE1156I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU15EG-L2FFVC900E
AMD
Package:Embedded - System On Chip (SoC)
6,765.188990
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XCZU7EV-3FFVC1156E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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NRF52832-QFWC-R
Nordic
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU25DR-L2FSVE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU28DR-L1FFVE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU46DR-L1FSVH1760I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire