The category is 'Embedded - System On Chip (SoC)'
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- Package / Case
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | 1st Connector Mounting Type | Cable Material | 2nd Connector Mounting Type | Base Product Number | Brand | Cable Types | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Operating Temperature | Packaging | Series | Size / Dimension | Part Status | Termination | Connector Type | Type | Number of Positions | Max Operating Temperature | Min Operating Temperature | Color | Gender | HTS Code | Fastening Type | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Reach Compliance Code | Frequency | Frequency Stability | Base Part Number | Output | JESD-30 Code | Function | Base Resonator | Current - Supply (Max) | Number of Outputs | Qualification Status | Approval Agency | Number of Contacts | Operating Supply Voltage | Power Supplies | Temperature Grade | Current - Supply (Disable) (Max) | Interface | Memory Size | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Spread Spectrum Bandwidth | Connectivity | Usage | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | 1st Connector Gender | 1st Connector Number of Positions Loaded | 1st Connector Type | 1st Connector Number of Positions | Assembly Configuration | Core Architecture | 2nd Connector Type | 1st Connector Orientation | Display Type | 1st Connector Shell Size - Insert | Speed Grade | Number of Transceivers | Absolute Pull Range (APR) | 2nd Connector Gender | Primary Attributes | Number of Logic Cells | Number of Characters Per Row | Number of Cores | 2nd Connector Number of Positions | Communications | 2nd Connector Number of Positions Loaded | 2nd Connector Orientation | Number of Inputs and Type | Number of Outputs and Type | Flash Size | 2nd Connector Shell Size - Insert | Expandable | Software | Connection Type | Features | Product Category | Height Seated (Max) | Length | Width | Ratings |
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 | Mfr Part No AGFB027R25A2I3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | DIN Rail | - | - | - | Panasonic Industrial Automation Sales | 624 | Bulk | Active | 0°C ~ 55°C | FP7 | 20.4 ~ 28.8VDC | - | CE, cULus, KC | 16K Words | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | No Display | FPGA - 2.7M Logic Elements | - | RS-232C, Option Cards Available | Option Cards Available | Option Cards Available | - | 16 Modules Max | FPWINGR7, FPWINPRO7 | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEBA2U19C8N | ALTERA | Datasheet | 1440 |
| Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | YES | 484 | 484-UBGA (19x19) | 484 | SG-8101 | INTEL CORP | Intel Corporation | 5CSEBA2U19C8N | EPSON | MCU - 151, FPGA - 66 | 85 °C | Tape & Reel (TR) | PLASTIC/EPOXY | FBGA | FBGA, BGA484,22X22,32 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | Active | NOT SPECIFIED | 2 | Compliant | Yes | FPGA - Field Programmable Gate Array CycloneV SoC SE dual -core ARM Cortex-A9 | 1.13 V | 1.07 V | 1.1 V | -40°C ~ 105°C | Tray | SG-8101 | 0.197 L x 0.126 W (5.00mm x 3.20mm) | Active | XO (Standard) | 85 °C | 0 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.8V ~ 3.3V | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | 12.223 MHz | ±20ppm | 5CSEBA2 | CMOS | S-PBGA-B484 | Standby (Power Down) | Crystal | 6.8mA (Typ) | 66 | Not Qualified | 1.1 V | 1.1,1.2/3.3,2.5 V | OTHER | 1.1µA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.5 MB | 600MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 66 | 1.9 mm | FIELD PROGRAMMABLE GATE ARRAY | 25000 | ARM | - | FPGA - 25K Logic Elements | 25000 | -- | 0.051 (1.30mm) | 19 mm | 19 mm | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS027H2F34I1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FBGA (35x35) | 1152 | Free Hanging (In-Line) | Polyvinyl Chloride (PVC) | Free Hanging (In-Line) | Round | INTEL CORP | Intel Corporation | 10AS027H2F34I1SG | Tripp Lite | 384 | 100 °C | -40 °C | Box | PLASTIC/EPOXY | BGA | 35 X 35 MM, ROHS COMPLIANT, FBGA-1152 | SQUARE | GRID ARRAY | Obsolete | Active | 5.64 | Non-Compliant | Yes | 0.93 V | 0.87 V | 0.9 V | -40°C ~ 100°C (TJ) | Tray | - | Discontinued at Digi-Key | Blue | 8542.39.00.01 | BOTTOM | BALL | Shielded | IP68 - Dust Tight, Waterproof | 1 mm | compliant | S-PBGA-B1152 | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | Male Pins | All | Receptacle, Right Angle | 8 | Standard | Receptacle | - | M12 | Male Pins | FPGA - 270K Logic Elements | 8 | All | - | -- | M12 | 32.8 (10.00m) | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-L1FFVG1517I | AMD | Datasheet | 643 |
| Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | 561 | Tray | Active | Non-Compliant | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LS1046AMN8T1A | Teledyne LeCroy | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1502-1LSIVFVC1760 | AMD | Datasheet | 425 |
| Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 500 | Tray | Active | Non-Compliant | Versal™ Prime | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1802-2MLIVSVD1760 | AMD | Datasheet | 732 |
| Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 692 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS032E1F29I1HG | ALTERA | Datasheet | 762 |
| Min: 1 Mult: 1 | 780-BBGA, FCBGA | 780-FBGA (29x29) | Intel / Altera | - | 36 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Puls | FPS300.246-049-102-PULS | 1.2 GHz | + 100 C | - 40 C | Yes | SMD/SMT | 360 | 40000 LAB | 320000 LE | 965336 | Active | 5.66 | Details | Yes | Arria 10 SoC | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | SOC - Systems on a Chip | unknown | 950 mV | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | 12 Transceiver | FPGA - 320K Logic Elements | 2 Core | -- | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS057H2F34E1HG | ALTERA | Datasheet | 576 |
| Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel / Altera | - | 24 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | IXYS | MCC310-12IO1 | 1.2 GHz | + 100 C | 0 C | Yes | SMD/SMT | 492 | 71250 LAB | 570000 LE | 964911 | Active | 5.66 | Details | Yes | This product may require additional documentation to export from the United States. | Arria 10 SoC | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | SOC - Systems on a Chip | unknown | 950 mV | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | 24 Transceiver | FPGA - 570K Logic Elements | 2 Core | -- | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS016E3F27E1HG | ALTERA | Datasheet | 608 |
| Min: 1 Mult: 1 | 672-BBGA, FCBGA | 672-FBGA (27x27) | Intel / Altera | - | 40 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Johnson Controls | VG1245AFH943BUA | 1.2 GHz | + 100 C | 0 C | Yes | SMD/SMT | 240 | 20000 LAB | 160000 LE | 964703 | Active | 5.67 | Details | Yes | Arria 10 SoC | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | SOC - Systems on a Chip | unknown | 950 mV | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | 12 Transceiver | FPGA - 160K Logic Elements | 2 Core | -- | Threaded | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU17EG-1FFVC1760I | AMD | Datasheet | 747 | - | Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD | 512 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1902-2MLIVIVA1596 | AMD | Datasheet | 721 |
| Min: 1 Mult: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | AMD | 500 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1802-1MLIVSVD1760 | AMD | Datasheet | 734 |
| Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 692 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XAZU11EG-1FFVF1517I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | 464 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU2EG-1SBVA484I | AMD | Datasheet | 2343 |
| Min: 1 Mult: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | XCZU2 | AMD | 82 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z030-1FB484I | AMD | Datasheet | 2193 |
| Min: 1 Mult: 1 | Gold | Free Hanging | 484-BBGA, FCBGA | 66 | 484-FCBGA (23x23) | XC7Z030 | AMD | 130 | Bulk | Active | Non-Compliant | -40°C ~ 100°C (TJ) | Bulk | Zynq®-7000 | Crimp | Plug | 66 | 175 °C | -65 °C | Male | Threaded | 66 | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 125K Logic Cells | - | Shielded | Environment Resistant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z007S-2CLG225I | AMD | Datasheet | 9 |
| Min: 1 Mult: 1 | 225-LFBGA, CSPBGA | 225-CSPBGA (13x13) | XC7Z007 | AMD | 54 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq®-7000 | 766MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 23K Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU3EG-2SFVA625I | AMD | Datasheet | 401 | - | Min: 1 Mult: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | XCZU3 | AMD | 180 | Tray | Active | Non-Compliant | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU9CG-1FFVB1156I | AMD | Datasheet | 792 |
| Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 1156-FCBGA (35x35) | XCZU9 | AMD | 328 | Tray | Active | -20°C ~ 70°C | Tape & Reel (TR) | SiT8208 | 0.106 L x 0.094 W (2.70mm x 2.40mm) | Active | XO (Standard) | 3.3V | 16MHz | ±10ppm | LVCMOS, LVTTL | Enable/Disable | MEMS | 33mA | 31mA | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | -- | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | 0.032 (0.80mm) | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA012R24C2I1V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.2M Logic Elements | - |
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AGFB027R25A2I3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5CSEBA2U19C8N
ALTERA
Package:Embedded - System On Chip (SoC)
94.768303
-
10AS027H2F34I1SG
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU48DR-L1FFVG1517I
AMD
Package:Embedded - System On Chip (SoC)
27,869.851546
-
LS1046AMN8T1A
Teledyne LeCroy
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1502-1LSIVFVC1760
AMD
Package:Embedded - System On Chip (SoC)
9,939.791964
-
XCVC1802-2MLIVSVD1760
AMD
Package:Embedded - System On Chip (SoC)
38,300.423971
-
10AS032E1F29I1HG
ALTERA
Package:Embedded - System On Chip (SoC)
3,014.458554
-
10AS057H2F34E1HG
ALTERA
Package:Embedded - System On Chip (SoC)
4,551.940115
-
10AS016E3F27E1HG
ALTERA
Package:Embedded - System On Chip (SoC)
1,039.367927
-
XCZU17EG-1FFVC1760I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1902-2MLIVIVA1596
AMD
Package:Embedded - System On Chip (SoC)
41,228.149372
-
XCVC1802-1MLIVSVD1760
AMD
Package:Embedded - System On Chip (SoC)
30,870.596508
-
XAZU11EG-1FFVF1517I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU2EG-1SBVA484I
AMD
Package:Embedded - System On Chip (SoC)
418.393592
-
XC7Z030-1FB484I
AMD
Package:Embedded - System On Chip (SoC)
406.735584
-
XC7Z007S-2CLG225I
AMD
Package:Embedded - System On Chip (SoC)
88.057554
-
XCZU3EG-2SFVA625I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU9CG-1FFVB1156I
AMD
Package:Embedded - System On Chip (SoC)
4,103.973877
-
AGFA012R24C2I1V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire