The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Brand | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Unit Weight | Voltage Rated | Voltage-Input | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | Part Status | Number of Terminations | Temperature Coefficient | Resistance | Max Operating Temperature | Min Operating Temperature | Composition | Applications | Power (Watts) | HTS Code | Capacitance | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Base Part Number | JESD-30 Code | Function | Number of Outputs | Qualification Status | Approval Agency | Efficiency | Operating Supply Voltage | Failure Rate | Lead Spacing | Power Supplies | Temperature Grade | Interface | Memory Size | Polarization | Current - Output (Max) | Speed | RAM Size | Lead Style | Core Processor | Peripherals | Program Memory Size | Connectivity | Input Type | Voltage - Output | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Core Architecture | Form | Region Utilized | Cord Length | Input Connector | Output Connector | Number of Transceivers | No Load Power Consumption | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Number of Taps/Steps | Number of Independent Delays | Delay to 1st Tap | Available Total Delays | Features | Tap Increment | Product Category | Height Seated (Max) | Length | Width | Thickness (Max) | Ratings |
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![]() | Mfr Part No XCZU25DR-1FFVE1156I | Xilinx | Datasheet | 601 | - | Min: 1 Mult: 1 | Tray | * | Active | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU27DR-L2FSVG1517I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Tray | * | Active | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGFA023R25A1I1V | Intel | Datasheet | 571 |
| Min: 1 Mult: 1 | Surface Mount | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8-uMAX/uSOP | DS1100 | Analog Devices Inc./Maxim Integrated | 480 | Tube | Obsolete | -40°C ~ 85°C | - | 4.75V ~ 5.25V | Nonprogrammable | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | 5 | 1 | 100ns | 500ns | 100 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGFC019R25A2I3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 0402 (1005 Metric) | 0402 | RN73H1E | KOA Speer Electronics, Inc. | 480 | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | Active | -55°C ~ 155°C | RN73H | 0.039 L x 0.020 W (1.00mm x 0.50mm) | ±0.5% | 2 | ±50ppm/°C | 10.1 Ohms | Metal Film | 0.063W, 1/16W | - | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | Automotive AEC-Q200, Moisture Resistant | 0.016 (0.40mm) | AEC-Q200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS022E3F29E1HG | ALTERA | Datasheet | 787 |
| Min: 1 Mult: 1 | 780-BBGA, FCBGA | 780-FBGA (29x29) | Intel / Altera | - | 36 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS022E3F29E1HG | 1.2 GHz | + 100 C | 0 C | Yes | SMD/SMT | 288 | 27500 LAB | 220000 LE | 973472 | Active | 5.67 | Details | Yes | Arria 10 SoC | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | SOC - Systems on a Chip | unknown | 950 mV | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | 12 Transceiver | FPGA - 220K Logic Elements | 2 Core | -- | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS057H2F34I2SG | ALTERA | Datasheet | 479 |
| Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | 121024 | Intel / Altera | - | 24 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS057H2F34I2SG | 1.2 GHz | Molex | Yes | SMD/SMT | 492 | 71250 LAB | 570000 LE | 100 °C | -40 °C | Bulk | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 965012 | Active | Active | NOT SPECIFIED | 5.45 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -40°C ~ 100°C (TJ) | Tray | * | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 492 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 570K Logic Elements | 570000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS048K4F35I3LG | ALTERA | Datasheet | 570 |
| Min: 1 Mult: 1 | YES | - | 1152 | INTEL CORP | Intel Corporation | 10AS048K4F35I3LG | Advantech Corp | 396 | 100 °C | -40 °C | Bulk | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Obsolete | NOT SPECIFIED | 5.47 | Yes | 0.93 V | 0.87 V | 0.9 V | 230VAC | - | Tray | - | 2.39 L x 2.01 W x 1.55 H (60.7mm x 51.1mm x 39.4mm) | Active | ITE (Commercial) | 6 W | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 396 | Not Qualified | CE, TUVgs | - | 0.9 V | INDUSTRIAL | Positive Tip, Negative Sleeve | 500mA | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Fixed Blade | 12V | MCU, FPGA | 396 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | Wall Mount (Class II) | Europe | 72 (1.83m) | CEE 7/16 | Phono Plug, 2.5mm O.D. x 11.5mm | - | FPGA - 480K Logic Elements | 480000 | -- | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS048K3F35I2SG | ALTERA | Datasheet | 771 |
| Min: 1 Mult: 1 | Axial | YES | Axial | 1152 | RNC60 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS048K3F35I2SG | 1.2 GHz | Vishay Dale | Yes | SMD/SMT | 396 | 60000 LAB | 480000 LE | 100 °C | -40 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 965306 | Active | Active | NOT SPECIFIED | 5.47 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -65°C ~ 175°C | Tray | Military, MIL-PRF-55182/03, RNC60 | 0.097 Dia x 0.280 L (2.46mm x 7.11mm) | ±0.1% | Active | 2 | ±50ppm/°C | 124 Ohms | Metal Film | 0.25W, 1/4W | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 396 | Not Qualified | M (1%) | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 480K Logic Elements | 480000 | 2 Core | -- | Military, Moisture Resistant, Weldable | SoC FPGA | - | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS066K3F35E2LG | ALTERA | Datasheet | 556 |
| Min: 1 Mult: 1 | 0805 (2012 Metric) | YES | 0805 | 1152 | Intel / Altera | - | 24 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS066K3F35E2LG | 1.2 GHz | Stackpole Electronics Inc | Yes | SMD/SMT | 396 | 82500 LAB | 660000 LE | 100 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 965076 | Active | Active | NOT SPECIFIED | 5.46 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -55°C ~ 155°C | Tray | RNCS | 0.079 L x 0.049 W (2.00mm x 1.25mm) | ±0.1% | Active | 2 | ±50ppm/°C | 15.4 kOhms | Thin Film | 0.1W, 1/10W | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 396 | Not Qualified | - | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 660K Logic Elements | 660000 | 2 Core | -- | Anti-Corrosive, Automotive AEC-Q200, Moisture Resistant | SoC FPGA | 0.026 (0.65mm) | 35 mm | 35 mm | AEC-Q200 | |||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVP1202-2MLEVSVA2785 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount, MLCC | 0805 (2012 Metric) | Vishay Vitramon | Tape & Reel (TR) | Obsolete | 50V | -55°C ~ 150°C | GA | 0.079 L x 0.049 W (2.00mm x 1.25mm) | ±0.1pF | C0G, NP0 | Automotive | 3.3 pF | - | - | - | Epoxy Mountable, High Temperature | - | 0.057 (1.45mm) | AEC-Q200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS027H4F34E3SG | ALTERA | Datasheet | 548 |
| Min: 1 Mult: 1 | FBGA-1152 | Intel / Altera | - | 1 | 2 x 32 kB | 2 x 32 kB | Intel | 1.2 GHz | Yes | SMD/SMT | 384 | 33750 LAB | 270000 LE | 965051 | Details | Arria 10 SoC | 1.784333 oz | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | SOC - Systems on a Chip | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | FPGA - 270K Logic Elements | 2 Core | -- | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 5CSEMA4U23C6N | ALTERA | Datasheet | 1621 |
| Min: 1 Mult: 1 | 672-FBGA | 484 | 672-UBGA (23x23) | MCU - 181, FPGA - 145 | Compliant | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | Active | 85 °C | 0 °C | 925 MHz | 5CSEMA4 | 1.1 V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 2.9 MB | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 40000 | ARM | FPGA - 40K Logic Elements | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS066N3F40I2SGES | ALTERA | Datasheet | 19 | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | YES | 1517-FCBGA (40x40) | 1517 | INTEL CORP | Intel Corporation | 10AS066N3F40I2SGES | 588 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | 5.66 | 0.93 V | 0.87 V | 0.9 V | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | Discontinued at Digi-Key | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 660K Logic Elements | -- | 40 mm | 40 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVC1502-2MSINSVG1369 | AMD | Datasheet | 652 |
| Min: 1 Mult: 1 | AMD | 478 | Tray | Active | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 800k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGIB022R31B2E3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 720 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex I | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPFS460TS-FC1152M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | Microchip Technology | 1 | Microchip | Microchip Technology | MCU - 136, FPGA - 468 | Tray | Active | Tray | PolarFire™ | SOC - Systems on a Chip | - | 3.95MB | RISC-V | DMA, PCI, PWM | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 461K Logic Modules | 128kB | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 1SX040HH3F35E3XG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel | 374 | Tray | Active | 0°C ~ 100°C (TJ) | Stratix® 10 SX | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 400K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVE1752-2MLINSVG1369 | AMD | Datasheet | 594 | - | Min: 1 Mult: 1 | AMD | 500 | Tray | Active | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC7Z045-2FFG676E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 676-BBGA, FCBGA | 676-FCBGA (27x27) | XC7Z045 | AMD | 130 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq®-7000 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 350K Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPFS250T-1FCG1152E | Microchip | Datasheet | 1991 |
| Min: 1 Mult: 1 | BGA-1152 | 1152-FCBGA (35x35) | Microchip Technology / Atmel | - | 1 | 4 x 32 kB | 16 kB, 4 x 32 kB | Microchip | 667 MHz, 667 MHz | + 100 C | Microchip Technology | 0 C | Yes | SMD/SMT | 372 I/O | 254000 LE | Tray | Active | This product may require additional documentation to export from the United States. | 0°C ~ 100°C | Tray | PolarFire™ | SOC - Systems on a Chip | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 5 Core | 128kB | SoC FPGA |
XCZU25DR-1FFVE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCZU27DR-L2FSVG1517I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
AGFA023R25A1I1V
Intel
Package:Embedded - System On Chip (SoC)
24,576.083838
AGFC019R25A2I3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
10AS022E3F29E1HG
ALTERA
Package:Embedded - System On Chip (SoC)
1,192.741066
10AS057H2F34I2SG
ALTERA
Package:Embedded - System On Chip (SoC)
4,055.307808
10AS048K4F35I3LG
ALTERA
Package:Embedded - System On Chip (SoC)
3,960.412137
10AS048K3F35I2SG
ALTERA
Package:Embedded - System On Chip (SoC)
4,064.269913
10AS066K3F35E2LG
ALTERA
Package:Embedded - System On Chip (SoC)
5,979.501498
XCVP1202-2MLEVSVA2785
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
10AS027H4F34E3SG
ALTERA
Package:Embedded - System On Chip (SoC)
1,351.309842
5CSEMA4U23C6N
ALTERA
Package:Embedded - System On Chip (SoC)
182.181622
10AS066N3F40I2SGES
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVC1502-2MSINSVG1369
AMD
Package:Embedded - System On Chip (SoC)
21,600.566025
AGIB022R31B2E3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
MPFS460TS-FC1152M
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
1SX040HH3F35E3XG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVE1752-2MLINSVG1369
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
XC7Z045-2FFG676E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
MPFS250T-1FCG1152E
Microchip
Package:Embedded - System On Chip (SoC)
432.554619
