The category is 'Embedded - System On Chip (SoC)'
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- Package / Case
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Number of Pins | Shell Material | Supplier Device Package | Insert Material | Number of Terminals | Backshell Material, Plating | Base Product Number | Brand | Case Code - in | Case Code - mm | Class | Clock Frequency-Max | Contact Finish Mating | Contact Materials | Data RAM Size | Dissipation Factor DF | Duty Cycle - Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Mounting Styles | MSL | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Primary Material | Product Status | Qualification | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Unit Weight | Voltage Rating DC | Voltage, Rating | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | JESD-609 Code | Part Status | Number of Terminations | Termination | Temperature Coefficient | Connector Type | Type | Resistance | Number of Positions | Terminal Finish | Composition | Color | Applications | Power (Watts) | HTS Code | Capacitance | Fastening Type | Subcategory | Current Rating (Amps) | Technology | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Reach Compliance Code | Current Rating | Frequency | Frequency Stability | Shell Finish | Shell Size - Insert | Termination Style | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Dielectric | Failure Rate | Lead Spacing | Power Supplies | Temperature Grade | Note | Ripple Current | Test Frequency | Speed | RAM Size | Shell Size, MIL | Core Processor | Peripherals | Program Memory Size | Connectivity | Cable Opening | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Product Type | ESR | Output Format | Primary Attributes | Number of CLBs | Number of Logic Cells | Number of Cores | Number of Equivalent Gates | Flash Size | Product | Features | Product Category | Diameter | Height | Height Seated (Max) | Length | Width | Contact Finish Thickness - Mating | Material Flammability Rating | Ratings |
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 | Mfr Part No XCZU3EG-1SFVC784I | AMD | Datasheet | 630 |
| Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | XCZU3 | AMD | 252 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB019R25A2E3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 480 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB022R31C3E3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 720 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS027H2F35I1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FBGA (35x35) | 1152 | INTEL CORP | Intel Corporation | 10AS027H2F35I1SG | n/a | 384 | 100 °C | -40 °C | DFN16 | PLASTIC/EPOXY | BGA | 35 X 35 MM, ROHS COMPLIANT, FBGA-1152 | SQUARE | GRID ARRAY | Obsolete | 5.64 | Yes | Yes | 0.93 V | 0.87 V | 0.9 V | 0...+70°C | Tray | n/a | Discontinued at Digi-Key | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | INDUSTRIAL | n/a | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 270K Logic Elements | -- | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS016E3F27E2SG | ALTERA | Datasheet | 435 |
| Min: 1 Mult: 1 | FBGA-672 | YES | 672 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS016E3F27E2SG | 1.2 GHz | Yes | SMD/SMT | 20000 LAB | 160000 LE | 100 °C | PLASTIC/EPOXY | BGA | BGA, BGA672,26X26,40 | BGA672,26X26,40 | SQUARE | GRID ARRAY | 964690 | Active | NOT SPECIFIED | 1.96 | Yes | Yes | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 9.819566 oz | Tray | Arria 10 SX 160 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B672 | 240 | Not Qualified | 0.9 V | OTHER | - | 240 | 3.25 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | 160000 | 2 Core | SoC FPGA | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU49DR-1FFVF1760I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Panel Mount | 1760-BBGA, FCBGA | Bulkhead - Front Side Nut | Aluminum | 1760-FCBGA (42.5x42.5) | Thermoplastic | - | TV07RQDZ | Gold | Copper Alloy | Amphenol Aerospace Operations | 622 | Bulk | Metal | Active | - | -65°C ~ 175°C | MIL-DTL-38999 Series III, Tri-Start™ TV | Crimp | Receptacle, Male Pins | 39 (38 + 1 Quadrax) | Black | Aviation, Marine, Military | Threaded | - | N (Normal) | Unshielded | Environment Resistant | Black Zinc Nickel | 17-2 | 500MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | - | 50.0µin (1.27µm) | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1802-1LSEVSVD1760 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1210 (3225 Metric) | 1210 | KOA Speer Electronics, Inc. | 692 | Tape & Reel (TR) | Active | -55°C ~ 155°C | SG73S-RT | 0.126 L x 0.102 W (3.20mm x 2.60mm) | ±2% | 2 | ±200ppm/°C | 12 kOhms | Thick Film | 1W | - | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | Anti-Sulfur, Automotive AEC-Q200, Moisture Resistant, Pulse Withstanding | 0.028 (0.70mm) | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1802-1MSEVSVA2197 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | Knowles Syfer | 770 | Tape & Reel (TR) | Active | 0°C ~ 100°C (TJ) | * | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z035-L2FFG676I | AMD | Datasheet | 562 |
| Min: 1 Mult: 1 | 0805 (2012 metric) | 676-FCBGA (27x27) | XC7Z035 | Vishay / Vitramon | 0805 | 2012 | Class 1 | 1000 | Vishay | + 150 C | AMD | - 55 C | 130 | Tray | Active | AEC-Q200 | N | 500 VDC | -40°C ~ 100°C (TJ) | Reel | VJ....32 | 0.1 pF | Standard | Lead-Bearing Finish MLCCs | 3.3 pF | Capacitors | SMD/SMT | C0G (NP0) | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Ceramic Capacitors | Kintex™-7 FPGA, 275K Logic Cells | - | General Type MLCCs | Multilayer Ceramic Capacitors MLCC - SMD/SMT | 1.45 mm | 2 mm | 1.25 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-1CS288I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 288 | ITT Cannon | 100 MHz | 1 | MICROSEMI CORP | ITT Cannon | A2F060M3E-1CS288I | PLASTIC/EPOXY | TFBGA | TFBGA, BGA288,21X21,20 | BGA288,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | 155523-4500 | Obsolete | 20 | 5.24 | Details | No | 1.575 V | 1.425 V | 1.5 V | e0 | TIN LEAD SILVER | 8542.39.00.01 | Circular Connectors | CMOS | BOTTOM | BALL | 235 | 0.5 mm | compliant | S-PBGA-B288 | 68 | Not Qualified | 1.5,1.8,2.5,3.3 V | 68 | 1536 CLBS, 60000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | Circular MIL Spec Connector | 1536 | 1536 | 60000 | Circular MIL Spec Connector | 11 mm | 11 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGID023R18A1E2V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 0402 (1005 metric) | - | ATC / KYOCERA AVX | 0402 | 1005 | 1000 | KYOCERA AVX | + 125 C | Intel | - 40 C | 480 | Tray | Active | Details | UBR | 0.000053 oz | 0°C ~ 100°C (TJ) | Reel | 504L | 1 % | Ultra-Boardband Resistor | High Frequency | Resistors | SMD/SMT | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | High Frequency/RF Resistors | FPGA - 2.3M Logic Elements | - | High Frequency/RF Resistors | 0.5 mm | 1 mm | 05 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVP1502-1LSEVSVA3340 | AMD | Datasheet | 777 | - | Min: 1 Mult: 1 | 3340-BFBGA | 3340-BGA (55x55) | Panjit | 1250 | Panjit | AMD | 486 | Tray | Active | Details | 0.040283 oz | 0°C ~ 100°C (TJ) | Ammo Pack | Versal® Premium | Diodes & Rectifiers | Si | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Schottky Diodes & Rectifiers | Versal™ Premium FPGA, 3.7M Logic Cells | - | Schottky Diodes & Rectifiers | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU5CG-1SFVC784E | AMD | Datasheet | 609 |
| Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | 221050 | Molex | 252 | Bulk | Active | 0°C ~ 100°C (TJ) | * | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB014R24D2I2V | Intel | Datasheet | 531 | - | Min: 1 Mult: 1 | - | - | Intel | - | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA014R24B2E4F | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | 121010 | Molex | 768 | Bulk | Active | 0°C ~ 100°C (TJ) | * | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1302-2LSEVSVD1760 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 2 Pin | 1760-FCBGA (40x40) | EPCOS / TDK | 0.2 | 160 | EPCOS / TDK | + 105 C | AMD Xilinx | - 25 C | 402 | Tray | B43641A9187M57 | Active | Details | 400 VDC | 0°C ~ 100°C (TJ) | Bulk | B43641 | 20 % | Long Life Capacitors | 180 uF | Capacitors | Snap In | 700 mV | 10 mm | 0.99 A | 100 Hz | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Electrolytic Capacitors | 520 mOhms | Versal™ Prime FPGA, 70k Logic Cells | - | General Purpose Electrolytic Capacitors | Aluminum Electrolytic Capacitors - Snap In | 22 mm | 30 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1402-2LSEVSVD1760 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 7 mm x 5 mm | 1760-FCBGA (40x40) | CTS Electronic Components | 55 % | 1000 | CTS | + 85 C | AMD Xilinx | - 40 C | 726 | Tray | Active | Details | 2.62 V | 2.37 V | 0°C ~ 100°C (TJ) | Reel | 637 | Oscillators | 45 mA | 148.35 MHz | 25 PPM | SMD/SMT | 700 mV | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Standard Oscillators | LVDS | Versal™ Prime FPGA, 1.2M Logic Cells | - | Standard Clock Oscillators | 1.7 mm | 7 mm | 5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB023R25A3E4X | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 0805 (2012 Metric) | 0805 | RN732A | KOA Speer Electronics, Inc. | 480 | Tape & Reel (TR) | Obsolete | -55°C ~ 155°C | RN73 | 0.079 L x 0.049 W (2.00mm x 1.25mm) | ±1% | 2 | ±50ppm/°C | 505 Ohms | Thin Film | 0.1W, 1/10W | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | Moisture Resistant | 0.024 (0.60mm) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFD019R25A2E4F | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | 110267 | Molex | 480 | Bulk | Active | 0°C ~ 100°C (TJ) | * | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1502-2MSEVFVC1760 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Glenair | 1 | Glenair | + 110 C | 0 C | MIL-Spec / MIL-Type | 800 mV | Rectangular MIL Spec Connectors | Rectangular MIL Spec Connectors |
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XCZU3EG-1SFVC784I
AMD
Package:Embedded - System On Chip (SoC)
623.479001
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AGFB019R25A2E3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFB022R31C3E3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS027H2F35I1SG
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS016E3F27E2SG
ALTERA
Package:Embedded - System On Chip (SoC)
795.556326
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XCZU49DR-1FFVF1760I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVC1802-1LSEVSVD1760
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVC1802-1MSEVSVA2197
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XC7Z035-L2FFG676I
AMD
Package:Embedded - System On Chip (SoC)
2,447.638930
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A2F060M3E-1CS288I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGID023R18A1E2V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVP1502-1LSEVSVA3340
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU5CG-1SFVC784E
AMD
Package:Embedded - System On Chip (SoC)
1,417.815649
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AGFB014R24D2I2V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA014R24B2E4F
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM1302-2LSEVSVD1760
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM1402-2LSEVSVD1760
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFB023R25A3E4X
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFD019R25A2E4F
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM1502-2MSEVFVC1760
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire