The category is 'Embedded - System On Chip (SoC)'
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- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Housing Material | Number of Terminals | Base Product Number | Brand | Case Code - in | Case Code - mm | Contact Materials | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Illuminated | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | MIL Type | Minimum Operating Temperature | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Number of Positions / Contacts per Port | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Temperature Coefficient / Code | Tradename | Unit Weight | Voltage, Rating | Operating Temperature | Packaging | Series | Tolerance | Part Status | Termination | Temperature Coefficient | Connector Type | Type | Resistance | Number of Positions | Max Operating Temperature | Min Operating Temperature | Color | Gender | HTS Code | Capacitance | Fastening Type | Subcategory | Power Rating | Technology | Terminal Position | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Base Part Number | Termination Style | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Configuration | Memory Size | Number of Ports | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Operating Temperature Range | Max Frequency | Number of Logic Blocks (LABs) | Speed Grade | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Product | Lamp Type | Mounting Angle | Features | USOC Codes | Product Category | Diameter | Height | Length | Width | Flammability Rating | Ratings |
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 | Mfr Part No XCVM1402-2LSEVSVF1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Glenair | Glenair | + 110 C | 0 C | Circular Connectors | 700 mV | Circular MIL Spec Connector | Circular MIL Spec Connector | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1302-2LLEVFVB1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Glenair | Glenair | + 110 C | 0 C | SOC - Systems on a Chip | 700 mV | System-On-Modules - SOM | Glenair | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1502-2LSEVFVB1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Glenair | Glenair | + 110 C | 0 C | Circular Connectors | 700 mV | Circular MIL Spec Connector | Circular MIL Spec Connector | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1502-1LLIVSVG1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Glenair | Glenair | + 110 C | - 40 C | Circular Connectors | 700 mV | Circular MIL Spec Connector | Circular MIL Spec Connector | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1502-2LSEVBVA1024 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Glenair | 1 | Glenair | + 110 C | 0 C | MIL-Spec / MIL-Type | 700 mV | Rectangular MIL Spec Connectors | Rectangular MIL Spec Connectors | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1502-2MLIVSVA1596 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Glenair | 1 | Glenair | + 110 C | - 40 C | Circular Connectors | 800 mV | Circular MIL Spec Connector | Circular MIL Spec Connector | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1502-2LLEVFVB1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Glenair | Glenair | + 110 C | 0 C | Circular Connectors | 700 mV | Circular MIL Spec Connector | Circular MIL Spec Connector | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEBA5U19C7N | ALTERA | Datasheet | 1866 |
| Min: 1 Mult: 1 | 484-FBGA | YES | 484 | 484-UBGA (19x19) | 484 | Glenair | INTEL CORP | Glenair | 5CSEBA5U19C7N | MIL-DTL-38999 | MCU - 151, FPGA - 66 | 85 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA484,22X22,32 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | NOT SPECIFIED | 5.55 | Compliant | Yes | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | Active | 85 °C | 0 °C | Circular Connectors | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | 5CSEBA5 | S-PBGA-B484 | 66 | Not Qualified | 1.13 V | 1.1,1.2/3.3,2.5 V | OTHER | 556.3 kB | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 66 | 1.9 mm | FIELD PROGRAMMABLE GATE ARRAY | 85000 | Circular MIL Spec Connector | 800 MHz | 32075 | 7 | FPGA - 85K Logic Elements | 85000 | -- | Connectors | Circular MIL Spec Connector | 19 mm | 19 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU43DR-L2FFVE1156I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Amphenol Nexus Technologies | Non-Illuminated | Amphenol | AMD Xilinx | 366 | Active | Details | -40°C ~ 100°C (TJ) | NX300 | Switches | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Pushbutton Switches | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | - | Pushbutton Switches | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU47DR-1FSVE1156E | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Honeywell | 1 | Non-Illuminated | Honeywell | AMD Xilinx | 366 | Tray | Active | Details | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | Switches | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Limit Switches | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | - | Limit Switches | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1502-2LSEVSVA1596 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Measurement Specialties | 1 | TE Connectivity | 2 oz | Bulk | R60D | Sensors | Linear Displacement Sensors | Linear Displacement Sensors | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1902-1MLIVSVA2197 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | Telemecanique | 1 | Schneider Electric | AMD Xilinx | 770 | Tray | Active | Details | -40°C ~ 100°C (TJ) | XUB | Sensors | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | Proximity Sensors | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1902-2MSIVIVA1596 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | EPCOS / TDK | 400 | EPCOS / TDK | + 155 C | AMD Xilinx | - 55 C | PCB Mount | 500 | Tray | Active | Details | -40°C ~ 100°C (TJ) | Bulk | B58100 | 2 % | NTC | 1.465 kOhms | Thermistors | 60 mW | Radial | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | NTC Thermistors | Versal™ AI Core FPGA, 1.9M Logic Cells | - | NTC Thermistors | 11 mm | 12 mm | 12.6 mm | 15 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-2FFVE1156I | Xilinx | Datasheet | 960 | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Amphenol Commercial Products | 125 | Amphenol | AMD Xilinx | 366 | Tray | Active | -40°C ~ 100°C (TJ) | Reel | Zynq® UltraScale+™ RFSoC | Modular Connectors / Ethernet Connectors | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Modular Connectors / Ethernet Connectors | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | Modular Connectors / Ethernet Connectors | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU47DR-1FFVG1517E | Xilinx | Datasheet | 40 | - | Min: 1 Mult: 1 | 1111 (2828 metric) | 1517-FCBGA (40x40) | ATC / KYOCERA AVX | 1111 | 2828 | 1000 | KYOCERA AVX | + 125 C | AMD Xilinx | - 55 C | 561 | Tray | Active | Details | P90 | 500 V | 0°C ~ 100°C (TJ) | Reel | 100B | 0.25 pF | 90 PPM / C | High Q, Low ESR/ESL Porcelain Superchip Capacitor | 3.9 pF | Capacitors | SMD/SMT | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Silicon RF Capacitors / Thin Film | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | RF/Microwave Multilayer Capacitors (MLC) | Silicon RF Capacitors / Thin Film | 2.59 mm | 2.79 mm | 2.79 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU46DR-2FFVH1760I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | Amphenol Positronic | 5 | Positronic | AMD Xilinx | 574 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | D-Sub Connectors | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Mixed Contact D-Sub Connectors | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | D-Sub Mixed Contact Connectors | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA008R24C2I3V | Intel | Datasheet | 636 |
| Min: 1 Mult: 1 | - | - | Advanced Energy | 1 | Advanced Energy | Intel | 576 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | DC-DC Converter | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Non-Isolated DC-DC Converters | FPGA - 764K Logic Elements | - | Non-Isolated DC/DC Converters | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB006R16A2E3V | Intel | Datasheet | 792 |
| Min: 1 Mult: 1 | Gold | - | - | Thermoplastic polyester | Amphenol Commercial Products | Phosphor Bronze | 450 | Amphenol | + 70 C | Intel | 0 C | 384 | 8P8C | Tray | Active | 0°C ~ 100°C (TJ) | Tray | Agilex F | Magnetic Jack | Black | Jack (Female) | Modular Connectors / Ethernet Connectors | Shielded | Solder Pin | 1x1 | 1 Port | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Modular Connectors / Ethernet Connectors | 0 C to + 70 C | FPGA - 573K Logic Elements | - | Connectors | Right Angle | RJ45 | Modular Connectors / Ethernet Connectors | UL 94V-0 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS016E4F27E3LG | ALTERA | Datasheet | 609 |
| Min: 1 Mult: 1 | 672-BBGA, FCBGA | YES | 672-FBGA (27x27) | 672 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS016E4F27E3LG | 1.2 GHz | Yes | SMD/SMT | 240 | 20000 LAB | 160000 LE | 100 °C | PLASTIC/EPOXY | BGA | BGA, BGA672,26X26,40 | BGA672,26X26,40 | SQUARE | GRID ARRAY | 964735 | Active | NOT SPECIFIED | 1.96 | Non-Compliant | Yes | FPGA - Field Programmable Gate Array Arria 10 SX 160 SoC FPGA | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B672 | 240 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 3.25 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 160K Logic Elements | 160000 | 2 Core | -- | SoC FPGA | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU2CG-2SFVA625I | AMD | Datasheet | 43 | - | Min: 1 Mult: 1 | Gold | Flanges, Panel, Through Hole | 625-BFBGA, FCBGA | 23 | 625-FCBGA (21x21) | XCZU2 | AMD | 180 | Tray | Active | Compliant | -40°C ~ 100°C (TJ) | Bulk | Zynq® UltraScale+™ MPSoC CG | Solder | Receptacle | 19 | 175 °C | -65 °C | Threaded | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | Shielded | Environment Resistant |
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XCVM1402-2LSEVSVF1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM1302-2LLEVFVB1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM1502-2LSEVFVB1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVC1502-1LLIVSVG1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVC1502-2LSEVBVA1024
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVC1502-2MLIVSVA1596
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM1502-2LLEVFVB1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5CSEBA5U19C7N
ALTERA
Package:Embedded - System On Chip (SoC)
192.236047
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XCZU43DR-L2FFVE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU47DR-1FSVE1156E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVC1502-2LSEVSVA1596
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVC1902-1MLIVSVA2197
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVC1902-2MSIVIVA1596
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU48DR-2FFVE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU47DR-1FFVG1517E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU46DR-2FFVH1760I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA008R24C2I3V
Intel
Package:Embedded - System On Chip (SoC)
10,111.634883
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AGFB006R16A2E3V
Intel
Package:Embedded - System On Chip (SoC)
6,352.778723
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10AS016E4F27E3LG
ALTERA
Package:Embedded - System On Chip (SoC)
752.755260
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XCZU2CG-2SFVA625I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire