The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Contact Shape | Shell Material | Supplier Device Package | Insert Material | Number of Terminals | Backshell Material, Plating | 1st Connector Mounting Type | 2nd Connector Mounting Type | 1st Connector Mounting Feature | 1st Contact Gender | 2nd Connector Mounting Feature | 2nd Contact Gender | Base Product Number | Brand | Cable Impedance | Cable Types | Contact Finish Mating | Contact Materials | Contact Sizes | Data Converters | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Frequency-Max | Ihs Manufacturer | Impedance (Max) (Zzt) | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Mfr | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Primary Material | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Voltage Rated | Voltage-Input | Voltage, Rating | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | Part Status | Number of Terminations | Termination | Temperature Coefficient | Connector Type | Type | Resistance | Number of Positions | Composition | Color | Applications | Power (Watts) | HTS Code | Capacitance | Fastening Type | Subcategory | Contact Type | Current Rating (Amps) | Technology | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Style | Reach Compliance Code | Shell Finish | Shell Size - Insert | JESD-30 Code | Number of Outputs | Qualification Status | Housing Color | Failure Rate | Lead Spacing | Power Supplies | Temperature Grade | Note | Oscillator Type | Speed | RAM Size | Current - Reverse Leakage @ Vr | Shell Size, MIL | Voltage - Forward (Vf) (Max) @ If | Lead Style | Voltage - Supply (Vcc/Vdd) | Current - Output | Core Processor | Peripherals | Program Memory Type | Core Size | Program Memory Size | Connectivity | Power - Max | Cable Opening | Voltage - Output | Architecture | Frequency - Switching | Number of Inputs | Seated Height-Max | Utilized IC / Part | Supplied Contents | Programmable Logic Type | Voltage - Zener (Nom) (Vz) | Product Type | Includes | 1st Connector | 2nd Connector | EEPROM Size | Board Type | Main Purpose | Primary Attributes | Outputs and Type | Regulator Topology | Number of Logic Cells | Number of Cores | Flash Size | Features | Product Category | Height Seated (Max) | Length | Width | Thickness (Max) | Contact Finish Thickness - Mating | Material Flammability Rating | Ratings |
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![]() | Mfr Part No 10AS022E3F27I2SG | ALTERA | Datasheet | 699 |
| Min: 1 Mult: 1 | Panel Mount | FBGA-672 | YES | Flange | Circular | Aluminum Alloy | - | 672 | D38999/20FJ | Intel / Altera | 20 (2), 10 Power (9) | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS022E3F27I2SG | 1.2 GHz | Conesys | Yes | SMD/SMT | 240 | 27500 LAB | 220000 LE | 100 °C | -40 °C | Box | PLASTIC/EPOXY | BGA | BGA, BGA672,26X26,40 | BGA672,26X26,40 | SQUARE | GRID ARRAY | 964738 | Active | Active | NOT SPECIFIED | 5.46 | Non-Compliant | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -65°C ~ 200°C | Tray | Military, MIL-DTL-38999 Series III, Tri-Start™ TV | Active | Receptacle Housing | For Female Sockets | 11 (2 + 9 Power) | 8542.39.00.01 | Threaded | SOC - Systems on a Chip | Crimp | CMOS | BOTTOM | E | BALL | Shielded | NOT SPECIFIED | Environment Resistant | 1 mm | compliant | Electroless Nickel | 25-11 | S-PBGA-B672 | 240 | Not Qualified | Silver | 0.9 V | INDUSTRIAL | Contacts Not Included | 1.5GHz | 256KB | J | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 3.25 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | - | FPGA - 220K Logic Elements | 220000 | 2 Core | -- | - | SoC FPGA | 27 mm | 27 mm | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS032E2F27I2SG | ALTERA | Datasheet | 405 |
| Min: 1 Mult: 1 | FBGA-672 | YES | 672 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS032E2F27I2SG | 1.2 GHz | Vishay Sfernice | Yes | SMD/SMT | 240 | 40000 LAB | 320000 LE | 100 °C | -40 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | BGA, BGA672,26X26,40 | BGA672,26X26,40 | SQUARE | GRID ARRAY | 964963 | Active | Last Time Buy | NOT SPECIFIED | 5.45 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -40°C ~ 100°C (TJ) | Tray | * | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B672 | 240 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 3.25 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 320K Logic Elements | 320000 | 2 Core | -- | SoC FPGA | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS022E3F29E2LG | ALTERA | Datasheet | 761 |
| Min: 1 Mult: 1 | 0603 (1608 Metric) | YES | 0603 | 780 | RN731J | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS022E3F29E2LG | 1.2 GHz | KOA Speer Electronics, Inc. | Yes | SMD/SMT | 288 | 27500 LAB | 220000 LE | 100 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | BGA, BGA780,28X28,40 | BGA780,28X28,40 | SQUARE | GRID ARRAY | 964739 | Active | Obsolete | NOT SPECIFIED | 5.46 | Non-Compliant | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -55°C ~ 155°C | Tray | RN73 | 0.063 L x 0.031 W (1.60mm x 0.80mm) | ±0.5% | Active | 2 | ±10ppm/°C | 517 Ohms | Thin Film | 0.063W, 1/16W | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B780 | 288 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | 3.35 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 220K Logic Elements | 220000 | 2 Core | -- | Moisture Resistant | SoC FPGA | 0.022 (0.55mm) | 29 mm | 29 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS057K3F35E2SG | ALTERA | Datasheet | 647 |
| Min: 1 Mult: 1 | Panel Mount | 1152-BBGA, FCBGA | YES | Bulkhead - Front Side Nut | Composite | 1152-FCBGA (35x35) | Thermoplastic | 1152 | - | ACT94 | Gold | Copper Alloy | INTEL CORP | Intel Corporation | 10AS057K3F35E2SG | TE Connectivity Deutsch Connectors | 396 | 100 °C | Bulk | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Composite | Discontinued at Digi-Key | NOT SPECIFIED | 5.45 | Yes | 0.93 V | 0.87 V | 0.9 V | - | -65°C ~ 175°C | Tray | MIL-DTL-38999 Series III, ACT | Active | Crimp | Receptacle, Female Sockets | 32 | Olive Drab | Aerospace, Military | 8542.39.00.01 | Threaded | Field Programmable Gate Arrays | 7.5A | CMOS | BOTTOM | A | BALL | Shielded | NOT SPECIFIED | Environment Resistant | 1 mm | compliant | Olive Drab Cadmium | 19-32 | S-PBGA-B1152 | 396 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | F | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | 396 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 570K Logic Elements | 570000 | -- | - | 35 mm | 35 mm | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS066K4F40E3LG | ALTERA | Datasheet | 531 |
| Min: 1 Mult: 1 | 1517-BBGA, FCBGA | YES | 1517-FBGA (40x40) | 1517 | MAX150 | Intel / Altera | - | 21 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS066K4F40E3LG | 1.2 GHz | Analog Devices Inc./Maxim Integrated | Yes | SMD/SMT | 696 | 82500 LAB | 660000 LE | 100 °C | Bulk | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | 978967 | Active | Obsolete | 5.46 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 4.5V ~ 40V | 0°C ~ 100°C (TJ) | Tray | - | Active | 8542.39.00.01 | SOC - Systems on a Chip | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | OTHER | 1.5GHz | 256KB | 1A, 50mA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 3.3V, 5V | MCU, FPGA | 500kHz | 3.5 mm | MAX15015A | Board(s) | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | Fully Populated | DC/DC, Step Down with LDO | FPGA - 660K Logic Elements | 2, Non-Isolated | Buck | 2 Core | -- | SoC FPGA | 40 mm | 40 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS048K3F35E2LG | ALTERA | Datasheet | 532 |
| Min: 1 Mult: 1 | Panel Mount | FBGA-1152 | YES | Bulkhead - Front Side Nut | Aluminum | Thermoplastic | 1152 | - | D38999/24ZD | Intel / Altera | Gold | Copper Alloy | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS048K3F35E2LG | 1.2 GHz | Corsair | Yes | SMD/SMT | 396 | 60000 LAB | 480000 LE | 100 °C | Bag | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 965009 | Active | Metal | Active | NOT SPECIFIED | 5.47 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | - | -65°C ~ 200°C | Tray | Military, MIL-DTL-38999 Series III | Active | Crimp | Receptacle, Female Sockets | 19 | Black | Aviation, Marine, Military | 8542.39.00.01 | Threaded | SOC - Systems on a Chip | 7.5A | CMOS | BOTTOM | C | BALL | Shielded | NOT SPECIFIED | IP67 - Dust Tight, Waterproof | 1 mm | compliant | Black Zinc Nickel | 15-19 | S-PBGA-B1152 | 396 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | D | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | 396 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 480K Logic Elements | 480000 | 2 Core | -- | - | SoC FPGA | 35 mm | 35 mm | 50.0µin (1.27µm) | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS066K2F35I2LG | ALTERA | Datasheet | 548 |
| Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FBGA (35x35) | 1152 | INTEL CORP | Intel Corporation | 10AS066K2F35I2LG | Diodes Incorporated | 396 | 100 °C | -40 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Obsolete | NOT SPECIFIED | 5.46 | Yes | 0.93 V | 0.87 V | 0.9 V | -40°C ~ 100°C (TJ) | Tray | - | Active | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 396 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 660K Logic Elements | 660000 | -- | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS027E4F27E3LG | ALTERA | Datasheet | 694 |
| Min: 1 Mult: 1 | FBGA-672 | YES | 672 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS027E4F27E3LG | 1.2 GHz | Intel | Yes | SMD/SMT | 240 | 33750 LAB | 270000 LE | 100 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA672,26X26,40 | BGA672,26X26,40 | SQUARE | GRID ARRAY | 965282 | Active | Obsolete | NOT SPECIFIED | 1.92 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 0°C ~ 100°C (TJ) | Tray | - | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B672 | 240 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 3.25 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | SoC FPGA | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS057K2F35I2SG | ALTERA | Datasheet | 412 |
| Min: 1 Mult: 1 | Through Hole | Radial, Disc | YES | 1152-FCBGA (35x35) | 1152 | INTEL CORP | Intel Corporation | 10AS057K2F35I2SG | KYOCERA AVX | 396 | 100 °C | -40 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Obsolete | NOT SPECIFIED | 5.45 | Yes | 0.93 V | 0.87 V | 0.9 V | 100V | -30°C ~ 85°C | Tray | - | 0.197 Dia (5.00mm) | ±5% | Active | C0G, NP0 | General Purpose | 8542.39.00.01 | 22 pF | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 396 | Not Qualified | - | 0.197 (5.00mm) | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Straight | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 570K Logic Elements | 570000 | -- | - | 0.157 (4.00mm) | 35 mm | 35 mm | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS048E1F29E1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | DO-213AB, MELF (Glass) | YES | DO-213AB (MELF, LL41) | 780 | 1N3027 | INTEL CORP | 22 Ohms | Intel Corporation | 10AS048E1F29E1SG | Microchip Technology | 360 | 100 °C | Bulk | PLASTIC/EPOXY | BGA | 29 X 29 MM, ROHS COMPLIANT, FBGA-780 | BGA780,28X28,40 | SQUARE | GRID ARRAY | Obsolete | Active | NOT SPECIFIED | 5.68 | Yes | 0.93 V | 0.87 V | 0.9 V | -55°C ~ 175°C | Tray | Military, MIL-PRF-19500/115 | ±2% | Discontinued at Digi-Key | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B780 | 360 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | 10 µA @ 15.2 V | 1.2 V @ 200 mA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1 W | MCU, FPGA | 360 | 3.35 mm | FIELD PROGRAMMABLE GATE ARRAY | 20 V | FPGA - 480K Logic Elements | 480000 | -- | 29 mm | 29 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS048E2F29E2SG | ALTERA | Datasheet | 549 |
| Min: 1 Mult: 1 | YES | 780 | MS27497E12B | INTEL CORP | Intel Corporation | 10AS048E2F29E2SG | Corsair | 360 | 100 °C | Bag | PLASTIC/EPOXY | BGA | BGA, BGA780,28X28,40 | BGA780,28X28,40 | SQUARE | GRID ARRAY | Active | Active | NOT SPECIFIED | 5.47 | Yes | 0.93 V | 0.87 V | 0.9 V | 0°C ~ 100°C (TJ) | Tray | * | Active | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B780 | 360 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 360 | 3.35 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 480K Logic Elements | 480000 | -- | 29 mm | 29 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS066K4F35E3SG | ALTERA | Datasheet | 760 |
| Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FBGA (35x35) | 1152 | 121065 | Intel / Altera | - | 24 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS066K4F35E3SG | 1.2 GHz | Molex | Yes | SMD/SMT | 396 | 82500 LAB | 660000 LE | 100 °C | Bulk | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 973546 | Active | Active | NOT SPECIFIED | 5.46 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 0°C ~ 100°C (TJ) | Tray | * | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 396 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 660K Logic Elements | 660000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS032H1F35E1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 100-LQFP | YES | 100-LQFP (14x20) | 1152 | R5F100 | A/D 20x8/10b | INTEL CORP | Intel Corporation | 10AS032H1F35E1SG | Renesas Electronics America Inc | 82 | 100 °C | Tray | PLASTIC/EPOXY | BGA | 35 X 35 MM, ROHS COMPLIANT, FBGA-1152 | SQUARE | GRID ARRAY | Obsolete | Active | 5.66 | Non-Compliant | Yes | 0.93 V | 0.87 V | 0.9 V | -40°C ~ 85°C (TA) | Tray | RL78/G13 | Discontinued at Digi-Key | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | OTHER | Internal | 32MHz | 20K x 8 | 1.6V ~ 5.5V | RL78 | DMA, LVD, POR, PWM, WDT | FLASH | 16-Bit | 256KB (256K x 8) | CSI, I²C, LINbus, UART/USART | MCU, FPGA | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | 8K x 8 | FPGA - 320K Logic Elements | -- | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGFB027R31C2I3V | Intel | Datasheet | 577 | - | Min: 1 Mult: 1 | - | - | Free Hanging (In-Line) | Free Hanging (In-Line) | - | Female | - | Female | UFL-2HF | 50 Ohms | 1.13mm OD Coaxial Cable | 6 GHz | Hirose Electric Co Ltd | 720 | Bulk | Active | -40°C ~ 90°C | U.FL | Gray | - | U.FL (UMCC) to U.FL (UMCC) | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | U.FL (UMCC) Plug, Right Angle | U.FL (UMCC) Plug, Right Angle | FPGA - 2.7M Logic Elements | - | - | 2.756 (70.00mm) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVM1502-2MLIVSVA2197 | AMD | Datasheet | 524 |
| Min: 1 Mult: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 608 | Tray | Active | Versal™ Prime | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGFA022R31C2I3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 720 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGFB008R24C3I3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 576 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVC1902-1LSEVIVA1596 | AMD | Datasheet | 667 | - | Min: 1 Mult: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | AMD | 500 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGFB027R25A1E1V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 624 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU15EG-2FFVC900E | AMD | Datasheet | 544 | - | Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU15 | AMD | 204 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | - |
10AS022E3F27I2SG
ALTERA
Package:Embedded - System On Chip (SoC)
1,247.619106
10AS032E2F27I2SG
ALTERA
Package:Embedded - System On Chip (SoC)
2,064.951494
10AS022E3F29E2LG
ALTERA
Package:Embedded - System On Chip (SoC)
1,438.241359
10AS057K3F35E2SG
ALTERA
Package:Embedded - System On Chip (SoC)
4,388.373224
10AS066K4F40E3LG
ALTERA
Package:Embedded - System On Chip (SoC)
4,921.196059
10AS048K3F35E2LG
ALTERA
Package:Embedded - System On Chip (SoC)
4,903.868562
10AS066K2F35I2LG
ALTERA
Package:Embedded - System On Chip (SoC)
7,630.178751
10AS027E4F27E3LG
ALTERA
Package:Embedded - System On Chip (SoC)
1,240.402310
10AS057K2F35I2SG
ALTERA
Package:Embedded - System On Chip (SoC)
5,584.013238
10AS048E1F29E1SG
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
10AS048E2F29E2SG
ALTERA
Package:Embedded - System On Chip (SoC)
2,882.254262
10AS066K4F35E3SG
ALTERA
Package:Embedded - System On Chip (SoC)
3,633.160614
10AS032H1F35E1SG
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
AGFB027R31C2I3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVM1502-2MLIVSVA2197
AMD
Package:Embedded - System On Chip (SoC)
11,787.040308
AGFA022R31C2I3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
AGFB008R24C3I3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVC1902-1LSEVIVA1596
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
AGFB027R25A1E1V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCZU15EG-2FFVC900E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
