The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Operating Supply Current | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Connectivity | Data Rate | Architecture | Number of Inputs | Organization | Programmable Logic Type | Number of Logic Elements/Cells | Core Architecture | Number of Gates | Max Frequency | Number of Logic Blocks (LABs) | Primary Attributes | Number of Logic Cells | Number of Equivalent Gates | Flash Size | Height Seated (Max) | Length | Width | RoHS Status | Lead Free |
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 | Mfr Part No M2S005-TQG144 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 144-LQFP | YES | 144 | 84 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 144 | MATTE TIN | 8542.39.00.01 | QUAD | GULL WING | NOT SPECIFIED | 1.2V | 0.5mm | NOT SPECIFIED | 84 | Not Qualified | 1.2V | 1.26V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 6060 | 128KB | 1.6mm | 20mm | 20mm | RoHS Compliant | ||||||||||||||||||||||||||||
 | Mfr Part No BCM3383DUIFEBG | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | Active | 1 (Unlimited) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 1SX280LU3F50E2VG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 2397-BBGA, FCBGA | YES | 704 | 0°C~100°C TJ | Tray | Stratix® 10 SX | Active | 3 (168 Hours) | ALSO OPERATES AT 0.85V | BOTTOM | BALL | 0.8V | S-PBGA-B2397 | 1.5GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2800K Logic Elements | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 1SX280LU3F50I3VG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 2397-BBGA, FCBGA | 704 | -40°C~100°C TJ | Tray | Stratix® 10 SX | Active | 3 (168 Hours) | 1.5GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2800K Logic Elements | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 1SX280LU2F50E2VGS1 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 2397-BBGA, FCBGA | 704 | 0°C~100°C TJ | Tray | Stratix® 10 SX | Active | 3 (168 Hours) | 1.5GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2800K Logic Elements | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 1SX280LU3F50E3VGS1 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 2397-BBGA, FCBGA | 704 | 0°C~100°C TJ | Tray | Stratix® 10 SX | Active | 3 (168 Hours) | 1.5GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2800K Logic Elements | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No M2S005S-VFG256I | Microsemi Corporation | Datasheet | 77 | - | Min: 1 Mult: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 256-LBGA | YES | 161 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 256 | MATTE TIN | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | NOT SPECIFIED | S-PBGA-B256 | 161 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 161 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 6060 | 128KB | 1.56mm | 14mm | 14mm | RoHS Compliant | |||||||||||||||||||||||||
 | Mfr Part No M2S010-FGG484I | Microsemi Corporation | Datasheet | 48 | - | Min: 1 Mult: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | YES | 484 | 233 | -40°C~100°C TJ | Tray | 2014 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 484 | MATTE TIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | NOT SPECIFIED | 233 | Not Qualified | 1.2V | 1.26V | 256kB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 667 Mbps | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | 12084 | 400MHz | 1007 | FPGA - 10K Logic Modules | 256KB | 2.44mm | 23mm | 23mm | RoHS Compliant | ||||||||||||||||||||||||
| Mfr Part No M2S010-VFG256I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Surface Mount | 256-LFBGA | 256 | 138 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 256 | MATTE TIN | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | NOT SPECIFIED | 138 | Not Qualified | 1.2V | 1.26V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 256KB | 1.56mm | 14mm | 14mm | RoHS Compliant | Lead Free | |||||||||||||||||||||||||
 | Mfr Part No M2S010-VFG400I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | YES | 195 | -40°C~100°C TJ | Tray | 2014 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 400 | MATTE TIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | NOT SPECIFIED | S-PBGA-B400 | 195 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 195 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 256KB | 1.51mm | 17mm | 17mm | RoHS Compliant | Lead Free | |||||||||||||||||||||||||
| Mfr Part No M2S005-FG484 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 484-BGA | 484 | 484-FPBGA (23x23) | 209 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | Active | 3 (168 Hours) | 85°C | 0°C | 166MHz | M2S005 | 1.2V | CAN, Ethernet, I2C, SPI, UART, USART, USB | 128kB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 667 Mbps | MCU, FPGA | 6060 | ARM | 400MHz | 505 | FPGA - 5K Logic Modules | 128KB | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005-1VF400 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 400-LFBGA | 400 | 400-VFBGA (17x17) | 169 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | Active | 3 (168 Hours) | 85°C | 0°C | 166MHz | M2S005 | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | ARM | FPGA - 5K Logic Modules | 128KB | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3F-FG256 | Microsemi Corporation | Datasheet | 543 | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 256-LBGA | 256 | MCU - 25, FPGA - 66 | 0°C~85°C TJ | Tray | 2012 | SmartFusion® | Active | 3 (168 Hours) | 256 | TIN LEAD/TIN LEAD SILVER | BOTTOM | BALL | 225 | 1.5V | 1mm | 80MHz | 30 | A2F200 | 66 | Not Qualified | 1.5V | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 1.575V | 1.425V | 2mA | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | ARM | 200000 | 8 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | 1.7mm | 17mm | 17mm | Non-RoHS Compliant | |||||||||||||||||||||||||
| Mfr Part No M2S010-FG484 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 484-BGA | 484 | 484-FPBGA (23x23) | 233 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | Active | 3 (168 Hours) | 85°C | 0°C | 166MHz | M2S010 | 1.2V | CAN, Ethernet, I2C, SPI, UART, USART, USB | 1.26V | 1.14V | 256kB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 667 Mbps | MCU, FPGA | 12084 | ARM | 400MHz | 1007 | FPGA - 10K Logic Modules | 256KB | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
 | Mfr Part No A2F500M3G-CSG288 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 16 Weeks | 288-TFBGA, CSPBGA | YES | MCU - 31, FPGA - 78 | 0°C~85°C TJ | Tray | 2015 | SmartFusion® | e1 | Active | 3 (168 Hours) | 288 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.5V | 0.5mm | 80MHz | NOT SPECIFIED | A2F500M3G | S-PBGA-B288 | 78 | Not Qualified | 1.575V | 1.51.82.53.3V | 1.425V | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | MCU, FPGA | 78 | 11520 CLBS, 500000 GATES | FIELD PROGRAMMABLE GATE ARRAY | ARM | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 500000 | 512KB | 1.05mm | 11mm | 11mm | RoHS Compliant | |||||||||||||||||||||||
 | Mfr Part No M2S025T-FCS325 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | 325-TFBGA, CSPBGA | YES | 180 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 325 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | not_compliant | NOT SPECIFIED | S-PBGA-B325 | 180 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 180 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Modules | 27696 | 256KB | 1.01mm | 11mm | 11mm | Non-RoHS Compliant | |||||||||||||||||||||||||
| Mfr Part No M2S050-FCS325 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 13 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 325-TFBGA, CSPBGA | YES | 200 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 325 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | not_compliant | NOT SPECIFIED | S-PBGA-B325 | 200 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 200 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 256KB | 1.01mm | 11mm | 11mm | Non-RoHS Compliant | Contains Lead | |||||||||||||||||||||||
| Mfr Part No M2S025-VF400I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 6 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | YES | 207 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 400 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | not_compliant | NOT SPECIFIED | S-PBGA-B400 | 207 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 207 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Modules | 27696 | 256KB | 1.51mm | 17mm | 17mm | Non-RoHS Compliant | |||||||||||||||||||||||||
| Mfr Part No M2S025T-VF400I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | YES | 207 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 400 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | not_compliant | NOT SPECIFIED | S-PBGA-B400 | 207 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 207 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Modules | 27696 | 256KB | 1.51mm | 17mm | 17mm | Non-RoHS Compliant | |||||||||||||||||||||||||
| Mfr Part No M2S025-1FG484 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | 484-FPBGA (23x23) | 267 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | Active | 3 (168 Hours) | 85°C | 0°C | 166MHz | M2S025 | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | ARM | FPGA - 25K Logic Modules | 256KB | Non-RoHS Compliant |
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M2S005-TQG144
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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BCM3383DUIFEBG
Broadcom Limited
Package:Embedded - System On Chip (SoC)
Price: please inquire
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1SX280LU3F50E2VG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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1SX280LU3F50I3VG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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1SX280LU2F50E2VGS1
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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1SX280LU3F50E3VGS1
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S005S-VFG256I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010-FGG484I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010-VFG256I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010-VFG400I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S005-FG484
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S005-1VF400
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F200M3F-FG256
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010-FG484
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F500M3G-CSG288
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S025T-FCS325
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S050-FCS325
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S025-VF400I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S025T-VF400I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S025-1FG484
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire