The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Operating Supply Current | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Connectivity | Data Rate | Architecture | Data Bus Width | Number of Inputs | Programmable Logic Type | Number of Logic Elements/Cells | Core Architecture | Number of Gates | Max Frequency | Primary Attributes | Number of Logic Cells | Flash Size | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
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 | Mfr Part No M2S050T-1FGG484M | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 484-BGA | YES | 267 | -55°C~125°C TJ | Tray | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 484 | 3A001.A.2.C | MATTE TIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | NOT SPECIFIED | S-PBGA-B484 | 267 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 256KB | 2.44mm | 23mm | 23mm | RoHS Compliant | |||||||||||||||||||||||||
| Mfr Part No M2S090TS-1FG484I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | YES | 267 | -40°C~100°C TJ | Tray | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | 166MHz | NOT SPECIFIED | M2S090TS | S-PBGA-B484 | 267 | Not Qualified | 1.26V | 1.2V | 1.14V | CAN, Ethernet, I2C, SPI, UART, USART, USB | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | FIELD PROGRAMMABLE GATE ARRAY | ARM | FPGA - 90K Logic Modules | 86316 | 512KB | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | ||||||||||||||||||||||
 | Mfr Part No M2S025-VFG400I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 6 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | YES | 207 | -40°C~100°C TJ | Tray | 2014 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 400 | MATTE TIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | NOT SPECIFIED | S-PBGA-B400 | 207 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 207 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Modules | 27696 | 256KB | 1.51mm | 17mm | 17mm | RoHS Compliant | |||||||||||||||||||||||||
| Mfr Part No M2S025-FGG484I | Microsemi Corporation | Datasheet | 48 | - | Min: 1 Mult: 1 | 3 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | YES | 267 | -40°C~100°C TJ | Tray | 2014 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 484 | MATTE TIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | NOT SPECIFIED | S-PBGA-B484 | 267 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Modules | 27696 | 256KB | 2.44mm | 23mm | 23mm | RoHS Compliant | |||||||||||||||||||||||||
 | Mfr Part No 1SX250LU3F50E3VG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 2397-BBGA, FCBGA | 704 | 0°C~100°C TJ | Tray | Stratix® 10 SX | Active | 3 (168 Hours) | 1.5GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2500K Logic Elements | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 1SX250LU3F50E1VG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 2397-BBGA, FCBGA | 704 | 0°C~100°C TJ | Tray | Stratix® 10 SX | Active | 3 (168 Hours) | 1.5GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2500K Logic Elements | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 1SX250LU3F50E2LG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 2397-BBGA, FCBGA | 704 | 0°C~100°C TJ | Tray | Stratix® 10 SX | Active | 3 (168 Hours) | 1.5GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2500K Logic Elements | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 1SX250LU2F50I2VG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 2397-BBGA, FCBGA | 704 | -40°C~100°C TJ | Tray | Stratix® 10 SX | Active | 3 (168 Hours) | 1.5GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2500K Logic Elements | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 1SX250LU3F50I2LG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 2397-BBGA, FCBGA | 704 | -40°C~100°C TJ | Tray | Stratix® 10 SX | Active | 3 (168 Hours) | 1.5GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2500K Logic Elements | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 1SX280LU2F50I1VG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 2397-BBGA, FCBGA | 704 | -40°C~100°C TJ | Tray | Stratix® 10 SX | Active | 3 (168 Hours) | 1.5GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2800K Logic Elements | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 1SX250LU3F50E2VG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 2397-BBGA, FCBGA | 704 | 0°C~100°C TJ | Tray | Stratix® 10 SX | Active | 3 (168 Hours) | 1.5GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2500K Logic Elements | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 1SX250LU2F50E2VG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 2397-BBGA, FCBGA | 704 | 0°C~100°C TJ | Tray | Stratix® 10 SX | Active | 3 (168 Hours) | 1.5GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2500K Logic Elements | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 1SX250LU2F50E2LG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 2397-BBGA, FCBGA | 704 | 0°C~100°C TJ | Tray | Stratix® 10 SX | Active | 3 (168 Hours) | 1.5GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2500K Logic Elements | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 1SX250LU3F50I1VG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 2397-BBGA, FCBGA | 704 | -40°C~100°C TJ | Tray | Stratix® 10 SX | Active | 3 (168 Hours) | 1.5GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2500K Logic Elements | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 1SX280LU3F50E3VG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 2397-BBGA, FCBGA | 704 | 0°C~100°C TJ | Tray | Stratix® 10 SX | Active | 3 (168 Hours) | 1.5GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2800K Logic Elements | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 1SX280LU2F50E2LG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 2397-BBGA, FCBGA | 704 | 0°C~100°C TJ | Tray | Stratix® 10 SX | Active | 3 (168 Hours) | 1.5GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2800K Logic Elements | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BCM1125HB0K600G | Broadcom Limited | Datasheet | 261 | - | Min: 1 Mult: 1 | Obsolete | 1 (Unlimited) | 64b | 600MHz | No | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-FGG484I | Microsemi Corporation | Datasheet | 244 | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 484-BGA | 484 | 484-FPBGA (23x23) | MCU - 41, FPGA - 128 | -40°C~100°C TJ | Tray | 2013 | SmartFusion® | Active | 3 (168 Hours) | 100°C | -40°C | 80MHz | A2F500M3G | 1.5V | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 1.575V | 1.425V | 13.5kB | 16.5mA | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | 400 kbps | MCU, FPGA | 5500 | ARM | 500000 | 100MHz | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | RoHS Compliant | Lead Free | ||||||||||||||||||||||||||||||
| Mfr Part No M2S010T-FGG484I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | YES | 233 | -40°C~100°C TJ | Tray | 2014 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 484 | MATTE TIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | NOT SPECIFIED | S-PBGA-B484 | 233 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 233 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 256KB | 2.44mm | 23mm | 23mm | RoHS Compliant | |||||||||||||||||||||||||
| Mfr Part No M2S050T-FGG484I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | YES | 267 | -40°C~100°C TJ | Tray | 2014 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 484 | MATTE TIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | NOT SPECIFIED | S-PBGA-B484 | 267 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 256KB | 2.44mm | 23mm | 23mm | RoHS Compliant |
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M2S050T-1FGG484M
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S090TS-1FG484I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S025-VFG400I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S025-FGG484I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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1SX250LU3F50E3VG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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1SX250LU3F50E1VG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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1SX250LU3F50E2LG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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1SX250LU2F50I2VG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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1SX250LU3F50I2LG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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1SX280LU2F50I1VG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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1SX250LU3F50E2VG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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1SX250LU2F50E2VG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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1SX250LU2F50E2LG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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1SX250LU3F50I1VG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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1SX280LU3F50E3VG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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1SX280LU2F50E2LG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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BCM1125HB0K600G
Broadcom Limited
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F500M3G-FGG484I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010T-FGG484I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S050T-FGG484I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire