The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Speed | RAM Size | Core Processor | Peripherals | Connectivity | Architecture | Number of Inputs | Programmable Logic Type | Number of Logic Elements/Cells | Core Architecture | Number of Logic Blocks (LABs) | Speed Grade | Primary Attributes | Number of Logic Cells | Flash Size | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status |
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 | Mfr Part No M2S090T-1FCS325 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 325-TFBGA, CSPBGA | YES | 180 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 325 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | not_compliant | NOT SPECIFIED | R-PBGA-B325 | 180 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 180 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 512KB | 1.16mm | 13.5mm | 11mm | Non-RoHS Compliant | ||||||||||||||||||
| Mfr Part No M2S090TS-FCS325I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 325-TFBGA, CSPBGA | YES | 180 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 325 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | not_compliant | NOT SPECIFIED | R-PBGA-B325 | 180 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 180 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 512KB | 1.16mm | 13.5mm | 11mm | Non-RoHS Compliant | ||||||||||||||||||
 | Mfr Part No M2S090TS-FGG484 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 484-BGA | YES | 267 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 484 | MATTE TIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | NOT SPECIFIED | S-PBGA-B484 | 267 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 512KB | 2.44mm | 23mm | 23mm | RoHS Compliant | ||||||||||||||||||||
| Mfr Part No M2S090TS-1FGG484 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 484-BGA | YES | 267 | 0°C~85°C TJ | Tray | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 484 | MATTE TIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | NOT SPECIFIED | S-PBGA-B484 | 267 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 512KB | 2.44mm | 23mm | 23mm | RoHS Compliant | |||||||||||||||||||||
| Mfr Part No M2S150T-FCV484 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BFBGA | YES | 273 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | not_compliant | NOT SPECIFIED | S-PBGA-B484 | 273 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 273 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | 3.15mm | 19mm | 19mm | Non-RoHS Compliant | ||||||||||||||||||
| Mfr Part No M2S150-1FCV484I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 484-BFBGA | YES | 273 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | not_compliant | NOT SPECIFIED | S-PBGA-B484 | 273 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 273 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | 3.15mm | 19mm | 19mm | Non-RoHS Compliant | ||||||||||||||||||
 | Mfr Part No M2S150T-FC1152 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 1152-BBGA, FCBGA | YES | 574 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | 166MHz | NOT SPECIFIED | M2S150T | S-PBGA-B1152 | 574 | Not Qualified | 1.26V | 1.2V | 1.14V | CAN, Ethernet, I2C, SPI, UART, USART, USB | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 574 | FIELD PROGRAMMABLE GATE ARRAY | ARM | FPGA - 150K Logic Modules | 146124 | 512KB | 2.9mm | 35mm | 35mm | Non-RoHS Compliant | |||||||||||||||||
| Mfr Part No M2S150T-FCVG484 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BFBGA | YES | 273 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 484 | MATTE TIN | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | NOT SPECIFIED | S-PBGA-B484 | 273 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 273 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | 3.15mm | 19mm | 19mm | RoHS Compliant | |||||||||||||||||||
 | Mfr Part No M2S090TS-FGG676 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 676-BGA | YES | 425 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 676 | MATTE TIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | NOT SPECIFIED | S-PBGA-B676 | 425 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 425 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 512KB | 2.44mm | 27mm | 27mm | RoHS Compliant | ||||||||||||||||||||
| Mfr Part No M2S090T-FGG676 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 676-BGA | YES | 425 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 676 | MATTE TIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 166MHz | NOT SPECIFIED | M2S090T | S-PBGA-B676 | 425 | Not Qualified | 1.26V | 1.2V | 1.14V | CAN, Ethernet, I2C, SPI, UART, USART, USB | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 425 | FIELD PROGRAMMABLE GATE ARRAY | ARM | FPGA - 90K Logic Modules | 86316 | 512KB | 2.44mm | 27mm | 27mm | RoHS Compliant | |||||||||||||||||
 | Mfr Part No M2S150TS-FCS536 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 536-LFBGA, CSPBGA | YES | 293 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | no | Active | 3 (168 Hours) | 536 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | not_compliant | NOT SPECIFIED | S-PBGA-B536 | 1.26V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 512KB | Non-RoHS Compliant | |||||||||||||||||||||||||||
| Mfr Part No M2S150T-1FCG1152I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 1152-BBGA, FCBGA | YES | 1152 | 574 | -40°C~100°C TJ | Tray | 2009 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | MATTE TIN | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 166MHz | NOT SPECIFIED | M2S150T | 574 | Not Qualified | 1.2V | CAN, Ethernet, I2C, SPI, UART, USART, USB | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | ARM | 1 | FPGA - 150K Logic Modules | 512KB | 2.9mm | 35mm | 35mm | RoHS Compliant | |||||||||||||||||||||||
 | Mfr Part No A2F500M3G-1FG256M | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 256-LBGA | 256 | MCU - 25, FPGA - 66 | -55°C~125°C TJ | Tray | SmartFusion® | Active | 3 (168 Hours) | 8542.39.00.01 | unknown | 100MHz | A2F500M3G | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150T-1FCG1152 | Microsemi Corporation | Datasheet | 10 | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 1152-BBGA, FCBGA | YES | 574 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | MATTE TIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 166MHz | NOT SPECIFIED | M2S150T | S-PBGA-B1152 | 574 | Not Qualified | 1.26V | 1.2V | 1.14V | CAN, Ethernet, I2C, SPI, UART, USART, USB | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 574 | FIELD PROGRAMMABLE GATE ARRAY | ARM | FPGA - 150K Logic Modules | 146124 | 512KB | 2.9mm | 35mm | 35mm | RoHS Compliant | ||||||||||||||||||
| Mfr Part No M2S025-VFG256I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 6 Weeks | 256-LBGA | YES | 138 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 256 | MATTE TIN | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | NOT SPECIFIED | S-PBGA-B256 | 138 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 138 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Modules | 27696 | 256KB | 1.56mm | 14mm | 14mm | RoHS Compliant | ||||||||||||||||||||
 | Mfr Part No M2S050-FGG896 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 896-BGA | 896 | 896-FBGA (31x31) | 377 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | Active | 3 (168 Hours) | 85°C | 0°C | 166MHz | M2S050 | 1.2V | CAN, Ethernet, I2C, SPI, UART, USART, USB | 1.26V | 1.14V | 164.3kB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 56340 | ARM | 4695 | FPGA - 50K Logic Modules | 256KB | 31mm | 31mm | No | RoHS Compliant | ||||||||||||||||||||||||||
 | Mfr Part No M2S005-VFG400 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | 400 | 400-VFBGA (17x17) | 169 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | Active | 3 (168 Hours) | 85°C | 0°C | 166MHz | M2S005 | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | ARM | FPGA - 5K Logic Modules | 128KB | RoHS Compliant | |||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010-VFG400 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | 400 | 400-VFBGA (17x17) | 195 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | Active | 3 (168 Hours) | 85°C | 0°C | 166MHz | M2S010 | 1.2V | CAN, Ethernet, I2C, SPI, UART, USART, USB | 50kB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 12084 | ARM | 1007 | FPGA - 10K Logic Modules | 256KB | 17mm | 17mm | RoHS Compliant | |||||||||||||||||||||||||||||
 | Mfr Part No BCM1125HA4K800G | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | Obsolete | 1 (Unlimited) | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No IB899F-301 | iBASE Technology | Datasheet | - | - | Min: 1 Mult: 1 | Active | 1 (Unlimited) | ROHS3 Compliant |
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M2S090T-1FCS325
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S090TS-FCS325I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S090TS-FGG484
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S090TS-1FGG484
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S150T-FCV484
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S150-1FCV484I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S150T-FC1152
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S150T-FCVG484
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S090TS-FGG676
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S090T-FGG676
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S150TS-FCS536
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S150T-1FCG1152I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F500M3G-1FG256M
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S150T-1FCG1152
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S025-VFG256I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S050-FGG896
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S005-VFG400
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010-VFG400
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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BCM1125HA4K800G
Broadcom Limited
Package:Embedded - System On Chip (SoC)
Price: please inquire
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IB899F-301
iBASE Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire