The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of I/Os | Operating Temperature (Max.) | Operating Temperature (Min.) | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Operating Supply Current | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Connectivity | Data Rate | Architecture | Number of Inputs | Programmable Logic Type | Number of Logic Elements/Cells | Core Architecture | Number of Gates | Max Frequency | Number of Logic Blocks (LABs) | Speed Grade | Primary Attributes | Number of Registers | Number of Logic Cells | Number of Equivalent Gates | Flash Size | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No XAZU5EV-1SFVC784I | Xilinx Inc. | Datasheet | 461 |
| Min: 1 Mult: 1 | 11 Weeks | YES | 100°C | -40°C | Active | 3 (168 Hours) | 784 | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | 0.8mm | NOT SPECIFIED | S-PBGA-B784 | INDUSTRIAL | MICROPROCESSOR CIRCUIT | 3.32mm | 23mm | 23mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No M2S005-TQ144 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | OBSOLETE (Last Updated: 1 month ago) | 144-LQFP | YES | 84 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Obsolete | 3 (168 Hours) | 144 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | GULL WING | NOT SPECIFIED | 1.2V | 0.5mm | not_compliant | NOT SPECIFIED | S-PQFP-G144 | 84 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 84 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 6060 | 128KB | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-1TQ144 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | OBSOLETE (Last Updated: 1 month ago) | 144-LQFP | YES | 84 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Obsolete | 3 (168 Hours) | 144 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | GULL WING | NOT SPECIFIED | 1.2V | 0.5mm | not_compliant | NOT SPECIFIED | S-PQFP-G144 | 84 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 84 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 6060 | 128KB | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
| Mfr Part No M2S010-1TQ144 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | OBSOLETE (Last Updated: 1 month ago) | 144-LQFP | YES | 144 | 84 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Obsolete | 3 (168 Hours) | 144 | Tin/Lead (Sn/Pb) | QUAD | GULL WING | NOT SPECIFIED | 1.2V | 0.5mm | not_compliant | NOT SPECIFIED | 84 | Not Qualified | 1.2V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 10K Logic Modules | 256KB | 20mm | 20mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-TQ144I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | OBSOLETE (Last Updated: 1 month ago) | 144-LQFP | YES | 84 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Obsolete | 3 (168 Hours) | 144 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | GULL WING | NOT SPECIFIED | 1.2V | 0.5mm | not_compliant | NOT SPECIFIED | S-PQFP-G144 | 84 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 84 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 6060 | 128KB | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
 | Mfr Part No BCM1480B0K800 | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Obsolete | 1 (Unlimited) | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No M2S005S-FG484 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | YES | 209 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | NOT SPECIFIED | S-PBGA-B484 | 209 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 209 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 6060 | 128KB | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||
 | Mfr Part No M2S005-1VFG400 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | 400 | 400-VFBGA (17x17) | 169 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | Active | 3 (168 Hours) | 85°C | 0°C | 166MHz | M2S005 | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | ARM | FPGA - 5K Logic Modules | 128KB | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3F-CSG288 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 288-TFBGA, CSPBGA | 288-CSP (11x11) | MCU - 31, FPGA - 78 | 0°C~85°C TJ | Tray | 2015 | SmartFusion® | Active | 3 (168 Hours) | 85°C | 0°C | 80MHz | A2F200 | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 1SX280LH2F55E2LG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 2912-BBGA, FCBGA | 1160 | 0°C~100°C TJ | Tray | Stratix® 10 SX | Active | 3 (168 Hours) | 1.5GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2800K Logic Elements | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-1TQ144 | Microsemi Corporation | Datasheet | 668 | - | Min: 1 Mult: 1 | 144-LQFP | 144-TQFP (20x20) | MCU - 21, FPGA - 33 | 0°C~85°C TJ | Tray | 2015 | SmartFusion® | Obsolete | 3 (168 Hours) | 85°C | 0°C | 100MHz | A2F060M3E | EBI/EMI, I2C, SPI, UART, USART | 100MHz | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-1TQG144I | Microsemi Corporation | Datasheet | 670 | - | Min: 1 Mult: 1 | 144-LQFP | 144-TQFP (20x20) | MCU - 21, FPGA - 33 | -40°C~100°C TJ | Tray | 2015 | SmartFusion® | Obsolete | 3 (168 Hours) | 100°C | -40°C | 100MHz | A2F060M3E | EBI/EMI, I2C, SPI, UART, USART | 100MHz | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No A2F060M3E-1FG256I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | YES | 256 | MCU - 26, FPGA - 66 | -40°C~100°C TJ | Tray | 2009 | SmartFusion® | e0 | Obsolete | 3 (168 Hours) | 256 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | 225 | 1.5V | 100MHz | 20 | A2F060M3E | 66 | 1.5V | EBI/EMI, I2C, SPI, UART, USART | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | ARM | 8 | 1 | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 1536 | 60000 | 128KB | No | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-FGG256I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 256-LBGA | 256 | 256-FPBGA (17x17) | MCU - 26, FPGA - 66 | -40°C~100°C TJ | Tray | 2015 | SmartFusion® | Obsolete | 3 (168 Hours) | 100°C | -40°C | 80MHz | A2F060M3E | 1.5V | EBI/EMI, I2C, SPI, UART, USART | 1.575V | 1.425V | 4.5kB | 3mA | 80MHz | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | 400 kbps | MCU, FPGA | 660 | ARM | 60000 | 100MHz | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005-1TQ144 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | OBSOLETE (Last Updated: 3 weeks ago) | 144-LQFP | YES | 84 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Obsolete | 3 (168 Hours) | 144 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | GULL WING | NOT SPECIFIED | 1.2V | 0.5mm | not_compliant | NOT SPECIFIED | S-PQFP-G144 | 84 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 84 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 6060 | 128KB | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-TQ144 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | OBSOLETE (Last Updated: 1 month ago) | 144-LQFP | YES | 84 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Obsolete | 3 (168 Hours) | 144 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | GULL WING | NOT SPECIFIED | 1.2V | 0.5mm | not_compliant | NOT SPECIFIED | S-PQFP-G144 | 84 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 84 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 6060 | 128KB | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-FGG256M | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | 256 | MCU - 26, FPGA - 66 | -55°C~125°C TJ | Tray | SmartFusion® | Obsolete | 3 (168 Hours) | 8542.39.00.01 | 80MHz | A2F060M3E | 1.5V | EBI/EMI, I2C, SPI, UART, USART | 1.575V | 1.425V | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010TS-1FGG484M | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | 484-BGA | YES | 233 | -55°C~125°C TJ | Tray | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 484 | 3A001.A.2.C | MATTE TIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | NOT SPECIFIED | S-PBGA-B484 | 233 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 233 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 256KB | 2.44mm | 23mm | 23mm | RoHS Compliant | |||||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-1VF256 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 256-LFBGA | YES | 161 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 256 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | not_compliant | NOT SPECIFIED | S-PBGA-B256 | 161 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 161 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 6060 | 128KB | 1.56mm | 14mm | 14mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
| Mfr Part No M2S005-1VFG400I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | 400 | 400-VFBGA (17x17) | 169 | -40°C~100°C TJ | Tray | 2009 | SmartFusion®2 | Active | 3 (168 Hours) | 100°C | -40°C | 166MHz | M2S005 | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | ARM | FPGA - 5K Logic Modules | 128KB | RoHS Compliant | Lead Free |
-
XAZU5EV-1SFVC784I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
2,269.329752
-
M2S005-TQ144
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005S-1TQ144
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010-1TQ144
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005S-TQ144I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
BCM1480B0K800
Broadcom Limited
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005S-FG484
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005-1VFG400
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F200M3F-CSG288
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
1SX280LH2F55E2LG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-1TQ144
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-1TQG144I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-1FG256I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-FGG256I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005-1TQ144
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005S-TQ144
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-FGG256M
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010TS-1FGG484M
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005S-1VF256
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005-1VFG400I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire