The category is 'Embedded - System On Chip (SoC)'
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- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Package / Case | Surface Mount | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Connectivity | Architecture | Number of Inputs | Programmable Logic Type | Primary Attributes | Number of Logic Cells | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No 10AS066K4F40E3SG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 1517-BBGA, FCBGA | YES | 696 | 0°C~100°C TJ | Tray | Arria 10 SX | Active | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | NOT SPECIFIED | S-PBGA-B1517 | 696 | Not Qualified | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 696 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 660K Logic Elements | 660000 | 3.5mm | 40mm | 40mm | RoHS Compliant | ||||||||||
 | Mfr Part No XCZU7CG-2FFVF1517I | Xilinx Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 11 Weeks | 1517-BBGA, FCBGA | YES | 464 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | NOT SPECIFIED | R-PBGA-B1517 | 0.876V | 0.825V | 533MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | ROHS3 Compliant | ||||||||||||||||||
 | Mfr Part No 10AS032H4F35E3SG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 1152-BBGA, FCBGA | YES | 384 | 0°C~100°C TJ | Tray | Arria 10 SX | Active | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | NOT SPECIFIED | S-PBGA-B1152 | 384 | Not Qualified | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 320K Logic Elements | 320000 | 3.5mm | 35mm | 35mm | RoHS Compliant | ||||||||||
 | Mfr Part No 5ASTFD3G3F35I5N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 1152-BBGA, FCBGA | YES | MCU - 208, FPGA - 385 | -40°C~100°C TJ | Tray | Arria V ST | e1 | Active | 3 (168 Hours) | TIN SILVER COPPER | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | NOT SPECIFIED | 5ASTFD3 | S-PBGA-B1152 | 1.13V | 1.07V | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | 622MHz | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 350K Logic Elements | 2.7mm | 35mm | 35mm | RoHS Compliant | |||||||||||
 | Mfr Part No 5ASTMD3E3F31I3N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 896-BBGA, FCBGA | YES | MCU - 208, FPGA - 250 | -40°C~100°C TJ | Tray | Arria V ST | e1 | Active | 3 (168 Hours) | 896 | TIN SILVER COPPER | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.15V | 1mm | NOT SPECIFIED | 5ASTMD3 | S-PBGA-B896 | 1.18V | 1.12V | 1.05GHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | 670MHz | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 350K Logic Elements | 2.7mm | 31mm | 31mm | RoHS Compliant | ||||||||||
| Mfr Part No 5ASTFD3G3F35I3N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 1152-BBGA, FCBGA | YES | MCU - 208, FPGA - 385 | -40°C~100°C TJ | Tray | Arria V ST | e1 | Active | 3 (168 Hours) | TIN SILVER COPPER | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.15V | 1mm | NOT SPECIFIED | 5ASTFD3 | S-PBGA-B1152 | 1.18V | 1.12V | 1.05GHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | 670MHz | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 350K Logic Elements | 2.7mm | 35mm | 35mm | RoHS Compliant | |||||||||||
| Mfr Part No 5ASXMB3E4F31C5N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 896-BBGA, FCBGA | YES | MCU - 208, FPGA - 250 | 0°C~85°C TJ | Tray | Arria V SX | e1 | Active | 3 (168 Hours) | 896 | TIN SILVER COPPER | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | NOT SPECIFIED | 5ASXMB3 | S-PBGA-B896 | 1.13V | 1.07V | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | 622MHz | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 350K Logic Elements | 2.7mm | 31mm | 31mm | RoHS Compliant | ||||||||||
| Mfr Part No XCZU19EG-3FFVC1760E | Xilinx Inc. | Datasheet | 480 | - | Min: 1 Mult: 1 | 11 Weeks | 1760-BBGA, FCBGA | 512 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | ROHS3 Compliant | ||||||||||||||||||||||||||
 | Mfr Part No 5CSEBA5U23C7N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 672-FBGA | YES | MCU - 181, FPGA - 145 | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SE | Active | 3 (168 Hours) | 672 | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | NOT SPECIFIED | 5CSEBA5 | S-PBGA-B672 | 145 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 85K Logic Elements | 85000 | 1.85mm | 23mm | 23mm | RoHS Compliant | |||||||
| Mfr Part No 10AS066K3F35I2SG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 1152-BBGA, FCBGA | YES | 396 | -40°C~100°C TJ | Tray | Arria 10 SX | Active | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | NOT SPECIFIED | S-PBGA-B1152 | 396 | Not Qualified | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 660K Logic Elements | 660000 | 3.5mm | 35mm | 35mm | RoHS Compliant | ||||||||||
 | Mfr Part No 10AS066N3F40I2LG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 1517-BBGA, FCBGA | YES | 588 | -40°C~100°C TJ | Tray | Arria 10 SX | Active | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | NOT SPECIFIED | S-PBGA-B1517 | 588 | Not Qualified | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 588 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 660K Logic Elements | 660000 | 3.5mm | 40mm | 40mm | RoHS Compliant | ||||||||||
| Mfr Part No 5CSEMA2U23C7N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 672-FBGA | YES | MCU - 181, FPGA - 145 | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SE | Active | 3 (168 Hours) | 672 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | NOT SPECIFIED | S-PBGA-B672 | 145 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Elements | 25000 | 1.85mm | 23mm | 23mm | RoHS Compliant | |||||||||
 | Mfr Part No XCZU2CG-L2SFVC784E | Xilinx Inc. | Datasheet | 73 | - | Min: 1 Mult: 1 | 11 Weeks | 784-BFBGA, FCBGA | YES | 252 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | 784 | IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM) | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | S-PBGA-B784 | 533MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ROHS3 Compliant | ||||||||||||||||||
| Mfr Part No 5CSEBA6U23I7NTS | Intel | Datasheet | 1788 | - | Min: 1 Mult: 1 | 8 Weeks | 672-FBGA | MCU - 181, FPGA - 145 | -40°C~100°C TJ | Tray | 2018 | Cyclone® V SE | Active | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 110K Logic Elements | |||||||||||||||||||||||||||||||
| Mfr Part No XCZU17EG-L1FFVD1760I | Xilinx Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 11 Weeks | 1760-BBGA, FCBGA | YES | 308 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | R-PBGA-B1760 | 0.742V | 0.698V | 500MHz, 600MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||
 | Mfr Part No XCZU3CG-L2SBVA484E | Xilinx Inc. | Datasheet | 544 | - | Min: 1 Mult: 1 | 11 Weeks | 484-BFBGA, FCBGA | YES | 82 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | 484 | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | R-PBGA-B484 | 0.742V | 0.698V | 533MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | ROHS3 Compliant | ||||||||||||||||
| Mfr Part No XCZU17EG-2FFVB1517E | Xilinx Inc. | Datasheet | 32 | - | Min: 1 Mult: 1 | 11 Weeks | 1517-BBGA, FCBGA | 644 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | yes | Active | 4 (72 Hours) | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||||
 | Mfr Part No 10AS032E3F27I2SG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 672-BBGA, FCBGA | YES | 240 | -40°C~100°C TJ | Tray | Arria 10 SX | Active | 3 (168 Hours) | 672 | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | NOT SPECIFIED | S-PBGA-B672 | 240 | Not Qualified | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 320K Logic Elements | 320000 | 3.25mm | 27mm | 27mm | RoHS Compliant | |||||||||
| Mfr Part No XCZU11EG-L2FFVB1517E | Xilinx Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 11 Weeks | 1517-BBGA, FCBGA | YES | 488 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | R-PBGA-B1517 | 0.742V | 0.698V | 533MHz, 600MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||
 | Mfr Part No 5CSEBA6U19C8N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 484-FBGA | YES | MCU - 151, FPGA - 66 | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SE | Active | 3 (168 Hours) | 484 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | NOT SPECIFIED | 5CSEBA6 | S-PBGA-B484 | 66 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 600MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 66 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 110K Logic Elements | 110000 | 1.9mm | 19mm | 19mm | RoHS Compliant |
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10AS066K4F40E3SG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU7CG-2FFVF1517I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS032H4F35E3SG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5ASTFD3G3F35I5N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5ASTMD3E3F31I3N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5ASTFD3G3F35I3N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5ASXMB3E4F31C5N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU19EG-3FFVC1760E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5CSEBA5U23C7N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS066K3F35I2SG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS066N3F40I2LG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5CSEMA2U23C7N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU2CG-L2SFVC784E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5CSEBA6U23I7NTS
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU17EG-L1FFVD1760I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU3CG-L2SBVA484E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU17EG-2FFVB1517E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS032E3F27I2SG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU11EG-L2FFVB1517E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5CSEBA6U19C8N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire