The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Package / Case | Surface Mount | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Connectivity | Architecture | Number of Inputs | Programmable Logic Type | Primary Attributes | Number of Logic Cells | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No 1SX250LN3F43I3VG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 1760-BBGA, FCBGA | 688 | -40°C~100°C TJ | Tray | Stratix® 10 SX | Active | 3 (168 Hours) | 1.5GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2500K Logic Elements | RoHS Compliant | |||||||||||||||||||||||||||||
| Mfr Part No 1SX280LN3F43I1VG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 1760-BBGA, FCBGA | 688 | -40°C~100°C TJ | Tray | Stratix® 10 SX | Active | 3 (168 Hours) | 1.5GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2800K Logic Elements | RoHS Compliant | |||||||||||||||||||||||||||||
| Mfr Part No 1SX280LN3F43I2VG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 1760-BBGA, FCBGA | 688 | -40°C~100°C TJ | Tray | Stratix® 10 SX | Active | 3 (168 Hours) | 1.5GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2800K Logic Elements | RoHS Compliant | |||||||||||||||||||||||||||||
| Mfr Part No 1SX280LN3F43E1VG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 1760-BBGA, FCBGA | 688 | 0°C~100°C TJ | Tray | Stratix® 10 SX | Active | 3 (168 Hours) | 1.5GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2800K Logic Elements | RoHS Compliant | |||||||||||||||||||||||||||||
| Mfr Part No 1SX280LN3F43E3VG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 1760-BBGA, FCBGA | 688 | 0°C~100°C TJ | Tray | Stratix® 10 SX | Active | 3 (168 Hours) | 1.5GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2800K Logic Elements | RoHS Compliant | |||||||||||||||||||||||||||||
 | Mfr Part No XCZU19EG-L1FFVE1924I | Xilinx Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 11 Weeks | 1924-BBGA, FCBGA | YES | 668 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | R-PBGA-B1924 | 0.742V | 0.698V | 500MHz, 600MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||
 | Mfr Part No 10AS016E4F27E3LG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 672-BBGA, FCBGA | YES | 240 | 0°C~100°C TJ | Tray | Arria 10 SX | Active | 3 (168 Hours) | 672 | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | NOT SPECIFIED | S-PBGA-B672 | 240 | Not Qualified | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 160K Logic Elements | 160000 | 3.25mm | 27mm | 27mm | RoHS Compliant | |||||||||
| Mfr Part No XCZU17EG-L2FFVE1924E | Xilinx Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 11 Weeks | 1924-BBGA, FCBGA | YES | 668 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | R-PBGA-B1924 | 0.742V | 0.698V | 533MHz, 600MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||
 | Mfr Part No 10AS016E4F29E3LG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 780-BBGA, FCBGA | YES | 288 | 0°C~100°C TJ | Tray | Arria 10 SX | Active | 3 (168 Hours) | 780 | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | NOT SPECIFIED | S-PBGA-B780 | 288 | Not Qualified | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 160K Logic Elements | 160000 | 3.35mm | 29mm | 29mm | RoHS Compliant | |||||||||
| Mfr Part No 10AS027E2F29E1HG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 780-BBGA, FCBGA | 360 | 0°C~100°C TJ | Tray | Arria 10 SX | Active | 3 (168 Hours) | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 270K Logic Elements | RoHS Compliant | ||||||||||||||||||||||||||||||
| Mfr Part No BCM47452B0KRFBG | Broadcom Limited | Datasheet | 20640 | - | Min: 1 Mult: 1 | 22 Weeks | Active | 1 (Unlimited) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 5ASXBB3D4F31C6N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 896-BBGA, FCBGA | YES | MCU - 208, FPGA - 250 | 0°C~85°C TJ | Tray | Arria V SX | e1 | Obsolete | 3 (168 Hours) | 896 | TIN SILVER COPPER | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | compliant | NOT SPECIFIED | 5ASXBB3 | S-PBGA-B896 | 1.13V | 1.07V | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | 500MHz | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 350K Logic Elements | 2.7mm | 31mm | 31mm | RoHS Compliant | |||||||||||
| Mfr Part No 5ASXMB5E4F31C6N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 896-BBGA, FCBGA | YES | MCU - 208, FPGA - 250 | 0°C~85°C TJ | Tray | Arria V SX | e1 | Obsolete | 3 (168 Hours) | 896 | TIN SILVER COPPER | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | compliant | NOT SPECIFIED | 5ASXMB5 | S-PBGA-B896 | 1.13V | 1.07V | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | 500MHz | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 462K Logic Elements | 2.7mm | 31mm | 31mm | RoHS Compliant | |||||||||||
| Mfr Part No 5ASXBB5D4F31C6N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 896-BBGA, FCBGA | YES | MCU - 208, FPGA - 250 | 0°C~85°C TJ | Tray | Arria V SX | e1 | Obsolete | 3 (168 Hours) | 896 | TIN SILVER COPPER | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | compliant | NOT SPECIFIED | 5ASXBB5 | S-PBGA-B896 | 1.13V | 1.07V | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | 500MHz | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 462K Logic Elements | 2.7mm | 31mm | 31mm | RoHS Compliant | |||||||||||
 | Mfr Part No 5ASXBB5D4F35C6N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | MCU - 208, FPGA - 385 | 0°C~85°C TJ | Tray | Arria V SX | e1 | Obsolete | 3 (168 Hours) | TIN SILVER COPPER | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | compliant | NOT SPECIFIED | 5ASXBB5 | S-PBGA-B1152 | 1.13V | 1.07V | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | 500MHz | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 462K Logic Elements | 2.7mm | 35mm | 35mm | RoHS Compliant | ||||||||||||
| Mfr Part No 5ASXFB5G4F35C6N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | MCU - 208, FPGA - 385 | 0°C~85°C TJ | Tray | Arria V SX | e1 | Obsolete | 3 (168 Hours) | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | compliant | NOT SPECIFIED | 5ASXFB5 | S-PBGA-B1152 | 350 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | 500MHz | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 350 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 462K Logic Elements | 420000 | 2.7mm | 35mm | 35mm | RoHS Compliant | ||||||
| Mfr Part No 5ASXMB3E4F31C6N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 896-BBGA, FCBGA | YES | MCU - 208, FPGA - 250 | 0°C~85°C TJ | Tray | Arria V SX | e1 | Obsolete | 3 (168 Hours) | 896 | TIN SILVER COPPER | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | compliant | NOT SPECIFIED | 5ASXMB3 | S-PBGA-B896 | 1.13V | 1.07V | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | 500MHz | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 350K Logic Elements | 2.7mm | 31mm | 31mm | RoHS Compliant | |||||||||||
| Mfr Part No 5ASXBB3D4F35C6N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | MCU - 208, FPGA - 385 | 0°C~85°C TJ | Tray | Arria V SX | e1 | Obsolete | 3 (168 Hours) | TIN SILVER COPPER | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | compliant | NOT SPECIFIED | 5ASXBB3 | S-PBGA-B1152 | 1.13V | 1.07V | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | 500MHz | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 350K Logic Elements | 2.7mm | 35mm | 35mm | RoHS Compliant | ||||||||||||
| Mfr Part No 5ASXFB3G4F35C6N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | MCU - 208, FPGA - 385 | 0°C~85°C TJ | Tray | Arria V SX | e1 | Obsolete | 3 (168 Hours) | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | compliant | NOT SPECIFIED | 5ASXFB3 | S-PBGA-B1152 | 350 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | 500MHz | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 350 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 350K Logic Elements | 350000 | 2.7mm | 35mm | 35mm | RoHS Compliant | ||||||
| Mfr Part No 1SX250LN3F43E1VG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 1760-BBGA, FCBGA | 688 | 0°C~100°C TJ | Tray | Stratix® 10 SX | Active | 3 (168 Hours) | 1.5GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2500K Logic Elements | RoHS Compliant |
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1SX250LN3F43I3VG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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1SX280LN3F43I1VG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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1SX280LN3F43I2VG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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1SX280LN3F43E1VG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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1SX280LN3F43E3VG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU19EG-L1FFVE1924I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS016E4F27E3LG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU17EG-L2FFVE1924E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS016E4F29E3LG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS027E2F29E1HG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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BCM47452B0KRFBG
Broadcom Limited
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5ASXBB3D4F31C6N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5ASXMB5E4F31C6N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5ASXBB5D4F31C6N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5ASXBB5D4F35C6N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5ASXFB5G4F35C6N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5ASXMB3E4F31C6N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5ASXBB3D4F35C6N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5ASXFB3G4F35C6N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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1SX250LN3F43E1VG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire