The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Shell Material | Supplier Device Package | Housing Material | Insert Material | Number of Terminals | Backshell Material, Plating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Material - Post | Base Product Number | Brand | Contact Finish Mating | Contact Materials | Data Converters | Data RAM Size | Data RAM Type | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Interface Type | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Data Rate | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Mounting Styles | MSL | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Primary Material | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Current Receiving | Supply Current Transmitting | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Voltage-Input | Voltage, Rating | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | Part Status | Number of Terminations | Termination | Temperature Coefficient | Connector Type | Type | Resistance | Number of Positions | Composition | Color | Applications | Power (Watts) | HTS Code | Fastening Type | Subcategory | Current Rating (Amps) | Technology | Voltage - Supply | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Reach Compliance Code | Current Rating | Frequency | Pitch - Mating | Frequency Stability | Output | Shell Finish | Shell Size - Insert | JESD-30 Code | Function | Base Resonator | Current - Supply (Max) | Number of Outputs | Qualification Status | Contact Finish - Post | Operating Frequency | Efficiency | Operating Supply Voltage | Failure Rate | Power Supplies | Contact Resistance | Temperature Grade | Current - Supply (Disable) (Max) | Interface | Oscillator Type | Current - Output (Max) | Speed | RAM Size | Shell Size, MIL | Voltage - Supply (Vcc/Vdd) | Core Processor | Peripherals | Program Memory Type | Core Size | Program Memory Size | Spread Spectrum Bandwidth | Connectivity | Output Power | Cable Opening | Voltage - Output | Architecture | Data Bus Width | Number of Inputs | Seated Height-Max | Programmable Logic Type | Product Type | EEPROM Size | Form | Termination Post Length | Pitch - Post | Number of Transceivers | Absolute Pull Range (APR) | Sensitivity | Number of ADC Channels | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Features | Product Category | Device Core | Height Seated (Max) | Length | Width | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Material Flammability Rating | Ratings |
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![]() | Mfr Part No AGFA006R16A2E4X | Intel | Datasheet | 538 | - | Min: 1 Mult: 1 | Panel Mount, Through Hole | - | Flange | Aluminum | - | Gold | Copper Alloy | Glenair | 384 | Retail Package | Metal | Active | -65°C ~ 175°C | 806 | Solder | Receptacle, Female Sockets | Olive Drab | Threaded | B | Olive Drab Cadmium | 24-20A | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MSCMMX6QZDK08AB1G0A | NXP | Datasheet | - | - | Min: 1 Mult: 1 | Panel Mount | Bulkhead - Rear Side Nut | Zinc Alloy | Polyamide (PA), Nylon, Glass Filled | - | M12D-04PMMS | Gold | Copper Alloy | Amphenol LTW | Bulk | Metal | Active | 250V | -40°C ~ 105°C | M | Solder Cup | Receptacle, Male Pins | 4 | Silver | - | Threaded | 4A | D | Unshielded | IP68/IP69K - Dust Tight, Water Resistant, Waterproof | Nickel | M12-4 | - | - | - | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No PIC32MZ1025W104132-I/NX | Microchip | Datasheet | 268 | - | Min: 1 Mult: 1 | Surface Mount | DQFN-132 | 132-VQFN (10x10) | PIC32MZ1025 | Microchip Technology / Atmel | A/D 20x12b SAR | 256 kB | SRAM | 168 | CAN, I2C, SPI, UART | Microchip | 80 MHz | 54 Mbps | + 85 C | Microchip Technology | - 40 C | Yes | SMD/SMT | MSL 3 - 168 hours | 64 I/O | Tray | Active | 88 mA | 287 mA | 3.63 V | 2.97 V | -40°C ~ 85°C (TA) | Tray | PIC® 32MZ | Wi-Fi | Wireless & RF Integrated Circuits | Si | 2.4 GHz | CAN, Ethernet, I2C, I2S, SPI, UART, USB | Internal | 200MHz | 256K x 8 | 2.97V ~ 3.63V | MIPS32® M-Class | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | Flash | 32-Bit Single-Core | 1MB | CANbus, Ethernet, I²C, IrDA, SPI, SQI, UART/USART, USB OTG | 21.5 dBm | 32bit | RF System on a Chip - SoC | - | - 76 dBm | 20 Channel | RF System on a Chip - SoC | PIC32 MZ | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU47DR-L1FFVE1156I | Xilinx | Datasheet | 72 | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AUTEC POWER SYSTEMS | 366 | Case | Active | 100 ~ 240 VAC | -40°C ~ 100°C (TJ) | DT030GS (30W) | ITE (Commercial) | 30 W | Level VI | 536mA | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 56V | MCU, FPGA | Desktop | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU47DR-2FFVE1156E | Xilinx | Datasheet | 160 | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | CIR06 | ITT Cannon, LLC | 366 | Bulk | Active | 0°C ~ 100°C (TJ) | * | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPFS095T-FCVG484T2 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | Polyamide (PA46), Nylon 4/6, Glass Filled | -- | Beryllium Copper | Brass | Gold | Microchip Technology | MCU - 136, FPGA - 108 | Tray | Active | -55°C ~ 105°C | Bulk | PGM | Active | Solder | PGA | 3A | 0.100 (2.54mm) | Tin | -- | - | 857.6KB | RISC-V | DMA, PCI, PWM | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | 0.165 (4.19mm) | 0.100 (2.54mm) | FPGA - 93K Logic Modules | 128KB | -- | 10.0µin (0.25µm) | 200.0µin (5.08µm) | UL94 V-0 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS048E1F29I1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 2010 (5025 Metric) | YES | 2010 | 780 | INTEL CORP | Intel Corporation | 10AS048E1F29I1SG | Kamaya Inc. | 360 | 100 °C | -40 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | 29 X 29 MM, ROHS COMPLIANT, FBGA-780 | SQUARE | GRID ARRAY | Obsolete | Active | 5.68 | Yes | 0.93 V | 0.87 V | 0.9 V | -55°C ~ 155°C | Tray | RMC | 0.197 L x 0.098 W (5.00mm x 2.50mm) | ±1% | Discontinued at Digi-Key | 2 | ±100ppm/°C | 2.32 kOhms | Thick Film | 0.75W, 3/4W | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B780 | - | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.35 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 480K Logic Elements | -- | - | 0.028 (0.70mm) | 29 mm | 29 mm | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS048H2F34I1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 0402 (1005 Metric) | YES | 0402 | 1152 | RN73R1E | INTEL CORP | Intel Corporation | 10AS048H2F34I1SG | KOA Speer Electronics, Inc. | 492 | 100 °C | -40 °C | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | PLASTIC/EPOXY | BGA | 35 X 35 MM, ROHS COMPLIANT, FBGA-1152 | SQUARE | GRID ARRAY | Obsolete | Active | 5.68 | Yes | 0.93 V | 0.87 V | 0.9 V | -55°C ~ 155°C | Tray | RN73R | 0.039 L x 0.020 W (1.00mm x 0.50mm) | ±0.25% | Discontinued at Digi-Key | 2 | ±10ppm/°C | 3.28 kOhms | Thin Film | 0.063W, 1/16W | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | - | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 480K Logic Elements | -- | Automotive AEC-Q200, Moisture Resistant | 0.016 (0.40mm) | 35 mm | 35 mm | AEC-Q200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS032E2F27I1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 672-BBGA, FCBGA | YES | 672-FBGA (27x27) | 672 | INTEL CORP | Intel Corporation | 10AS032E2F27I1SG | PEI-Genesis | 240 | 100 °C | -40 °C | Bulk | PLASTIC/EPOXY | BGA | 27 X 27 MM, ROHS COMPLIANT, FBGA-672 | SQUARE | GRID ARRAY | Obsolete | Active | 5.66 | Non-Compliant | Yes | 0.93 V | 0.87 V | 0.9 V | -40°C ~ 100°C (TJ) | Tray | * | Discontinued at Digi-Key | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B672 | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.25 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 320K Logic Elements | -- | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS032E1F29I1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | YES | 780-FBGA (29x29) | 780 | 533 | INTEL CORP | Intel Corporation | 10AS032E1F29I1SG | CTS-Frequency Controls | 360 | 100 °C | -40 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | 29 X 29 MM, ROHS COMPLIANT, FBGA-780 | SQUARE | GRID ARRAY | Obsolete | Active | 5.66 | Non-Compliant | Yes | 0.93 V | 0.87 V | 0.9 V | -20°C ~ 70°C | Tray | 533 | 0.197 L x 0.126 W (5.00mm x 3.20mm) | Discontinued at Digi-Key | TCXO | 8542.39.00.01 | 3V | BOTTOM | BALL | 1 mm | compliant | 24 MHz | ±2ppm | HCMOS | S-PBGA-B780 | Standby (Power Down) | Crystal | 10mA | INDUSTRIAL | 10µA | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.35 mm | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - 320K Logic Elements | -- | 0.065 (1.65mm) | 29 mm | 29 mm | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS057K1F35I1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | INTEL CORP | Intel Corporation | 10AS057K1F35I1SG | PEI-Genesis | 396 | 100 °C | -40 °C | Bulk | PLASTIC/EPOXY | BGA | 35 X 35 MM, ROHS COMPLIANT, FBGA-1152 | SQUARE | GRID ARRAY | Obsolete | Active | 5.66 | Yes | 0.93 V | 0.87 V | 0.9 V | -40°C ~ 100°C (TJ) | Tray | * | Discontinued at Digi-Key | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 570K Logic Elements | -- | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 1SX280LU3F50I2VG | ALTERA | Datasheet | 788 |
| Min: 1 Mult: 1 | Glenair | 704 | Retail Package | Active | -40°C ~ 100°C (TJ) | Tray | * | Active | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2800K Logic Elements | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 1SX250LN3F43E2LG | ALTERA | Datasheet | 400 |
| Min: 1 Mult: 1 | PEI-Genesis | 688 | Bulk | Active | 0°C ~ 100°C (TJ) | Tray | * | Active | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2500K Logic Elements | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS066K4F35I3SGES | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FBGA (35x35) | 1152 | INTEL CORP | Intel Corporation | 10AS066K4F35I3SGES | Knowles Syfer | 396 | 100 °C | -40 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | Active | 5.66 | 0.93 V | 0.87 V | 0.9 V | -40°C ~ 100°C (TJ) | Tray | * | Discontinued at Digi-Key | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 660K Logic Elements | -- | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS066K2F35I1HG | ALTERA | Datasheet | 435 |
| Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel / Altera | - | 24 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS066K2F35I1HG | 1.2 GHz | + 100 C | PEI-Genesis | - 40 C | Yes | SMD/SMT | 396 | 82500 LAB | 660000 LE | Bulk | 967072 | Active | Active | 5.67 | Details | Yes | This product may require additional documentation to export from the United States. | Arria 10 SoC | -40°C ~ 100°C (TJ) | Tray | * | Active | SOC - Systems on a Chip | unknown | 950 mV | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | FPGA - 660K Logic Elements | 2 Core | -- | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS057N3F40I2LG | ALTERA | Datasheet | 560 |
| Min: 1 Mult: 1 | Axial | YES | Axial | 1517 | Intel / Altera | - | 21 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS057N3F40I2LG | 1.2 GHz | Stackpole Electronics Inc | Yes | SMD/SMT | 588 | 71250 LAB | 570000 LE | 100 °C | -40 °C | Bulk | PLASTIC/EPOXY | BGA | BGA, BGA1517,39X39,40 | BGA1517,39X39,40 | SQUARE | GRID ARRAY | 965378 | Active | Active | NOT SPECIFIED | 5.45 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -55°C ~ 155°C | Tray | RNF | 0.108 Dia x 0.344 L (2.75mm x 8.75mm) | ±1% | Active | 2 | ±100ppm/°C | 487 kOhms | Metal Film | 0.5W, 1/2W | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1517 | 588 | Not Qualified | - | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 588 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 570K Logic Elements | 570000 | 2 Core | -- | Flame Retardant Coating, Safety | SoC FPGA | - | 40 mm | 40 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 1SX280LH2F55I2LG | ALTERA | Datasheet | 550 |
| Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | Intel / Altera | - | 10 | 4 x 32 kB | 4 x 32 kB | Intel | 1 GHz | + 100 C | SiTime | - 40 C | Yes | SMD/SMT | 1160 | 350000 LAB | 2800000 LE | Tape & Reel (TR) | 960576 | Active | Details | This product may require additional documentation to export from the United States. | Stratix | -40°C ~ 85°C | Tray | SiT8208 | 0.276 L x 0.197 W (7.00mm x 5.00mm) | Active | XO (Standard) | SOC - Systems on a Chip | 2.5V | 74.175824 MHz | ±10ppm | LVCMOS, LVTTL | Standby (Power Down) | MEMS | 33mA | 0.85 V | 70µA | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | - | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | 24 Transceiver | - | FPGA - 2800K Logic Elements | 4 Core | -- | SoC FPGA | 0.039 (1.00mm) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS057K2F40E2LG | ALTERA | Datasheet | 547 |
| Min: 1 Mult: 1 | 1517-BBGA, FCBGA | YES | 1517-FCBGA (40x40) | 1517 | Intel / Altera | - | 21 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS057K2F40E2LG | 1.2 GHz | Glenair | Yes | SMD/SMT | 696 | 71250 LAB | 570000 LE | 100 °C | Retail Package | PLASTIC/EPOXY | BGA | BGA, BGA1517,39X39,40 | BGA1517,39X39,40 | SQUARE | GRID ARRAY | 965015 | Active | Active | NOT SPECIFIED | 5.45 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 0°C ~ 100°C (TJ) | Tray | * | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1517 | 696 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 696 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 570K Logic Elements | 570000 | 2 Core | -- | SoC FPGA | 40 mm | 40 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS066H3F34I2LG | ALTERA | Datasheet | 439 |
| Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | Intel / Altera | - | 24 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS066H3F34I2LG | 1.2 GHz | Glenair | Yes | SMD/SMT | 492 | 82500 LAB | 660000 LE | 100 °C | -40 °C | Retail Package | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 965023 | Active | Active | NOT SPECIFIED | 5.45 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -40°C ~ 100°C (TJ) | Tray | * | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 492 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 660K Logic Elements | 660000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS048H4F34I3SG | ALTERA | Datasheet | 693 |
| Min: 1 Mult: 1 | YES | 1152 | INTEL CORP | Intel Corporation | 10AS048H4F34I3SG | EDAC Inc. | 492 | 100 °C | -40 °C | Bulk | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | NOT SPECIFIED | 5.47 | Yes | 0.93 V | 0.87 V | 0.9 V | -40°C ~ 100°C (TJ) | Tray | * | Active | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 492 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 480K Logic Elements | 480000 | -- | 35 mm | 35 mm |
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