The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mount | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Number of Pins | Shell Material | Supplier Device Package | Material | Housing Material | Number of Terminals | Base Product Number | Brand | Case Code - in | Case Code - mm | Contact Finish Mating | Contact Materials | Data RAM Size | Duty Cycle - Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Primary Material | Product Status | Reflow Temperature-Max (s) | Resistor Values | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Unit Weight | Voltage, Rating | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | Part Status | Termination | Temperature Coefficient | Connector Type | Type | Resistance | Number of Positions | Max Operating Temperature | Min Operating Temperature | Color | HTS Code | Fastening Type | Subcategory | Power Rating | Current Rating (Amps) | Technology | Voltage - Supply | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Depth | Style | Reach Compliance Code | Current Rating | Frequency | Frequency Stability | Output | Shell Finish | Shell Size - Insert | Termination Style | JESD-30 Code | Function | Base Resonator | Current - Supply (Max) | Number of Outputs | Qualification Status | Operating Supply Voltage | ESR (Equivalent Series Resistance) | Power Supplies | Temperature Grade | Current - Supply (Disable) (Max) | Inductance | Interface | Memory Size | Load Capacitance | Speed | RAM Size | Operating Mode | Shell Size, MIL | Core Processor | Number of Resistors | Frequency Tolerance | Peripherals | Program Memory Size | Spread Spectrum Bandwidth | Connectivity | Architecture | Number of Inputs | Circuit Type | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Operating Temperature Range | ESR | Core Architecture | Speed Grade | Output Format | Number of Transceivers | Absolute Pull Range (APR) | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Product | Features | Product Category | Height | Height Seated (Max) | Length | Width | Contact Finish Thickness - Mating | REACH SVHC | Flammability Rating | Ratings |
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![]() | Mfr Part No 10AS032H3F35E2SG | ALTERA | Datasheet | 493 |
| Min: 1 Mult: 1 | FBGA-1152 | YES | 1152 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS032H3F35E2SG | 1.2 GHz | EDAC Inc. | Yes | SMD/SMT | 384 | 40000 LAB | 320000 LE | 100 °C | Bulk | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 965061 | Active | Active | NOT SPECIFIED | 5.45 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 0°C ~ 100°C (TJ) | Tray | * | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 384 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 320K Logic Elements | 320000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS032E2F27E2SG | ALTERA | Datasheet | 524 |
| Min: 1 Mult: 1 | FBGA-672 | YES | 672 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS032E2F27E2SG | 1.2 GHz | Glenair | Yes | SMD/SMT | 240 | 40000 LAB | 320000 LE | 100 °C | Retail Package | PLASTIC/EPOXY | BGA | BGA, BGA672,26X26,40 | BGA672,26X26,40 | SQUARE | GRID ARRAY | 965289 | Active | Active | NOT SPECIFIED | 5.45 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 0°C ~ 100°C (TJ) | Tray | * | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B672 | 240 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 3.25 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 320K Logic Elements | 320000 | 2 Core | -- | SoC FPGA | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS032E4F29I3LG | ALTERA | Datasheet | 507 |
| Min: 1 Mult: 1 | Panel Mount, Through Hole | FBGA-780 | YES | Flange | Stainless Steel | 780 | Intel / Altera | Gold | Copper Alloy | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS032E4F29I3LG | 1.2 GHz | Glenair | Yes | SMD/SMT | 360 | 40000 LAB | 320000 LE | 100 °C | -40 °C | Retail Package | PLASTIC/EPOXY | BGA | BGA, BGA780,28X28,40 | BGA780,28X28,40 | SQUARE | GRID ARRAY | 964847 | Active | Metal | Active | NOT SPECIFIED | 5.45 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -65°C ~ 175°C | Tray | 806 | Active | Solder | Plug, Male Pins | Silver | 8542.39.00.01 | Threaded | SOC - Systems on a Chip | CMOS | BOTTOM | F | BALL | NOT SPECIFIED | 1 mm | compliant | Passivated | 26-20A | S-PBGA-B780 | 360 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 360 | 3.35 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 320K Logic Elements | 320000 | 2 Core | -- | SoC FPGA | 29 mm | 29 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS057K4F35I3SG | ALTERA | Datasheet | 616 |
| Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | KYOCERA AVX | 396 | Bulk | Active | -40°C ~ 100°C (TJ) | Tray | * | Active | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 570K Logic Elements | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS027E2F27E2SG | ALTERA | Datasheet | 470 |
| Min: 1 Mult: 1 | Panel Mount | FBGA-672 | YES | Flange | Aluminum Alloy | 672 | KJB0T | Intel / Altera | Gold | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS027E2F27E2SG | 1.2 GHz | ITT Cannon, LLC | Yes | SMD/SMT | 240 | 33750 LAB | 270000 LE | 100 °C | Bulk | PLASTIC/EPOXY | BGA | BGA, BGA672,26X26,40 | BGA672,26X26,40 | SQUARE | GRID ARRAY | 964965 | Active | Metal | Active | NOT SPECIFIED | 5.43 | Non-Compliant | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | - | -65°C ~ 175°C | Tray | KJB | Active | Crimp | Receptacle, Female Sockets | 22 | Olive Drab | 8542.39.00.01 | Threaded | SOC - Systems on a Chip | - | CMOS | BOTTOM | C | BALL | - | NOT SPECIFIED | Environment Resistant | 1 mm | compliant | Olive Drab Cadmium | 13-35 | S-PBGA-B672 | 240 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 3.25 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | - | SoC FPGA | 27 mm | 27 mm | 50.0µin (1.27µm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS027E2F29E1HG | ALTERA | Datasheet | 545 |
| Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 780-FBGA (29x29) | SG-8101 | Intel / Altera | - | 36 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS027E2F29E1HG | 1.2 GHz | + 100 C | EPSON | 0 C | Yes | SMD/SMT | 360 | 33750 LAB | 270000 LE | Tape & Reel (TR) | 965044 | Active | Active | 5.64 | Details | Yes | Arria 10 SoC | -40°C ~ 85°C | Tray | SG-8101 | 0.197 L x 0.126 W (5.00mm x 3.20mm) | Active | XO (Standard) | SOC - Systems on a Chip | 1.8V ~ 3.3V | unknown | 36.7 MHz | ±15ppm | CMOS | Standby (Power Down) | Crystal | 6.8mA (Typ) | 950 mV | 1.1µA | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | 12 Transceiver | - | FPGA - 270K Logic Elements | 2 Core | -- | SoC FPGA | 0.051 (1.30mm) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS016E4F29E3SG | ALTERA | Datasheet | 551 |
| Min: 1 Mult: 1 | 780-BBGA, FCBGA | YES | 780-FBGA (29x29) | 780 | INTEL CORP | Intel Corporation | 10AS016E4F29E3SG | PEI-Genesis | 288 | 100 °C | Bulk | PLASTIC/EPOXY | BGA | BGA, BGA780,28X28,40 | BGA780,28X28,40 | SQUARE | GRID ARRAY | Active | Active | NOT SPECIFIED | 1.96 | Non-Compliant | Yes | 0.93 V | 0.87 V | 0.9 V | 0°C ~ 100°C (TJ) | Tray | * | Active | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B780 | 288 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | 3.35 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 160K Logic Elements | 160000 | -- | 29 mm | 29 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A2F200M3F-CSG288I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | External | 288-TFBGA, CSPBGA | 288-CSP (11x11) | ABS | ABS | A2F200 | Microchip Technology | MCU - 31, FPGA - 78 | Tray | Active | Compliant | -40°C ~ 100°C (TJ) | SmartFusion® | Grey | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | STD | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | 80 mm | No SVHC | UL94 HB | IP65 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU46DR-L2FFVH1760I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | Glenair | 574 | Retail Package | Active | -40°C ~ 100°C (TJ) | * | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 5CSEBA2U19C8SN | ALTERA | Datasheet | 8068 | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | YES | 484 | 484-UBGA (19x19) | 484 | INTEL CORP | Intel Corporation | 5CSEBA2U19C8SN | Suntsu Electronics, Inc. | MCU - 151, FPGA - 66 | 85 °C | Bulk | PLASTIC/EPOXY | FBGA | FBGA, BGA484,22X22,32 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | Active | NOT SPECIFIED | 2.04 | Compliant | Yes | 1.13 V | 1.07 V | 1.1 V | -40°C ~ 85°C | Tray | SXT214 | 0.079 L x 0.063 W (2.00mm x 1.60mm) | Active | MHz Crystal | 85 °C | 0 °C | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | 48 MHz | ±30ppm | S-PBGA-B484 | 66 | Not Qualified | 1.1 V | 60 Ohms | 1.1,1.2/3.3,2.5 V | OTHER | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.5 MB | 8pF | 600MHz | 64KB | Fundamental | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | ±25ppm | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 66 | 1.9 mm | FIELD PROGRAMMABLE GATE ARRAY | 25000 | ARM | FPGA - 25K Logic Elements | 25000 | -- | 0.020 (0.50mm) | 19 mm | 19 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVM1302-2LLEVSVD1760 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 7 mm x 5 mm | 1760-FCBGA (40x40) | CTS Electronic Components | 55 % | 1000 | CTS | + 70 C | AMD Xilinx | - 20 C | 402 | Tray | Active | Details | 2.62 V | 2.37 V | 0°C ~ 100°C (TJ) | Reel | 637 | Oscillators | 55 mA | 155.52 MHz | 25 PPM | SMD/SMT | 700 mV | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Standard Oscillators | LVPECL | Versal™ Prime FPGA, 70k Logic Cells | - | Standard Clock Oscillators | 2 mm | 7 mm | 5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVM1402-2LLEVSVD1760 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | ITT Cannon | 1 | ITT Cannon | + 110 C | AMD Xilinx | 0 C | 726 | Tray | 110704-0148 | Active | 0°C ~ 100°C (TJ) | KPT | D-Sub Connectors | 700 mV | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | D-Sub Connectors - Standard Density | Versal™ Prime FPGA, 1.2M Logic Cells | - | D-Sub Standard Connectors | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVM1302-1LSIVSVD1760 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | TE Connectivity / Holsworthy | 0805 | 2012 | 5000 | TE Connectivity | + 155 C | AMD Xilinx | - 55 C | PCB Mount | 402 | Tray | 5-1614959-1 | Active | Details | 0.000225 oz | 100 V | -40°C ~ 100°C (TJ) | MouseReel | CPF | 0.1 % | 25 PPM / C | High Stability Thin Film Precision Resistor | 1.37 MOhms | Resistors | 100 mW (1/10 W) | Thin Film | SMD/SMT | 700 mV | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Thin Film Resistors | Versal™ Prime FPGA, 70k Logic Cells | - | Precision Resistors Thin Film SMD | - | Thin Film Resistors - SMD | 0.55 mm | 2 mm | 1.25 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVM1302-1LLIVSVD1760 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | Glenair | 1 | Glenair | + 110 C | AMD Xilinx | - 40 C | 402 | Tray | Active | -40°C ~ 100°C (TJ) | 928 | Power | 700 mV | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Lighting Connectors | Versal™ Prime FPGA, 70k Logic Cells | - | Lighting Connectors | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVC1902-1LLIVSVA2197-5098 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 110 C | - 40 C | Compliant | 40 % | SOC - Systems on a Chip | 7.5 mm | 700 mV | 5.8 µH | System-On-Modules - SOM | SoC FPGA | 7.5 mm | 9.4 mm | 6.5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGFA022R25A2E3V | Intel | Datasheet | 628 |
| Min: 1 Mult: 1 | - | - | Intel | 624 | Tray | Active | No | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGIB027R29B1E2VR3 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | TE Connectivity / Laird External Antennas | 1 | TE Connectivity | Intel | - | Tray | Active | 0°C ~ 100°C (TJ) | Agilex I | Antennas | Dish | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | Antennas | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGFA023R25A3E4X | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 5 mm x 3.2 mm | - | CTS Electronic Components | 55 % | 1000 | CTS | + 85 C | Intel | - 40 C | 480 | Tray | Active | Details | 3.46 V | 3.13 V | 0°C ~ 100°C (TJ) | Reel | 653 | Oscillators | 45 mA | 312.5 MHz | 50 PPM | SMD/SMT | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Standard Oscillators | LVDS | FPGA - 2.3M Logic Elements | - | Standard Clock Oscillators | 1.2 mm | 5 mm | 3.2 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU67DR-1FSVE1156IES9919 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1.6 mm x 1.2 mm | CTS Electronic Components | 3000 | CTS | + 70 C | - 20 C | Details | Reel | 416 | 15 PPM | Crystals | 50 MHz | 15 PPM | SMD/SMT | 18 pF | Crystals | 100 Ohms | Crystals | 1.6 mm | 1.2 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVM2202-1MSEVSVC2197 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 0402 (1005 metric) | 8 | CTS Electronic Components | 10000 | CTS | + 125 C | - 55 C | 82 kOhms | Details | 0.000023 oz | MouseReel | 74x | 5 % | 200 PPM / C | Resistors | SMD/SMT | 800 mV | 4 | Isolated | Resistor Networks & Arrays | - 55 C to + 125 C | Arrays | Resistor Networks & Arrays | 0.4 mm | 2 mm | 1 mm |
10AS032H3F35E2SG
ALTERA
Package:Embedded - System On Chip (SoC)
1,870.368004
10AS032E2F27E2SG
ALTERA
Package:Embedded - System On Chip (SoC)
1,573.625930
10AS032E4F29I3LG
ALTERA
Package:Embedded - System On Chip (SoC)
1,802.287029
10AS057K4F35I3SG
ALTERA
Package:Embedded - System On Chip (SoC)
3,548.050093
10AS027E2F27E2SG
ALTERA
Package:Embedded - System On Chip (SoC)
1,270.457967
10AS027E2F29E1HG
ALTERA
Package:Embedded - System On Chip (SoC)
1,676.396285
10AS016E4F29E3SG
ALTERA
Package:Embedded - System On Chip (SoC)
647.427597
A2F200M3F-CSG288I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCZU46DR-L2FFVH1760I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
5CSEBA2U19C8SN
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVM1302-2LLEVSVD1760
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVM1302-1LLIVSVD1760
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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Package:Embedded - System On Chip (SoC)
Price: please inquire
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Package:Embedded - System On Chip (SoC)
16,327.776758
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Package:Embedded - System On Chip (SoC)
Price: please inquire
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Package:Embedded - System On Chip (SoC)
Price: please inquire
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Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
