The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
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- Core Processor
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- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Brand | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Mfr | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Operating Temperature | Packaging | Series | Part Status | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | JESD-30 Code | Number of Outputs | Qualification Status | Power Supplies | Temperature Grade | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Product Type | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Product Category | Length | Width |
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 | Mfr Part No XCVE1752-1MLINSVG1369 | AMD | Datasheet | 584 | - | Min: 1 Mult: 1 | AMD | 500 | Tray | Active | Versal™ AI Core | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA008R16A2I1V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 384 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB022R25A2E2V | Intel | Datasheet | 692 |
| Min: 1 Mult: 1 | - | - | Intel | 624 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS066 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Intel | Bulk | Active | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z020-1CLG484C | AMD | Datasheet | 20 | - | Min: 1 Mult: 1 | 484-LFBGA, CSPBGA | 484-CSPBGA (19x19) | XC7Z020 | AMD | 130 | Tray | Active | 0°C ~ 85°C (TJ) | Zynq®-7000 | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 85K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU19EG-3FFVC1760E | AMD | Datasheet | 402 | - | Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | XCZU19 | AMD | 512 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA027R24C3E3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS027H4F35I3LG | ALTERA | Datasheet | 754 |
| Min: 1 Mult: 1 | FBGA-1152 | YES | 1152 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS027H4F35I3LG | 1.2 GHz | Yes | SMD/SMT | 384 | 33750 LAB | 270000 LE | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 973480 | Active | NOT SPECIFIED | 5.43 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 384 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | ||||||
| Mfr Part No AGFA022R25A2I3V | Intel | Datasheet | 519 |
| Min: 1 Mult: 1 | - | - | Intel | 624 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS250T-1FCSG536T2 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 536-LFBGA | 536-BGA (16x16) | Microchip Technology | MCU - 136, FPGA - 168 | Tray | Active | -40°C ~ 125°C (TJ) | - | - | 2.2MB | RISC-V | DMA, PCI, PWM | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGIB023R18A2E1V | Intel | Datasheet | 714 |
| Min: 1 Mult: 1 | - | - | Intel | 480 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex I | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z030-2FFG676I | AMD | Datasheet | 56 | - | Min: 1 Mult: 1 | 676-BBGA, FCBGA | 676-FCBGA (27x27) | XC7Z030 | AMD | 130 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq®-7000 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 125K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU43DR-1FSVE1156E | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD Xilinx | 366 | Active | 0°C ~ 100°C (TJ) | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU43DR-1FFVE1156E | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD Xilinx | 366 | Active | 0°C ~ 100°C (TJ) | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA006R16A2E2V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 384 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFC023R25A2E2V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 480 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1802-2LLIVFVC1760 | AMD | Datasheet | 530 |
| Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 378 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ Prime | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU5EV-2SFVC784E | AMD | Datasheet | 584 |
| Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | XCZU5 | AMD | 252 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EV | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU5EG-1SFVC784E | AMD | Datasheet | 680 |
| Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | XCZU5 | AMD | 252 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1802-2LLIVSVD1760 | AMD | Datasheet | 640 | - | Min: 1 Mult: 1 | - | - | AMD | 726 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ AI Core | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - |
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XCVE1752-1MLINSVG1369
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFA008R16A2I1V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFB022R25A2E2V
Intel
Package:Embedded - System On Chip (SoC)
17,045.664161
-
10AS066
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z020-1CLG484C
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU19EG-3FFVC1760E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFA027R24C3E3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
10AS027H4F35I3LG
ALTERA
Package:Embedded - System On Chip (SoC)
1,801.371694
-
AGFA022R25A2I3V
Intel
Package:Embedded - System On Chip (SoC)
19,735.526602
-
MPFS250T-1FCSG536T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGIB023R18A2E1V
Intel
Package:Embedded - System On Chip (SoC)
28,203.058556
-
XC7Z030-2FFG676I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU43DR-1FSVE1156E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU43DR-1FFVE1156E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFA006R16A2E2V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFC023R25A2E2V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1802-2LLIVFVC1760
AMD
Package:Embedded - System On Chip (SoC)
17,083.149675
-
XCZU5EV-2SFVC784E
AMD
Package:Embedded - System On Chip (SoC)
2,254.659706
-
XCZU5EG-1SFVC784E
AMD
Package:Embedded - System On Chip (SoC)
1,495.037643
-
XCVC1802-2LLIVSVD1760
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire