The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Package / Case | Surface Mount | Supplier Device Package | Housing Material | Number of Terminals | Base Product Number | Case Size | Case Style | Clock Frequency-Max | Connections | Data RAM Size | Device Logic Gates | Device Logic Units | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Number of User I/Os | Maximum Operating Supply Voltage | Mfr | Minimum Operating Supply Voltage | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Number of Outlets | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Range | Reflow Temperature-Max (s) | Risk Rank | Rohs Code | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage | Usage Level | Operating Temperature | Series | JESD-609 Code | Pbfree Code | Terminal Finish | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Power Supplies | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Screening Level | Speed Grade | Primary Attributes | Number of Registers | Number of CLBs | Number of Logic Cells | Number of Cores | Number of Equivalent Gates | Flash Size | IP Rating | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No XCZU11EG-1FFVB1517I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | XCZU11 | Turck | U-91485 | 0.892 V | AMD | 0.808 V | 488 | Tray | Active | 0.8500 V | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU7EV-L2FBVB900E | AMD | Datasheet | 788 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU7 | Miscellaneous | 0.876 V | AMD | 0.825 V | 204 | Tray | Active | 0.8500 V | 0 to 110 °C | Zynq® UltraScale+™ MPSoC EV | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2L | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU3CG-L2SBVA484E | AMD | Datasheet | 507 | - | Min: 1 Mult: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | Aluminum | XCZU3 | Grace Technologies | P-D4-H3R3 | AMD | 82 | (1) 120V Receptacle | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | IP65 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050-1FG896I | Microchip | Datasheet | 1696 |
| Min: 1 Mult: 1 | 896-BGA | 896-FBGA (31x31) | M2S050 | 64 kB | - | - | Electri-Flex | 166 MHz | Microchip Technology | SMD/SMT | 377 | 56340 LE | Tray | Active | 1.2000 V | -40 to 100 °C | SmartFusion®2 | 896 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 50K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3F-1PQG208I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | A2F200 | 100 MHz | 200000 | MICROSEMI CORP | Microsemi Corporation | A2F200M3F-1PQG208I | 1.575 V | Microchip Technology | 1.425 V | 3 | MCU - 22, FPGA - 66 | Tray | PLASTIC/EPOXY | FQFP | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Active | Active | 30 | 5.59 | Yes | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | -40 to 100 °C | SmartFusion® | Yes | Pure Matte Tin (Sn) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | QUAD | GULL WING | 245 | 0.5 mm | compliant | S-PQFP-G208 | 66 | Not Qualified | 1.5,1.8,2.5,3.3 V | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 66 | 4608 CLBS, 200000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 4608 | 4608 | 200000 | 256KB | 28 mm | 28 mm | ||||||||||||||||||||||||
| Mfr Part No XCZU11EG-1FFVB1517E | AMD | Datasheet | 750 | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | XCZU11 | Turck | RSM40RKM50-10M/S1587/BL67 | 0.892 V | AMD | 0.808 V | 488 | Tray | Active | 0.8500 V | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XAZU3EG-L1SFVC784I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | XAZU3 | Murrelektronik | 7000-08701-3170750 | 0.742 V | AMD | 0.698 V | 128 | Tray | Active | 0.7200 V | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 500MHz, 1.2GHz | 1.8MB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, I²C, SPI, UART/USART, USB | MPU, FPGA | 1L | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU9EG-3FFVB1156E | AMD | Datasheet | 525 |
| Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | XCZU9 | Bridgeport Fittings Inc | 0.927 V | AMD | 0.873 V | 328 | Tray | Active | 0.9000 V | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3 | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU7CG-2FFVF1517E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | XCZU7 | Murrelektronik | M1D458FRRJ45BM-1M | AMD | 464 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU11EG-L1FFVF1517I | AMD | Datasheet | 790 | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | XCZU11 | 4 | Center Back Mount | 1/2 NPT | NOSHOK | 40-410-30-vac/bar | AMD | 464 | Tray | Active | -30 Hg-0 psi | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3F-1FG256 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | 256-FPBGA (17x17) | A2F200 | Klockner-Moeller, Div of Eaton | DIL2MKV-00(24V50/60HZ) | Microchip Technology | MCU - 25, FPGA - 66 | Tray | Active | 0°C ~ 85°C (TJ) | SmartFusion® | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU5EG-L2SFVC784E | AMD | Datasheet | 404 | - | Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | XCZU5 | AMD | 252 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU4CG-2FBVB900I | AMD | Datasheet | 740 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU4 | 192,150 | 204 | 0.892 V | AMD | 0.808 V | 204 | Tray | Active | FCBGA | 0.8500 V | Industrial grade | -40 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 900 | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Industrial | 2 | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | 175,680 | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150-FCV484I | Microchip | Datasheet | 1896 |
| Min: 1 Mult: 1 | 484-BFBGA | 484-FBGA (19x19) | M2S150 | 64 kB | - | - | 166 MHz | Microchip Technology | 273 | 146124 LE | Tray | Active | 1.2000 V | -40 to 100 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 150K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025TS-1VFG400T2 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 400-LFBGA | 400-VFBGA (17x17) | M2S025 | MICROSEMI CORP | Microsemi Corporation | M2S025TS-1VFG400T2 | Microchip Technology | 207 | Tray | Active | Active | 40 | 5.81 | Yes | 1.2000 V | 0 to 85 °C | Automotive, AEC-Q100, SmartFusion®2 | e1 | Yes | Tin/Silver/Copper (Sn/Ag/Cu) | 250 | compliant | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 25K Logic Modules | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-CSG288 | Microchip | Datasheet | 31 | - | Min: 1 Mult: 1 | 288-TFBGA, CSPBGA | 288-CSP (11x11) | A2F500 | 500000 | 1.575 V | Microchip Technology | 1.425 V | MCU - 31, FPGA - 78 | Tray | Active | 1.5000 V | 0 to 85 °C | SmartFusion® | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | STD | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU7EG-L2FBVB900E | AMD | Datasheet | 543 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU7 | AMD | 204 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU7EG-L1FFVC1156I | AMD | Datasheet | 686 |
| Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | XCZU7 | AMD | 360 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU4EV-1FBVB900I | AMD | Datasheet | 27 | - | Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU4 | 0.892 V | AMD | 0.808 V | 204 | Tray | Active | 0.8500 V | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EV | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XAZU2EG-L1SFVC784I | AMD | Datasheet | 1812 |
| Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | XAZU2 | AMD | 128 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 1.2GHz | 1.2MB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, I²C, SPI, UART/USART, USB | MPU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - |
-
XCZU11EG-1FFVB1517I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU7EV-L2FBVB900E
AMD
Package:Embedded - System On Chip (SoC)
4,650.399802
-
XCZU3CG-L2SBVA484E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050-1FG896I
Microchip
Package:Embedded - System On Chip (SoC)
223.451275
-
A2F200M3F-1PQG208I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU11EG-1FFVB1517E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XAZU3EG-L1SFVC784I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU9EG-3FFVB1156E
AMD
Package:Embedded - System On Chip (SoC)
6,898.088916
-
XCZU7CG-2FFVF1517E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU11EG-L1FFVF1517I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F200M3F-1FG256
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU5EG-L2SFVC784E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU4CG-2FBVB900I
AMD
Package:Embedded - System On Chip (SoC)
1,873.197183
-
M2S150-FCV484I
Microchip
Package:Embedded - System On Chip (SoC)
494.750474
-
M2S025TS-1VFG400T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F500M3G-CSG288
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU7EG-L2FBVB900E
AMD
Package:Embedded - System On Chip (SoC)
3,936.813937
-
XCZU7EG-L1FFVC1156I
AMD
Package:Embedded - System On Chip (SoC)
3,823.890704
-
XCZU4EV-1FBVB900I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XAZU2EG-L1SFVC784I
AMD
Package:Embedded - System On Chip (SoC)
458.246935