The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Contact Shape | Shell Material | Supplier Device Package | Weight | Insert Material | Number of Terminals | Backshell Material, Plating | Base Product Number | Brand | Contact Finish Mating | Contact Materials | Contact Sizes | Data Converters | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Instruction Set Architecture | Interface Type | JTAG Support | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Mfr | Minimum Operating Supply Voltage | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of CPU Cores | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Primary Material | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Usage Level | Voltage, Rating | Operating Temperature | Packaging | Series | Size / Dimension | JESD-609 Code | Part Status | Termination | Connector Type | Type | Number of Positions | Terminal Finish | Color | Applications | Power (Watts) | Additional Feature | HTS Code | Fastening Type | Subcategory | Contact Type | Current Rating (Amps) | Technology | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Reach Compliance Code | Shell Finish | Pin Count | Shell Size - Insert | Termination Style | JESD-30 Code | Number of Outputs | Qualification Status | Approval Agency | Efficiency | Voltage - Isolation | Voltage - Input (Max) | Housing Color | Operating Supply Voltage | Voltage - Input (Min) | Power Supplies | Note | Interface | Oscillator Type | Current - Output (Max) | Speed | RAM Size | Shell Size, MIL | Voltage - Supply (Vcc/Vdd) | Core Processor | Peripherals | Program Memory Type | Core Size | Program Memory Size | Connectivity | Cable Opening | Voltage - Output | Topology | Architecture | Data Bus Width | Number of Inputs | Seated Height-Max | Programmable Logic Type | Product Type | Includes | EEPROM Size | Screening Level | Speed Grade | Dimming | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Features | Product Category | Device Core | Length | Width | Contact Finish Thickness - Mating | Material Flammability Rating | Ratings |
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 | Mfr Part No M2S090T-FCSG325I | Microchip | Datasheet | 2304 | - | Min: 1 Mult: 1 | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x13.5) | 325 | M2S090 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S090T-FCSG325I | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | 3 | SMD/SMT | 180 | 86316 LE | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, BGA325,21X21,20 | BGA325,21X21,20 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.74 | Yes | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | R-PBGA-B325 | 180 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | 1.16 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 13.5 mm | 11 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025TS-1FGG484I | Microchip | Datasheet | 2191 |
| Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S025 | 64 kB | - | - | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | SMD/SMT | 267 | 27696 LE | Tray | Active | 1.2000 V | -40 to 100 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 25K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-VFG256 | Microchip | Datasheet | 38 | - | Min: 1 Mult: 1 | 256-LBGA | 256-FPBGA (17x17) | M2S005 | 64 kB | - | - | 166 MHz | Microchip Technology | 161 | 6060 LE | Tray | Active | 0°C ~ 85°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 5K Logic Modules | 1 Core | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060-FGG484 | Microchip | Datasheet | 2111 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 484-BGA | 484-FPBGA (23x23) | M2S060 | Microchip Technology / Atmel | 64 kB | 60 | - | - | Microchip | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | 267 | 4710 LAB | 56520 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | SmartFusion2 | 1.2 V | 0 to 85 °C | Tray | SmartFusion2 | SOC - Systems on a Chip | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | SoC FPGA | STD | FPGA - 60K Logic Modules | 1 Core | 256KB | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060-FG484 | Microchip | Datasheet | 2326 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 484-BGA | 484-FPBGA (23x23) | M2S060 | 64 kB | - | - | 166 MHz | Microchip Technology | 267 | 56520 LE | Tray | Active | Non-Compliant | 0°C ~ 85°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU2CG-1SFVC784I | AMD | Datasheet | 16 | - | Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | XCZU2 | AMD | 252 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU3CG-1SBVA484E | AMD | Datasheet | 2160 |
| Min: 1 Mult: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | XCZU3 | AMD | 82 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB012R24B3E3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 768 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1302-2MLENBVB1024 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1024-BFBGA | 1024-BGA (31x31) | AMD | 316 | Tray | Active | Non-Compliant | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSXFC2C6U23I7LN | ALTERA | Datasheet | 1989 |
| Min: 1 Mult: 1 | Tray | * | Active | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z007S-2CLG400I | AMD | Datasheet | 77 |
| Min: 1 Mult: 1 | 400-LFBGA, CSPBGA | 400-CSPBGA (17x17) | XC7Z007 | 1.05 V | AMD | 0.95 V | 100 | Tray | Active | 1.0000 V | -40 to 100 °C | Zynq®-7000 | 766MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Artix™-7 FPGA, 23K Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGID019R18A1E1V | Intel | Datasheet | 723 |
| Min: 1 Mult: 1 | - | - | Intel | 480 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex I | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XAZU3EG-1SFVA625Q | AMD | Datasheet | 548 |
| Min: 1 Mult: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | XAZU3 | 0.892 V | AMD | 0.808 V | 128 | Tray | Active | 0.8500 V | -40 to 125 °C | Zynq® UltraScale+™ MPSoC EG | 625 | 500MHz, 1.2GHz | 1.8MB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, I²C, SPI, UART/USART, USB | MPU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MIMXRT1021CAG4AR | NXP | Datasheet | - | - | Min: 1 Mult: 1 | PEI-Genesis | Bulk | Active | * | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU47DR-2FSVE1156E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 100-BQFP | 100-QFP (14x20) | MB90F546 | A/D 8x8/10b | Infineon Technologies | 81 | Tray | Discontinued at Digi-Key | -40°C ~ 105°C (TA) | F²MC-16LX MB90545G | External | 16MHz | 8K x 8 | 4.5V ~ 5.5V | F²MC-16LX | POR, WDT | FLASH | 16-Bit | 256KB (256K x 8) | CANbus, EBI/EMI, SCI, Serial I/O, UART/USART | MCU, FPGA | - | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060-1FCS325 | Microchip | Datasheet | 2132 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Free Hanging (In-Line) | 325-TFBGA, FCBGA | - | Circular | Aluminum | 325-FCBGA (11x11) | - | D38999/26ZA | 22D | 64 kB | - | - | 166 MHz | Amphenol Aerospace Operations | 200 | 56520 LE | Bulk | Active | Non-Compliant | -65°C ~ 175°C | Military, MIL-DTL-38999 Series III, Tri-Start™ TV | Plug Housing | For Female Sockets | 6 | Threaded | Crimp | A | Shielded | Environment Resistant | Zinc Nickel | 9-35 | Black | Contacts Not Included | 166MHz | 64KB | A | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | FPGA - 60K Logic Modules | 1 Core | 256KB | Coupling Nut, Self Locking | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU46DR-1FSVH1760I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Free Hanging (In-Line) | 1760-BBGA, FCBGA | - | Aluminum Alloy | 1760-FCBGA (42.5x42.5) | Rubber | - | FRCIR | Gold | Copper Alloy | RISC | JTAG | Yes | ITT Cannon, LLC | 6 | 574 | Bulk | Metal | Active | Industrial grade | 500VAC, 700VDC | -40°C ~ 125°C | CIR | Crimp | Plug, Male Pins | 35 | Black | Aerospace, Medical, Military | Bayonet Lock | 13A | W | Shielded | Environment Proof | Black Anodized | 1760 | 28-15 | 0.85 V | JTAG | 500MHz, 1.2GHz | 38 Mb | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 0.610 ~ 0.937 (15.49mm ~ 23.80mm) | MCU, FPGA | 32 Bit | Industrial | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | Backshell, Cable Clamp, Coupling Nut, Flame Retardant | Arm Cortex A53/Arm Cortex R5 | - | Flame Retardant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-2FFVE1156E | AMD | Datasheet | 574 | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | PEI-Genesis | 366 | Bulk | Active | 0°C ~ 100°C (TJ) | * | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060TS-FG484I | Microchip | Datasheet | 2086 |
| Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S060 | 64 kB | - | - | 166 MHz | Mallory Sonalert Products Inc. | 267 | 56520 LE | Bulk | Active | -40°C ~ 100°C (TJ) | * | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-L2FFVE1156I | AMD | Datasheet | 614 |
| Min: 1 Mult: 1 | Chassis Mount | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | 1.7 lbs (771.1 g) | LXV76 | Advanced Energy | 366 | Box | Obsolete | -35°C ~ 70°C | LXV76 (76W) | 6.97 L x 2.66 W x 1.46 H (177.0mm x 67.5mm x 37.0mm) | Constant Voltage | 76 W | Wire Leads | 1 | CE, cULus, EN | 89% | 3 kV | 305VAC | 90VAC | 1.81A | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 42V | AC DC Converter | MCU, FPGA | - | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | OTP, OVP, SCP | IP67 |
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M2S090T-FCSG325I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025TS-1FGG484I
Microchip
Package:Embedded - System On Chip (SoC)
147.326578
-
M2S005S-VFG256
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060-FGG484
Microchip
Package:Embedded - System On Chip (SoC)
122.719858
-
M2S060-FG484
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU2CG-1SFVC784I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU3CG-1SBVA484E
AMD
Package:Embedded - System On Chip (SoC)
443.327841
-
AGFB012R24B3E3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1302-2MLENBVB1024
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5CSXFC2C6U23I7LN
ALTERA
Package:Embedded - System On Chip (SoC)
227.509292
-
XC7Z007S-2CLG400I
AMD
Package:Embedded - System On Chip (SoC)
85.486450
-
AGID019R18A1E1V
Intel
Package:Embedded - System On Chip (SoC)
29,433.157960
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XAZU3EG-1SFVA625Q
AMD
Package:Embedded - System On Chip (SoC)
1,163.250912
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MIMXRT1021CAG4AR
NXP
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU47DR-2FSVE1156E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060-1FCS325
Microchip
Package:Embedded - System On Chip (SoC)
168.786009
-
XCZU46DR-1FSVH1760I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU48DR-2FFVE1156E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060TS-FG484I
Microchip
Package:Embedded - System On Chip (SoC)
274.800625
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XCZU48DR-L2FFVE1156I
AMD
Package:Embedded - System On Chip (SoC)
37,990.780188