The category is 'Embedded - Microcontrollers - Application Specific'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Clock Frequency-Max | Date Of Intro | Ihs Manufacturer | Moisture Sensitivity Levels | Number of I/O Lines | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Number of Ports | uPs/uCs/Peripheral ICs Type | Supply Current-Max | Seated Height-Max | Address Bus Width | Boundary Scan | Low Power Mode | External Data Bus Width | Number of Serial I/Os | Bus Compatibility | Data Transfer Rate-Max | Time-Min | Interrupt Capability | Volatile | Communication Protocol | Information Access Method | Length | Width |
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![]() | Mfr Part No UPD72874GC-YEB | NEC Electronics Group | Datasheet | - | - | Min: 1 Mult: 1 | YES | 120 | 24.576 MHz | NEC ELECTRONICS CORP | 70 °C | PLASTIC/EPOXY | TFQFP | TFQFP, | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Obsolete | QFP | No | 3.6 V | 3 V | 3.3 V | e0 | TIN LEAD | 8542.31.00.01 | QUAD | GULL WING | 0.4 mm | compliant | 120 | S-PQFP-G120 | Not Qualified | COMMERCIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | 1.2 mm | 32 | NO | YES | 32 | 3 | PCI | 50 MBps | ASYNC, BIT | 14 mm | 14 mm | |||||||||||||||||
![]() | Mfr Part No PC8477BV | National Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 68 | NATIONAL SEMICONDUCTOR CORP | 70 °C | PLASTIC/EPOXY | QCCJ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | Obsolete | No | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | J BEND | 1.27 mm | compliant | S-PQCC-J68 | Not Qualified | COMMERCIAL | 15 mA | |||||||||||||||||||||||||||||||||
![]() | Mfr Part No PSD935G2-70U | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | YES | 80 | STMICROELECTRONICS | 52 | 70 °C | PLASTIC/EPOXY | LQFP | PLASTIC, TQFP-80 | TQFP80,.55SQ | SQUARE | FLATPACK, LOW PROFILE | Obsolete | QFP | No | 5.5 V | 4.5 V | 5 V | e0 | EAR99 | TIN LEAD | 8542.39.00.01 | QUAD | GULL WING | 0.5 mm | not_compliant | 80 | S-PQFP-G80 | Not Qualified | COMMERCIAL | 7 | PARALLEL IO PORT, GENERAL PURPOSE | 1.2 mm | 16 | 12 mm | 12 mm | |||||||||||||||||||||
![]() | Mfr Part No THGBM4G5D1HBAIRY1J | Toshiba Electronic Devices & Storage Corporation | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IM6403IJL | General Electric Solid State | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | GENERAL ELECTRIC SOLID STATE | 85 °C | -40 °C | CERAMIC | DIP | DIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE | Transferred | No | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T40 | Not Qualified | INDUSTRIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | ||||||||||||||||||||||||||||||||
![]() | Mfr Part No IM6403IJL | Harris Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | HARRIS SEMICONDUCTOR | 85 °C | -40 °C | CERAMIC | DIP | DIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | No | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T40 | Not Qualified | INDUSTRIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | ||||||||||||||||||||||||||||||||
![]() | Mfr Part No ST16C550CJBC | Exar Corporation | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SDSDQM-032G-B35A | SanDisk Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | SANDISK CORP | UNSPECIFIED | DIE | DIE, | UNSPECIFIED | UNCASED CHIP | Transferred | Yes | AVAILABLE IN EUROPE, MIDDLE EAST, AFRICA, ASIA-PACIFIC AND LATIN AMERICA | 8542.31.00.01 | UPPER | NO LEAD | NOT SPECIFIED | unknown | NOT SPECIFIED | X-XUUC-N | MICROPROCESSOR CIRCUIT | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No PI7C8150AMA-33 | Pericom Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 208 | 33 MHz | PERICOM SEMICONDUCTOR CORP | 85 °C | PLASTIC/EPOXY | FQFP | FQFP, | SQUARE | FLATPACK, FINE PITCH | Obsolete | QFP | No | 3.6 V | 3 V | 3.3 V | e0 | EAR99 | TIN LEAD | 8542.31.00.01 | QUAD | GULL WING | 0.5 mm | compliant | 208 | S-PQFP-G208 | Not Qualified | OTHER | BUS CONTROLLER, PCI | 3.8 mm | 32 | 32 | 28 mm | 28 mm | ||||||||||||||||||||||
![]() | Mfr Part No RV-3032-C7-TA-QC-MG01 | Micro Crystal AG | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU5EG-2LSFVC784E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 784 | ADVANCED MICRO DEVICES INC | 4 | 110 °C | PLASTIC/EPOXY | FBGA | FCBGA-784 | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | Yes | 0.85 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | OTHER | PROGRAMMABLE SoC | 3.32 mm | CAN, I2C, SPI, UART | 23 mm | 23 mm | |||||||||||||||||||||||||||
![]() | Mfr Part No ICS1394N | Integrated Circuit Systems Inc | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No X1228S14I-4.5AT1 | Intersil Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 14 | 0.032 MHz | INTERSIL CORP | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | PLASTIC, SOIC-14 | SOP14,.25 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 5.5 V | 2.7 V | 5 V | e0 | No | EAR99 | TIN LEAD | 8542.39.00.01 | DUAL | GULL WING | 1.27 mm | not_compliant | 14 | R-PDSO-G14 | Not Qualified | INDUSTRIAL | TIMER, REAL TIME CLOCK | 1.75 mm | SECONDS | Y | YES | SERIAL(I2C) | 8.65 mm | 3.9 mm | |||||||||||||||||
![]() | Mfr Part No PCI6350-AA66PC | PLX Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 208 | 66 MHz | PLX TECHNOLOGY INC | 70 °C | PLASTIC/EPOXY | FQFP | FQFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Obsolete | QFP | No | 3.6 V | 3 V | 3.3 V | e0 | No | 3A991.A.2 | TIN LEAD | 8542.31.00.01 | QUAD | GULL WING | 0.5 mm | unknown | 208 | S-PQFP-G208 | Not Qualified | COMMERCIAL | BUS CONTROLLER, PCI | 32 | 32 | 28 mm | 28 mm | |||||||||||||||||||||
![]() | Mfr Part No XCZU7EV-3FFVF1517I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1517 | 2017-02-15 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Transferred | Yes | 0.9 V | e1 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | INDUSTRIAL | PROGRAMMABLE SoC | 3.51 mm | 40 mm | 40 mm | ||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU7EV-3FFVF1517I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1517 | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | FCBGA-1517 | SQUARE | GRID ARRAY | Active | Yes | 0.9 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B1517 | INDUSTRIAL | PROGRAMMABLE SoC | 3.51 mm | 40 mm | 40 mm | ||||||||||||||||||||||||||||
![]() | Mfr Part No RV-8803-C7-TA-QA-MG03 | Micro Crystal AG | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SC1100UFH-233 | National Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 388 | NATIONAL SEMICONDUCTOR CORP | 3 | PLASTIC/EPOXY | BGA | BGA388,26X26,50 | SQUARE | GRID ARRAY | Obsolete | No | e0 | TIN LEAD | 8542.31.00.01 | BOTTOM | BALL | 220 | 1.27 mm | not_compliant | 30 | S-PBGA-B388 | Not Qualified | ||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SC1100UFH-233 | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | YES | 388 | NATIONAL SEMICONDUCTOR CORP | 3 | PLASTIC/EPOXY | BGA | BGA, BGA388,26X26,50 | BGA388,26X26,50 | SQUARE | GRID ARRAY | Obsolete | No | e0 | TIN LEAD | 8542.31.00.01 | BOTTOM | BALL | 220 | 1.27 mm | compliant | 30 | S-PBGA-B388 | Not Qualified | |||||||||||||||||||||||||||||||||
![]() | Mfr Part No PSD934F2-70M | STMicroelectronics | Datasheet | 2400 | - | Min: 1 Mult: 1 | YES | 52 | STMICROELECTRONICS | 27 | 70 °C | PLASTIC/EPOXY | QFP | PLASTIC, QFP-52 | QFP52,.52SQ | SQUARE | FLATPACK | Obsolete | QFP | No | 5.5 V | 4.5 V | 5 V | e0 | EAR99 | TIN LEAD | 8542.39.00.01 | QUAD | GULL WING | 0.65 mm | not_compliant | 52 | S-PQFP-G52 | Not Qualified | COMMERCIAL | 4 | PARALLEL IO PORT, GENERAL PURPOSE | 2.35 mm | 16 | 10 mm | 10 mm |
UPD72874GC-YEB
NEC Electronics Group
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
PC8477BV
National Semiconductor Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
PSD935G2-70U
STMicroelectronics
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
THGBM4G5D1HBAIRY1J
Toshiba Electronic Devices & Storage Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
IM6403IJL
General Electric Solid State
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
IM6403IJL
Harris Semiconductor
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
ST16C550CJBC
Exar Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
SDSDQM-032G-B35A
SanDisk Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
PI7C8150AMA-33
Pericom Semiconductor Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
RV-3032-C7-TA-QC-MG01
Micro Crystal AG
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU5EG-2LSFVC784E
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
ICS1394N
Integrated Circuit Systems Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
X1228S14I-4.5AT1
Intersil Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
PCI6350-AA66PC
PLX Technology
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU7EV-3FFVF1517I
AMD Xilinx
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU7EV-3FFVF1517I
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
RV-8803-C7-TA-QA-MG03
Micro Crystal AG
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
SC1100UFH-233
National Semiconductor Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
SC1100UFH-233
Texas Instruments
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
PSD934F2-70M
STMicroelectronics
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
