The category is 'Embedded - Microcontroller, Microprocessor, FPGA Modules'
- All Manufacturers
- RoHS
- RAM Size
- Max Operating Temperature
- Min Operating Temperature
- Frequency
- Case/Package
- Number of Pins
- Data Bus Width
- Max Frequency
- Interface
- Memory Size
- Max Supply Voltage
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Package / Case | Surface Mount | Number of Terminals | 16Bit Timer | ADC (Bit) | CCP Capture/Compare | Clock Frequency-Max | CPU Core | CPU Maximum Speed | DAC (Bit) | Dimensions | Direct Memory Access | GPIO Ports Number | I2C | I2S | Ihs Manufacturer | Infrared Data Association | Internal Comparator | Internal Oscillator | Low-Voltage Detect | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitivity Levels | Number of I/O Lines | Operating Temperature-Max | Operating Temperature-Min | Operating Voltage Range | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Peripheral/Function | Product Status | Program Storage Size | PWM (Bit) | Real-Time Clock | RoHS | Rohs Code | Secure Digital Input and Output | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Universal Serial Bus | Watchdog | Operating Temperature | Packaging | Published | Series | Size / Dimension | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Connector Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Max Output Current | Operating Supply Voltage | Temperature Grade | Interface | Memory Size | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Program Memory Type | Supply Current-Max | Bit Size | Seated Height-Max | Address Bus Width | Operating Temperature Range | Core Architecture | Boundary Scan | External Data Bus Width | RAM (words) | Bus Compatibility | Module/Board Type | Flash Size | UART/USART | SPI | CAN | Saturation Current | Co-Processor | Length | Width | RoHS Status | Lead Free |
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 | Mfr Part No CC-WMX-ZC6D-L1 | Digi | Datasheet | 1733 |
| Min: 1 Mult: 1 | 45 mm x 40 mm | + 85 C | Digi | - 40 C | Box | Active | * | 512 MB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TE0714-04-42I-7-B | Trenz Electronic | Datasheet | 16 |
| Min: 1 Mult: 1 | Trenz Electronic GmbH | Bulk | Active | -40°C ~ 85°C | TE0714 | 1.570 L x 1.180 W (40.00mm x 30.00mm) | - | - | - | Artix-7 A35T | FPGA | 16MB | Artix-7 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TE0712-02-72C06-M | Trenz Electronic | Datasheet | - | - | Min: 1 Mult: 1 | Trenz Electronic GmbH | Bulk | Active | 0°C ~ 85°C | TE0712 | 1.970 L x 1.570 W (50.00mm x 40.00mm) | Samtec LSHM | 200MHz | 1GB | - | FPGA Core | 32MB | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TE0820-05-5DR21MA | Trenz Electronic | Datasheet | - | - | Min: 1 Mult: 1 | Trenz Electronic GmbH | Bulk | Active | - | TE0820 | - | - | - | 2GB | - | MPU Core | 128MB | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 20-101-0508 | Digi | Datasheet | - | - | Min: 1 Mult: 1 | 4 Weeks | Module | -40°C~70°C | 2000 | RabbitCore RCM3000 | 1.85 x 2.73 47mmx69mm | Not For New Designs | 1 (Unlimited) | 2 IDC Headers 2x17 | 70°C | -40°C | 30MHz | 150mA | 3.45V | Serial | 30MHz | 128KB | Rabbit 3000 | MPU Core | 256KB | RoHS Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No DC-ME-01T-NS | Digi | Datasheet | - | - | Min: 1 Mult: 1 | Module | -40°C~85°C | Bulk | 2008 | Digi Connect ME® | 1.45 x 0.75 36.7mmx19.1mm | Obsolete | 1 (Unlimited) | RJ45 | 55MHz | 8MB | ARM7TDMI, NS7520 | ARM | MPU Core | 2MB | RoHS Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No DC-ME-01T-PS-50 | Digi | Datasheet | - | - | Min: 1 Mult: 1 | 11 Weeks | -40°C~85°C | 2012 | Digi Connect ME® | 1.45 x 0.75 36.7mmx19.1mm | Discontinued | 1 (Unlimited) | RJ45 | 85°C | -40°C | 55MHz | 55MHz | 8MB | ARM7TDMI, NS7520 | ARM | MPU Core | 2MB | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No DC-ME-01T-MF-VS | Digi | Datasheet | - | - | Min: 1 Mult: 1 | 1 Weeks | Module | -40°C~85°C | Bulk | 2012 | Digi Connect ME® | 1.45 x 0.75 36.7mmx19.1mm | Obsolete | 1 (Unlimited) | RJ45 | 55MHz | 8MB | ARM7TDMI, NS7520 | ARM | MPU Core | 2MB | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No LPC47M182-NW | SMSC | Datasheet | - | - | Min: 1 Mult: 1 | YES | 128 | 14.318 MHz | STANDARD MICROSYSTEMS CORP | 21 | 70 °C | PLASTIC/EPOXY | FQFP | 14 X 20 MM, 2.70 MM HEIGHT, LEAD FREE, QFP-128 | QFP128,.67X.93,20 | RECTANGULAR | FLATPACK, FINE PITCH | Transferred | QFP | Yes | 3.6 V | 3 V | 3.3 V | e3 | Yes | MATTE TIN | 8542.39.00.01 | QUAD | GULL WING | 260 | 0.5 mm | compliant | 128 | R-PQFP-G128 | Not Qualified | COMMERCIAL | 15 mA | 3.4 mm | 4 | NO | 4 | LPC | 3 | 20 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No STIH207-BKB | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SIS5600 | Silicon Integrated Systems Corp | Datasheet | - | - | Min: 1 Mult: 1 | YES | 487 | SILICON INTEGRATED SYSTEMS CORP | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | BGA | 8542.39.00.01 | BOTTOM | BALL | 1.27 mm | unknown | 487 | S-PBGA-B487 | Not Qualified | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No PSD51/18 | POWER SEMICONDUCTORS INC | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No STPCI0166BTC3 | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | YES | 388 | 14.318 MHz | STMICROELECTRONICS | 8 | 115 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA388,26X26,50 | BGA388,26X26,50 | SQUARE | GRID ARRAY | Obsolete | BGA | No | 3.6 V | 3 V | 3.3 V | e0 | TIN LEAD | 0 TO 100 OPERATING CASE TEMPERATURE | 8542.39.00.01 | BOTTOM | BALL | 1.27 mm | not_compliant | 388 | S-PBGA-B388 | Not Qualified | INDUSTRIAL | 66 MHz | MULTIFUNCTION PERIPHERAL | 32 | 2.38 mm | 32 | NO | 32 | PCI; ISA; CARDBUS; PCMCIA; PC-AT; PS/2 | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No W83910F | Winbond Electronics Corp | Datasheet | - | - | Min: 1 Mult: 1 | YES | 128 | 40 MHz | WINBOND ELECTRONICS CORP | 38 | 70 °C | PLASTIC/EPOXY | FQFP | FQFP, QFP128,.67X.93,20 | QFP128,.67X.93,20 | RECTANGULAR | FLATPACK, FINE PITCH | Obsolete | QFP | 5.5 V | 4.5 V | 5 V | 8542.39.00.01 | QUAD | GULL WING | 0.5 mm | unknown | 128 | R-PQFP-G128 | Not Qualified | COMMERCIAL | 3.32 mm | 4 | NO | 4 | 242 | LPC | 20 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No F82C100 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No PC97307-ICK/VUL | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | YES | 16 | 48 MHz | NATIONAL SEMICONDUCTOR CORP | 2A | 24 | 70 °C | PLASTIC/EPOXY | QFP | QFP, QFP160,1.2SQ | QFP160,1.2SQ | SQUARE | FLATPACK | Transferred | No | 5.5 V | 4.5 V | 5 V | e0 | TIN LEAD | 8542.39.00.01 | QUAD | GULL WING | 220 | 0.65 mm | compliant | 30 | S-PQFP-G16 | Not Qualified | COMMERCIAL | 50 mA | 4.1 mm | 16 | NO | 8 | 242 | PC-AT; EISA; ISA; PS/2; MICROCHANNEL | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No PC97307-ICK/VUL | Winbond Electronics Corp | Datasheet | - | - | Min: 1 Mult: 1 | YES | 16 | 48 MHz | WINBOND ELECTRONICS CORP | 2A | 24 | 70 °C | PLASTIC/EPOXY | QFP | QFP, | SQUARE | FLATPACK | Obsolete | QFP | No | 5.5 V | 4.5 V | 5 V | e0 | TIN LEAD | 8542.39.00.01 | QUAD | GULL WING | 220 | 0.65 mm | not_compliant | 30 | 16 | S-PQFP-G16 | Not Qualified | COMMERCIAL | 4.1 mm | 16 | NO | 8 | 242 | PC-AT; EISA; ISA; PS/2; MICROCHANNEL | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No PIMX8UX6AVLFZAC | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No APM32F103VCT6 | Geehy | Datasheet | - | - | Min: 1 Mult: 1 | 8 | 12bit | Yes | ARM-M3 | 96MHz | 12bit | Yes | 80 | 2 | 2 | Yes | Yes | Yes | 2V~3.6V | Tray | DMA;LCD/LED Driver;CCP capture/comparison;SDIO;IrDA;Temperature Sensor;RTC Real-time Clock;Watchdog;CRC check;LIN Bus Protocol | 256KB | 16bit | Yes | true | Yes | Yes | Yes | 64KB | FLASH | -40℃~+85℃ | 5 | 3 | 2 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No STC15W4K56S4-30I-LQFP64S | STC Micro | Datasheet | - | - | Min: 1 Mult: 1 | 5 | 10bit | Yes | 51Series | 62 | Yes | Yes | Yes | 2.5V~5.5V | Tray | Low-Voltage Detection;CCP capture/comparison;Watchdog | 56KB | 15bit | true | Yes | 4KB | FLASH | -40℃~+85℃ | 4 | 1 |
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CC-WMX-ZC6D-L1
Digi
Package:Embedded - Microcontroller, Microprocessor, FPGA Modules
113.111495
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TE0714-04-42I-7-B
Trenz Electronic
Package:Embedded - Microcontroller, Microprocessor, FPGA Modules
95.332927
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TE0712-02-72C06-M
Trenz Electronic
Package:Embedded - Microcontroller, Microprocessor, FPGA Modules
Price: please inquire
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TE0820-05-5DR21MA
Trenz Electronic
Package:Embedded - Microcontroller, Microprocessor, FPGA Modules
Price: please inquire
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20-101-0508
Digi
Package:Embedded - Microcontroller, Microprocessor, FPGA Modules
Price: please inquire
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DC-ME-01T-NS
Digi
Package:Embedded - Microcontroller, Microprocessor, FPGA Modules
Price: please inquire
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DC-ME-01T-PS-50
Digi
Package:Embedded - Microcontroller, Microprocessor, FPGA Modules
Price: please inquire
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DC-ME-01T-MF-VS
Digi
Package:Embedded - Microcontroller, Microprocessor, FPGA Modules
Price: please inquire
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LPC47M182-NW
SMSC
Package:Embedded - Microcontroller, Microprocessor, FPGA Modules
Price: please inquire
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STIH207-BKB
STMicroelectronics
Package:Embedded - Microcontroller, Microprocessor, FPGA Modules
Price: please inquire
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SIS5600
Silicon Integrated Systems Corp
Package:Embedded - Microcontroller, Microprocessor, FPGA Modules
Price: please inquire
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PSD51/18
POWER SEMICONDUCTORS INC
Package:Embedded - Microcontroller, Microprocessor, FPGA Modules
Price: please inquire
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STPCI0166BTC3
STMicroelectronics
Package:Embedded - Microcontroller, Microprocessor, FPGA Modules
Price: please inquire
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W83910F
Winbond Electronics Corp
Package:Embedded - Microcontroller, Microprocessor, FPGA Modules
Price: please inquire
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F82C100
Intel Corporation
Package:Embedded - Microcontroller, Microprocessor, FPGA Modules
Price: please inquire
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PC97307-ICK/VUL
Texas Instruments
Package:Embedded - Microcontroller, Microprocessor, FPGA Modules
Price: please inquire
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PC97307-ICK/VUL
Winbond Electronics Corp
Package:Embedded - Microcontroller, Microprocessor, FPGA Modules
Price: please inquire
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PIMX8UX6AVLFZAC
NXP Semiconductors
Package:Embedded - Microcontroller, Microprocessor, FPGA Modules
Price: please inquire
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APM32F103VCT6
Geehy
Package:Embedded - Microcontroller, Microprocessor, FPGA Modules
Price: please inquire
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STC15W4K56S4-30I-LQFP64S
STC Micro
Package:Embedded - Microcontroller, Microprocessor, FPGA Modules
Price: please inquire