The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Memory Types | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Operating Supply Current | RAM Size | Clock Frequency | Propagation Delay | Turn On Delay Time | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Speed Grade | Output Function | Number of Transceivers | Number of Macro Cells | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Dedicated Inputs | Number of Equivalent Gates | Height | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
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 | Mfr Part No M2GL050TS-1FCS325I | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | 176 | + 100 C | - 40 C | Yes | SMD/SMT | 200 I/O | 56340 LE | N | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | IGLOO2 | Tray | M2GL050TS | 667 Mb/s | 2 Transceiver | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL050T-1FCS325 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2GL050 | 176 | MICROSEMI CORP | M2GL050T-1FCS325 | Microchip Technology | Yes | 200 | 85 °C | Tray | PLASTIC/EPOXY | BGA | 11 X 11 MM, 0.50 MM PITCH, FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.27 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | IGLOO2 | 0°C ~ 85°C (TJ) | Tray | M2GL050T | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | compliant | S-PBGA-B325 | 200 | Not Qualified | 1.2 V | OTHER | 200 | FIELD PROGRAMMABLE GATE ARRAY | 56340 | 1869824 | 56340 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P125-1FG144I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | A3P125 | 350 MHz | 160 | MICROSEMI CORP | A3P125-1FG144I | 272 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 97 I/O | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.23 | N | No | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3P125 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | INDUSTRIAL | 3072 CLBS, 125000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 125000 | 1 | 3072 | 125000 | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 10CL016ZU256I8G | Intel | Datasheet | 2620 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-LFBGA | YES | 162 | -40°C~100°C TJ | Tray | Cyclone® 10 LP | Active | 3 (168 Hours) | 256 | 1.0V | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | NOT SPECIFIED | S-PBGA-B256 | FIELD PROGRAMMABLE GATE ARRAY | 15408 | 516096 | 963 | 963 | 1.5mm | 14mm | 14mm | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No EP1C3T100C7 | Intel | Datasheet | 356 | - | Min: 1 Mult: 1 | Surface Mount | 100-TQFP | YES | 65 | 0°C~85°C TJ | Tray | 2014 | Cyclone® | e0 | Obsolete | 3 (168 Hours) | 100 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V~1.575V | QUAD | GULL WING | 235 | 1.5V | 0.5mm | 30 | EP1C3 | S-PQFP-G100 | 104 | Not Qualified | 1.51.5/3.3V | 320MHz | 104 | FIELD PROGRAMMABLE GATE ARRAY | 2910 | 59904 | 291 | 1.2mm | 14mm | 14mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P060-1FG144 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | A3P060 | 350 MHz | 160 | MICROSEMI CORP | A3P060-1FG144 | 272 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 96 I/O | 85 °C | Tray | PLASTIC/EPOXY | LBGA | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.23 | N | No | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | A3P060 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | COMMERCIAL | 1536 CLBS, 60000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 18432 | 60000 | 1 | 1536 | 60000 | 1.05 mm | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P600-FG256 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | M1A3P600 | 350 MHz | 90 | MICROSEMI CORP | M1A3P600-FG256 | 231 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 177 I/O | 85 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | M1A3P600 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | COMMERCIAL | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | STD | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3PE1500-2FG484 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | 484 | 484-FPBGA (23x23) | 400.011771 mg | A3PE1500 | 60 | 310 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | SMD/SMT | 280 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | A3PE1500 | 70 °C | 0 °C | 1.425V ~ 1.575V | 1.5 V | 1.575 V | 1.425 V | 33.8 kB | 276480 | 1500000 | 310 MHz | 2 | 38400 | 1.73 mm | 23 mm | 23 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3PE600-1FG484 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3PE600 | 60 | MICROSEMI CORP | A3PE600-1FG484 | 272 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 270 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | A3PE600 | e0 | TIN LEAD | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | 272 MHz | S-PBGA-B484 | Not Qualified | 1.5 V | COMMERCIAL | 1.575 V | 1.425 V | 13.5 kB | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 272 MHz | 1 | 13824 | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm | No | |||||||||||||||||||||||||||||||||||||
| Mfr Part No U1AFS600-FGG256I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | 256-FPBGA (17x17) | U1AFS600 | 90 | Microchip Technology | Yes | 114 | Tray | Active | N | This product may require additional documentation to export from the United States. | Fusion | -40°C ~ 100°C (TJ) | Tray | U1AFS600 | 1.425V ~ 1.575V | 36864 | 250000 | STD | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P1000L-1FG256 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | M1A3P1000 | 350 MHz | 90 | MICROSEMI CORP | M1A3P1000L-1FG256 | 892.86 MHz | 1.26 V | + 70 C | Microchip Technology | 1.14 V | 0 C | Yes | 3 | SMD/SMT | 177 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | ProASIC3 | 1.2000 V | 0.014110 oz | 0 to 70 °C | Tray | M1A3P1000L | e0 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | 177 | Not Qualified | 1.2 V | 1.5/3.3 V | COMMERCIAL | 177 | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 1 | 24576 | 24576 | 1000000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1AGL1000V5-FG144I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FPBGA-144 | YES | 144 | 144-FPBGA (13x13) | 144 | M1AGL1000 | 108 MHz | 160 | MICROSEMI CORP | M1AGL1000V5-FG144I | Microchip Technology | Yes | 3 | SMD/SMT | 97 | 11000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | 13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | IGLOOe | -40°C ~ 85°C (TA) | Tray | M1AGL1000V5 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | INDUSTRIAL | 18 kB | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1e+06 | 24576 | 1000000 | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A40MX02-2PLG68 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | PLCC-68 | YES | 68-PLCC (24.23x24.23) | 68 | A40MX02 | 101 MHz | 19 | MICROSEMI CORP | A40MX02-2PLG68 | 175 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 57 I/O | 70 °C | Tray | PLASTIC/EPOXY | QCCJ | ROHS COMPLIANT, PLASTIC, LCC-68 | SQUARE | CHIP CARRIER | Active | Active | 40 | 5.3 | Details | Yes | 5.25 V | 3 V | 3.3 V | Actel | 0.171777 oz | 0°C ~ 70°C (TA) | Tube | A40MX02 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | J BEND | 245 | 1.27 mm | compliant | S-PQCC-J68 | Not Qualified | 3.3 V, 5 V | COMMERCIAL | 295 CLBS, 3000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | 3000 | 2 ns | 295 | 3000 | 3.68 mm | 24.23 mm | 24.23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3PE1500-1PQG208 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | PQFP-208 | YES | 208 | 208-PQFP (28x28) | 208 | A3PE1500 | 350 MHz | 24 | MICROSEMI CORP | A3PE1500-1PQG208 | 272 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 147 I/O | 70 °C | Tray | PLASTIC/EPOXY | FQFP | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 5.61 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0°C ~ 85°C (TJ) | Tray | A3PE1500 | e3 | Matte Tin (Sn) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 245 | 0.5 mm | compliant | S-PQFP-G208 | 147 | Not Qualified | 1.5 V | 1.5/3.3 V | COMMERCIAL | 1.575 V | 1.425 V | 33.8 kB | 147 | 38400 CLBS, 1500000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | 272 MHz | 1 | 38400 | 38400 | 38400 | 1500000 | 3.4 mm | 28 mm | 28 mm | No | |||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL025TS-FGG484 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-484 | 484-FPBGA (23x23) | M2GL025 | 60 | + 85 C | Microchip Technology | 0 C | Yes | SMD/SMT | 267 I/O | 27696 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | IGLOO2 | 0°C ~ 85°C (TJ) | Tray | M2GL025TS | 1.14V ~ 2.625V | 1.2 V | 27696 | 1130496 | 4 Transceiver | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No LCMXO640E-3TN100C | Lattice Semiconductor Corporation | Datasheet | 70 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | Surface Mount | 100-LQFP | 100 | 657.000198mg | SRAM | 74 | 0°C~85°C TJ | Tray | 2000 | MachXO | e3 | yes | Active | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | 8542.39.00.01 | 1.14V~1.26V | QUAD | GULL WING | 260 | 1.2V | 0.5mm | 30 | LCMXO640 | 100 | 74 | Not Qualified | 1.2V | 14mA | 0B | 4.9 ns | 4.9 ns | FLASH PLD | 640 | 500MHz | 80 | MACROCELL | 320 | 640 | 7 | 1.6mm | 14mm | 14mm | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XC2VP30-6FFG896C | Xilinx Inc. | Datasheet | 324 | - | Min: 1 Mult: 1 | 6 Weeks | Surface Mount | Surface Mount | 896-BBGA, FCBGA | 896 | 556 | 0°C~85°C TJ | Tray | 2005 | Virtex®-II Pro | e1 | yes | Obsolete | 4 (72 Hours) | 896 | 3A991.D | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 245 | 1.5V | 1mm | 30 | XC2VP30 | 896 | 556 | Not Qualified | 1.5V | 1.51.5/3.32/2.52.5V | 306kB | 1200MHz | FIELD PROGRAMMABLE GATE ARRAY | 30816 | 2506752 | 3424 | 6 | 27392 | 0.32 ns | 3.4mm | 31mm | 31mm | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EPF10K100EFI256-2 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-BGA | YES | 191 | -40°C~85°C TA | Tray | FLEX-10KE® | e0 | Obsolete | 3 (168 Hours) | 256 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 2.375V~2.625V | BOTTOM | BALL | 220 | 2.5V | 1mm | 30 | EPF10K100 | S-PBGA-B256 | 191 | Not Qualified | 2.52.5/3.3V | 0.5 ns | 191 | LOADABLE PLD | 4992 | 49152 | 257000 | 624 | MIXED | 2.1mm | 17mm | 17mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XCS10-4VQ100C | Xilinx Inc. | Datasheet | 408 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 100-TQFP | 77 | 0°C~85°C TJ | Tray | 1999 | Spartan® | e0 | Obsolete | 3 (168 Hours) | 100 | EAR99 | TIN LEAD | 8542.39.00.01 | 4.75V~5.25V | QUAD | GULL WING | 225 | 5V | 0.5mm | unknown | 30 | XCS10 | 100 | S-PQFP-G100 | 112 | Not Qualified | 5V | 784B | 166MHz | 112 | FIELD PROGRAMMABLE GATE ARRAY | 466 | 6272 | 10000 | 196 | 1.2 ns | 196 | 196 | 3000 | 1.2mm | 14mm | 14mm | Non-RoHS Compliant | Contains Lead | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No EP4CE15F23I8LN | Intel | Datasheet | 34 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 484-BGA | YES | 343 | -40°C~100°C TJ | Tray | Cyclone® IV E | e1 | Active | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 0.97V~1.03V | BOTTOM | BALL | 260 | 1V | 1mm | 40 | EP4CE15 | S-PBGA-B484 | 346 | Not Qualified | 11.2/3.32.5V | 362MHz | 346 | FIELD PROGRAMMABLE GATE ARRAY | 15408 | 516096 | 963 | 963 | 2.4mm | 23mm | 23mm | RoHS Compliant |
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M2GL050TS-1FCS325I
Atmel (Microchip Technology)
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M2GL050T-1FCS325
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P125-1FG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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10CL016ZU256I8G
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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EP1C3T100C7
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P060-1FG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3P600-FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3PE1500-2FG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3PE600-1FG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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U1AFS600-FGG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3P1000L-1FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1AGL1000V5-FG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A40MX02-2PLG68
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3PE1500-1PQG208
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M2GL025TS-FGG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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LCMXO640E-3TN100C
Lattice Semiconductor Corporation
Package:Embedded - FPGAs (Field Programmable Gate Array)
17.447608
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XC2VP30-6FFG896C
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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EPF10K100EFI256-2
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XCS10-4VQ100C
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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EP4CE15F23I8LN
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire